STPS6045HR Aerospace 2 x 30 A - 45 V Schottky rectifier Features ■ Forward current: 2 x 30 A ■ Repetitive peak voltage: 45 V ■ Low forward voltage drop: 0.75 V ■ Maximum junction temperature: 175 °C ■ Negligible switching losses ■ Low capacitance ■ High reverse avalanche surge capability ■ Hermetic package ■ Target radiation qualification: – 150 krad (Si) low dose rate – 1 Mrad high dose rate ■ ESCC qualified TO-254 Figure 1. Device configuration STPS6045CFSY1 STPS6045CFSYHRB 1 Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. Housed in a hermetically sealed surface mount package, it is ideal for use in applications for aerospace and other harsh environments. Terminal 1: Anode a Terminal 2: Common cathode Terminal 3: Anode b 2 3 The case is not connected to any lead The STPS6045HR is intended for use in medium voltage applications and in high frequency circuits where low switching losses and low noise are required. Table 1. Device summary Order code STPS6045CFSY1 STPS6045CFSYHRB November 2010 ESCC part number Quality level EPPL - Engineering model - 5106/018/01 ESCC flight - Doc ID 18184 Rev 1 Comment Package Single die TO-254 Lead finish Gold Solder dip 1/8 www.st.com 8 Characteristics 1 STPS6045HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM Characteristic Forward surge current (per diode)(1) Value Unit 300 A (2) 45 V (3) 1 A Average output rectified current (50% duty cycle):(4) (5) per diode per device 30 40 A IF(RMS) Forward rms current (per diode) 30 A TOP Operating temperature range(6) (case temperature) -65 to +175 °C +175 °C -65 to +175 °C VRRM IRRM IO TJ Repetitive peak reverse voltage Repetitive peak reverse current Junction temperature range(6) TSTG Storage temperature TSOL Soldering temperature(7) +260 °C dV/dt Critical rate of rise of reverse voltage 10000 V/µs 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. Pulsed, duration 2 µs, F = 1 kHz 4. For Tcase > +138 °C per device and Tcase > +144 °C per device, derate linearly to 0 A at +175 °C. 5. The per device ratings apply only when both anode terminals are tied together. 6. For solder dip lead finish devices all testing performed at Tamb > +125 °C shall be carried out in a 100% inert atmosphere. 7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth(j-c)(1) Thermal resistance Characteristic Thermal resistance, junction to case per diode per device(2) 1. Package mounted on infinite heatsink 2. The per device ratings apply only when both anode terminals are tied togther. 2/8 Doc ID 18184 Rev 1 Value Unit 1.7 1.2 °C/W STPS6045HR Table 4. Symbol IR VF1 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C Characteristic Reverse current MIL-STD-750 test method 4016 (1) VF2(1) VF3 (1) VF4 (1) C Zth(j-c)(2) Forward voltage 4011 Values Test conditions Units Min. Max. DC method, VR = 45V - 500 µA Pulse method, IF = 5 A - 520 mV Pulse method, IF = 10 A - 590 mV Pulse method, IF = 20 A 650 mV Pulse method, IF = 35 A 820 Capacitance 4001 VR = 5 V, F = 1 MHz Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs - 1.3 Calculate ΔVF(3) nF °C/W 1. Pulse width ≤ 300 µs, Duty Cycle ≤ 2% 2. Performed only during screening tests parameter drift values (initial measurements), go-no-go 3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Symbol IR Electrical measurements at high and low temperatures (per diode) Characteristic Reverse current MIL-STD-750 test method 4016 VF2(2) VF3(2) Forward voltage VF4(2) 4011 Values Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 45 V - 40 mA Tcase = +125 (+0, -5) °C pulse method, IF = 10 A - 530 mV Tcase = +125 (+0, -5) °C pulse method, IF = 20 A - 610 mV Tcase = -55 (+0, -5) °C pulse method, IF = 20 A - 800 mV Tcase = +125 (+0, -5) °C pulse method, IF = 35 A - 790 mV 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Pulse width ≤ 300 µs, duty cycle ≤ 2% Doc ID 18184 Rev 1 3/8 Package Information 2 STPS6045HR Package Information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Metal flange mount package (TO-254(a)) 3 lead, dimension definitions B R1 D E H ØF C G A 3 2 1 N ØM R2 L K ØI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections 4/8 Doc ID 18184 Rev 1 STPS6045HR Package Information Table 6. Metal flange mount package (TO-254) 3-lead, dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 ØF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H ØI (1) 6.86 BSC 0.89 0.270 BSC 1.14 0.035 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 ØM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 (3) 1.65 Typ. R2 0.065 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations Doc ID 18184 Rev 1 5/8 Ordering Information STPS6045HR 3 Ordering Information Table 7. Ordering information Order code STPS6045CFSY1 ESCC part number - EPPL Package - Lead finish Marking Gold STPS6045CFSY1 + BeO TO-254 STPS6045CFSYHRB 6/8 5106/018/01 - Solder dip Doc ID 18184 Rev 1 510601801 + BeO Mass (g) Packing 10.0 Strip pack STPS6045HR 4 Revision history Revision history Table 8. Document revision history Date Revision 03-Nov-2010 1 Changes Initial release. Doc ID 18184 Rev 1 7/8 STPS6045HR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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