TSC TSM160N10

TSM160N10
100V N-Channel Power MOSFET
TO-220
PRODUCT SUMMARY
Pin Definition:
1. Gate
2. Drain
3. Source
Features
●
●
●
●
VDS (V)
RDS(on)(mΩ)
ID (A)
100
5.5 @ VGS =10V
160
Block Diagram
Advanced Trench Technology
Low RDS(ON) 5.5mΩ (Max.)
Low gate charge typical @ 154nC (Typ.)
Low Crss typical @ 260pF (Typ.)
Ordering Information
Part No.
Package
Packing
TO-220
50pcs / Tube
TSM160N10CZ C0
N-Channel MOSFET
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
100
V
Gate-Source Voltage
VGS
±20
V
TC=25°C
Continuous Drain Current
TC=70°C
TA=25°C
160
ID
TA=70°C
127
A
14.2
11.4
Drain Current-Pulsed Note 1
IDM
620
A
Avalanche Current, L=0.5mH
IAS, IAR
40
A
Avalanche Energy, L=0.5mH
EAS, EAR
400
mJ
TC=25°C
Maximum Power Dissipation
TC=70°C
TA=25°C
300
PD
TA=70°C
Storage Temperature Range
Operating Junction Temperature Range
210
W
2.4
1.68
TSTG
-55 to +175
°C
TJ
-55 to +175
°C
Symbol
Limit
* Limited by maximum junction temperature
Thermal Performance
Parameter
Thermal Resistance - Junction to Case
RӨJC
Thermal Resistance - Junction to Ambient
Notes: Surface mounted on FR4 board t ≤ 10sec
RӨJA
1/6
Unit
0.5
o
62.5
o
C/W
C/W
Version: B13
TSM160N10
100V N-Channel Power MOSFET
Electrical Specifications (Ta = 25oC unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
BVDSS
100
--
--
V
Drain-Source On-State Resistance
VGS = 10V, ID = 30A
RDS(ON)
--
4.5
5.5
mΩ
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
2
3
4
V
Zero Gate Voltage Drain Current
VDS = 80V, VGS = 0V
IDSS
--
--
1
uA
Gate Body Leakage
VGS = ±20V, VDS = 0V
IGSS
--
--
±100
nA
Qg
--
154
--
Qgs
--
35
--
Qgd
--
40
--
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VDS = 30V, ID = 30A,
VGS = 10V
VDS = 30V, VGS = 0V,
f = 1.0MHz
Ciss
--
9840
--
Coss
--
750
--
Crss
--
260
--
td(on)
--
25
--
tr
--
40
--
td(off)
--
85
--
tf
--
45
--
VSD
-
0.8
1.3
nC
pF
Switching
Turn-On Delay Time
Turn-On Rise Time
VGS = 10V, VDS = 30V,
Turn-Off Delay Time
RG = 3.3Ω
Turn-Off Fall Time
Drain-Source Diode Characteristics and Maximum Rating
Drain-Source Diode Forward
VGS=0V, IS=30A
Voltage
nS
V
Reverse Recovery Time
IS = 30A, TJ=25 C
tfr
120
nS
Reverse Recovery Charge
dI/dt = 100A/us
Qfr
160
nC
o
Notes:
1. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%.
2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal
reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA
is determined by the user's board design. RθJA shown below for single device operation on FR-4 in still air
2/6
Version: B13
TSM160N10
100V N-Channel Power MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Output Characteristics
Gate Threshold Voltage
Gate Source On Resistance
Drain-Source On Resistance
Drain-Source On-Resistance
Source-Drain Diode Forward Voltage
3/6
Version: B13
TSM160N10
100V N-Channel Power MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Power Derating
Drain Current vs. Junction Temperature
Safe Operation Area
Transient Thermal Impedance
Capacitance
Gate Charge
4/6
Version: B13
TSM160N10
100V N-Channel Power MOSFET
TO-220 Mechanical Drawing
Unit: Millimeters
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep,
J=Oct, K=Nov, L=Dec)
L = Lot Code
5/6
Version: B13
TSM160N10
100V N-Channel Power MOSFET
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
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merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6/6
Version: B13