STPS3150-Y Automotive power Schottky rectifier Features ■ AEC-Q101 qualified ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency and extented battery life ■ Low thermal resistance ■ ECOPACK®2 compliant component A Description K SMB STPS3150UY Table 1. Packaged in SMB, this device is intended for use in automotive applications where low drop forward voltage is required to reduce power dissipation. November 2011 Doc ID 018926 Rev 1 Device summary Symbol Value IF(AV) 3A VRRM 150 V Tj (max) 175 °C VF (max) 0.67 V 1/7 www.st.com 7 Characteristics STPS3150-Y 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Unit 150 V VRRM Repetitive peak reverse voltage IF(AV) Average forward current TL = 130 °C δ = 0.5 3 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 80 A Tstg Storage temperature range -65 to +175 °C -40 to +175 °C Operating junction temperature range Tj dPtot --------------dTj 1. Value < 1 -------------------------Rth ( j – a ) Table 3. condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Rth(j-l) Parameter Junction to lead Table 4. Parameter Tests conditions Tj = 25 °C Reverse leakage current Tj = 125 °C Tj = 25 °C VF (2) Value Unit 20 °C/W Static electrical characteristics Symbol IR (1) (1) Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 3 A Typ Max. Unit 0.4 2.0 µA 0.6 2.0 mA 0.78 0.82 0.63 0.67 0.85 0.89 0.70 0.75 V IF = 6 A 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.023 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current Figure 2. IF(AV)(A) PF(AV)(W) 2.4 δ = 0.2 δ = 0.1 2.2 3.5 δ = 0.5 Rth(j-a)=Rth(j-I) 3.0 δ = 0.05 2.0 Average forward current versus ambient temperature (δ = 0.5) 1.8 2.5 δ=1 1.6 1.4 2.0 1.2 1.5 1.0 Rth(j-a)=75°C/W 0.8 1.0 0.6 T T 0.4 0.5 IF(AV)(A) 0.2 δ=tp/T 0.0 0.0 2/7 0.5 1.0 1.5 2.0 2.5 3.0 δ=tp/T tp 0.0 3.5 0 Doc ID 018926 Rev 1 25 Tamb(°C) tp 50 75 100 125 150 175 STPS3150-Y Figure 3. Characteristics Non repetitive surge peak forward current versus overload duration (maximum values) Figure 4. IM(A) PARM(tp) PARM(1 µs) 12 11 Normalized avalanche power derating versus pulse duration SMB 1 10 9 8 0.1 Ta=25°C 7 6 Ta=75°C 5 4 0.01 Ta=125°C 3 IM 2 t 1 t(s) δ=0.5 tp(µs) 0.001 0 1.E-03 1.E-02 Figure 5. 1.E-01 0.01 1.E+00 Normalized avalanche power derating versus junction temperature Figure 6. 0.1 1 10 100 1000 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) PARM(Tj) PARM(25 °C) 1.0 SMB 0.9 1.2 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 0.2 Tj(°C) 0.1 0 25 50 75 Single pulse 100 125 150 1.E-02 Figure 7. Reverse leakage current versus reverse voltage applied (typical values) δ=tp/T tp(s) tp 0.0 Figure 8. IR(µA) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Junction capacitance versus reverse voltage applied (typical values) C(pF) 1.E+04 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1.E+03 Tj=125°C 1.E+02 Tj=100°C 1.E+01 100 Tj=75°C Tj=50°C 1.E+00 Tj=25°C 1.E-01 VR(V) VR(V) 10 1.E-02 0 25 50 75 100 125 150 1 Doc ID 018926 Rev 1 10 100 1000 3/7 Characteristics Figure 9. STPS3150-Y Forward voltage drop versus forward current Figure 10. Forward voltage drop versus forward current IFM(A) IFM(A) 100 100 Tj=125°C (maximum values) Tj=125°C (maximum values) Tj=125°C (typical values) Tj=125°C (typical values) Tj=25°C (maximum values) Tj=25°C (maximum values) 10 10 VFM(V) VFM(V) 1 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) 110 100 Epoxy printed circuit board FR4, copper thickness = 35 µm 90 80 70 60 50 40 30 20 10 SCu(cm²) 0 0.0 4/7 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 018926 Rev 1 4.0 4.5 5.0 1.8 STPS3150-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 12. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID 018926 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3150UY G315Y SMB 0.107 g 2500 Tape and reel Revision history Table 7. 6/7 STPS3150-Y Document revision history Date Revision 03-Nov-2011 1 Description of Changes Initial release. Doc ID 018926 Rev 1 STPS3150-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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