STPS5045S Power Schottky rectifier Datasheet − production data Features A ■ Low forward voltage drop ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low thermal resistance ■ 200 °C maximum junction temperature ■ K A K A A Avalanche rated D2PAK STPS5045SG-TR Description This device is a dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. j Table 1. Packaged in D2PAK, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection applications. Also ideal for PV cell-bypass diode for junction and smart junction boxes. June 2012 This is information on a product in full production. Doc ID022861 Rev 1 Device summary Symbol Value IF(AV) 50 A VRRM 45 V Tj (max) 200 °C VF(max) 0.48 V 1/7 www.st.com 7 Characteristics 1 STPS5045S Characteristics Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified) Symbol Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 90 A 50 A IF(AV) Average forward current δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 600 A PARM Repetitive peak avalanche power tp = 10 µs Tj = 125 °C 1200 W -65 to +175 °C +200 °C +175 °C Value Unit 1.0 °C/W Tstg Tj(1) 1. Parameter Tc = 135 °C Storage temperature range Maximum operating junction temperature in DC forward mode(2) Maximum operating junction temperature 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 2. Maximum operating junction temperature only in DC forward mode Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol IR (1) Parameter Junction to case Static electrical characteristics Parameter Test conditions Reverse leakage current Forward voltage drop Max. VR = VRRM 0.090 0.36 Tj = 75 °C VR = 20 V 0.7 1.9 Tj = 125 °C VR = VRRM 65 185 0.55 0.61 0.48 0.56 Tj = 125 °C Tj = 200 °C IF = 50 A Unit mA V IF = 10 A 0.22 IF =20 A 0.28 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.38 x IF(AV) + 0.0036 IF2(RMS) 2/7 Typ. Tj = 25 °C Tj = 25 °C VF(2) Min. Doc ID022861 Rev 1 STPS5045S Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) 45 60 δ = 0.1 δ = 0.2 Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) δ = 0.5 40 Rth(j -a)=Rth(j-c) 50 δ = 0.05 35 40 δ=1 30 25 30 20 15 20 T T 10 10 5 IF(AV)(A) 0 0 10 Figure 3. 1 20 30 40 δ=tp/T 50 δ=tp/T tp Tamb(°C) tp 0 60 70 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(10µs) 1.0 50 75 100 125 150 175 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 0.1 tp(µs) 0.001 1 10 Single pulse 0.0 1.E-05 100 tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1000 Doc ID022861 Rev 1 3/7 Characteristics Figure 5. STPS5045S Reverse leakage current versus reverse voltage applied (typical values) Figure 6. C(pF) IR(mA) 1.E+03 Junction capacitance versus reverse voltage applied (typical values) 10000 F=1MHz Vosc =30mVRMS Tj =25°C Tj =150°C 1.E+02 Tj =125°C 1.E+01 Tj =100°C Tj =75°C 1.E+00 1000 Tj =50°C 1.E-01 Tj =25°C 1.E-02 VR(V) 1.E-03 0 5 Figure 7. 1000.0 10 15 20 25 30 35 40 VR(V) 100 45 Forward voltage drop versus forward current 1 Figure 8. IFM(A) 100 Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 80 Tj =125°C (Maximum values) 100.0 10 epoxy printed circuit board FR4, copper thickness = 35 µm, D2PAK 70 Tj =125°C (Typical values) 60 Tj =200°C (Typical values) 50 Tj =25°C (Maximum values) 10.0 40 30 20 1.0 10 VFM(V) 0.0 4/7 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 S(Cu)(cm²) 0 0.1 1.0 0 Doc ID022861 Rev 1 5 10 15 20 25 30 35 40 STPS5045S 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. D2PAK dimensions Dimensions Ref A E C2 L2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 Figure 9. 0.40 typ. 0° 8° 0.016 typ. 0° 8° Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 Doc ID022861 Rev 1 3.70 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS5045SG-TR STPS5045SG D2PAK 1.48 g 1000 Tape and reel Revision history Table 7. 6/7 STPS5045S Revision history Date Revision 28-June-2012 1 Changes First issue. Doc ID022861 Rev 1 STPS5045S Please Read Carefully: Information in this document is provided solely in connection with ST products. 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