STMICROELECTRONICS STPS30M120S

STPS30M120S
Power Schottky rectifier
Datasheet − production data
Features
A
K
■
High current capability
■
Avalanche rated
■
Low forward voltage drop
■
High frequency operation
A
K
K
This Schottky diode is suited for high frequency
switch mode power supply.
Packaged in TO-220AB narrow leads and I2PAK,
this device is intended to be used in notebook,
game station and desktop adapters, providing in
these applications a good efficiency at both low
and high load.
A
Table 1.
I
V
"Forward"
I
2 x IO
K
TO-220AB narrow leads
STPS30M120STN
Electrical characteristics(a)
Figure 1.
A
A
Description
X
A
K
I2PAK
STPS30M120SR
Device summary
Symbol
Value
IF(AV)
30 A
VRRM
120 V
VF (typ)
0.45 V
Tj (max)
150 °C
IF
VRRM
VR
VAR
IO
X
V
IR
VTo VF(Io) VF VF(2xIo)
"Reverse"
IAR
a. VARM and IARM must respect the reverse safe
operating area defined in Figure 9. VAR and IAR are
pulse measurements (tp < 10 µs). VR, IR, VRRM and
VF, are static characteristics
April 2012
This is information on a product in full production.
Doc ID 022918 Rev 1
1/8
www.st.com
8
Characteristics
1
STPS30M120S
Characteristics
Table 2.
Absolute ratings (limiting values with terminals 1 and 3 short circuited at
Tamb = 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
120
V
IF(RMS)
Forward rms current
50
A
IF(AV)
Average forward current, δ = 0.5
Tc = 110 °C
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sine-wave
260
A
PARM(1)
Repetitive peak avalanche power
Tj = 125 °C, tp = 10 µs
1450
W
VARM(2)
Maximum repetitive peak
tp < 10 µs, Tj < 125 °C, IAR < 9.7 A
avalanche voltage
150
V
VASM(2)
Maximum single-pulse
peak avalanche voltage
150
V
-65 to +175
°C
150
°C
Tstg
Tj
tp < 10 µs, Tj < 125 °C, IAR < 9.7 A
Storage temperature range
Maximum operating junction
temperature(3)
1. For pulse time duration deratings, please refer to Figure 4. More details regarding the avalanche energy
measurements and diode validation in the avalanche are provided in the STMicroelectronics Application
notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement
using Schottky rectifier avalanche specification”.
2. See Figure 9
3.
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR(1)
VF(2)
Parameter
Junction to case
Unit
1.3
°C/W
Static electrical characteristics (terminals 1 and 3 short circuited)
Parameter
Reverse leakage
current
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 125 °C
VR = VRM
Min.
Typ.
Max.
Unit
-
70
345
µA
-
25
65
mA
Tj = 125 °C
IF = 5 A
-
0.45
0.50
Tj = 125 °C
IF = 10 A
-
0.52
0.57
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
IF = 15 A
IF = 30 A
-
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.53 x IF(AV) + 0.0067 x IF2(RMS)
Doc ID 022918 Rev 1
0.75
0.57
-
1. Pulse test: tp = 5 ms, δ < 2%
2/8
Value
0.62
0.90
0.66
0.73
V
STPS30M120S
Figure 2.
35
Characteristics
Average forward power dissipation Figure 3.
versus average forward current
PF(AV)(W)
35
Rth(j-a) = Rth(j-c)
30
δ = 0.2
δ = 0.1
25
IF(AV)(A)
δ=1
δ = 0.5
30
Average forward current versus
ambient temperature (δ = 0.5)
25
δ = 0.05
20
20
15
15
10
10
T
5
5
δ = tp / T
IF(AV)(A)
tp
0
Tamb(°C)
0
0
5
Figure 4.
1
10
15
20
25
30
35
40
Normalized avalanche power
derating versus pulse duration
0
25
Figure 5.
PARM (t p )
PARM (10 µs)
1.0
50
75
100
125
150
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.01
0.3
Single pulse
0.2
0.1
t p(µs)
0.001
1.E-04
1
10
Figure 6.
1.E+03
tp(s)
0.0
100
1.E-03
1.E-02
1.E-01
1.E+00
1000
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 7.
IR(mA)
10000
Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
F=1MHz
Vosc =30mVRMS
Tj =25°C
1.E+02
Tj =150°C
1.E+01
Tj =125°C
Tj =100°C
1000
1.E+00
Tj =75°C
Tj =50°C
1.E-01
Tj =25°C
1.E-02
VR(V)
1.E-03
0
10
20
30
40
50
60
70
80
90
100
110
120
VR(V)
100
1
Doc ID 022918 Rev 1
10
100
1000
3/8
Characteristics
Figure 8.
1000.0
STPS30M120S
Forward voltage drop versus
forward current
Figure 9.
Reverse safe operating area
(tp < 10 µs and Tj < 125 °C)
IFM(A)
Iarm (A)
Tj =125°C
(Maximum values)
100.0
Tj =125°C
(Typical values)
10.0
Tj =25°C
(Maximum values)
1.0
VFM(V)
0.1
0.0
4/8
0.2
0.4
0.6
0.8
1.0
1.2
1.4
12.5
12.0
11.5
11.0
10.5
10.0
9.5
9.0
8.5
8.0
120
1.6
Doc ID 022918 Rev 1
Varm (V)
130
140
150
160
170
STPS30M120S
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
TO-220AB narrow leads dimensions
Dimensions
Ref.
Millimeters
Min.
A
P
E
F
Q
H1
D1
L20
L30
L1
b1(x3)
L
1
2
C
b (x3)
e1
Min.
Typ.
Max.
4.40
4.60
0.17
0.18
b
0.61
0.88
0.024
0.034
b1
0.95
1.20
0.037
0.047
c
0.48
0.70
0.019
0.027
D
15.25
15.75
0.60
0.62
1.27
0.05
E
10.00
10.40
0.39
0.41
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.19
0.20
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.24
0.26
J1
2.40
2.72
0.095
0.107
L
13.00
14.00
0.51
0.55
L1
2.60
2.90
0.102
0.114
J1
3
e
Max.
A
D1
D
Typ.
Inches
L20
15.40
0.61
L30
28.90
1.14
∅P
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
Doc ID 022918 Rev 1
5/8
Package information
STPS30M120S
Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering
like SMDs. Such devices are intended to be through-hole mounted ONLY and in no
circumstances shall ST be held liable for any lack of performance or damage arising out of
soldering of nickel-plated back frames.
Table 6.
I2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.40
2.72
0.094
0.107
b
0.61
0.88
0.024
0.035
b1
1.14
1.70
0.044
0.067
c
0.49
0.70
0.019
0.028
c2
1.23
1.32
0.048
0.052
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.195
0.203
E
10
10.40
0.394
0.409
L
13
14
0.512
0.551
L1
3.50
3.93
0.138
0.155
L2
1.27
1.40
0.050
0.055
A
E
c2
L2
D
L1
A1
b1
L
b
c
e
e1
6/8
Doc ID 022918 Rev 1
STPS30M120S
3
Ordering information
Ordering information
Table 7.
4
Ordering information
Order code
Marking
Package
Weight
Base qty Delivery mode
STPS30M120SR
PS30M120SR
I2PAK
1.49 g
50
Tube
STPS30M120STN
PS30M120STN
TO-220AB
narrow leads
1.9 g
50
Tube
Revision history
Table 8.
Document revision history
Date
Revision
02-Apr-2012
1
Changes
First issue.
Doc ID 022918 Rev 1
7/8
STPS30M120S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
8/8
Doc ID 022918 Rev 1