TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 FEATURES • • • • • • 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC EN S1D S2D DD S1C S2C DC RGY PACKAGE (TOP VIEW) S1A S2A DA S1B S2B DB VCC • • 1 1 16 15 EN 14 S1D 13 S2D 2 3 4 12 DD 11 S1C 10 S2C 5 6 7 8 9 DC • IN S1A S2A DA S1B S2B DB GND IN • • • D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) Low Differential Gain and Phase (DG = 0.82%, DP = 0.1 Degree Typ) Wide Bandwidth (BW = 300 MHz Min) Low Crosstalk (XTALK = –80 dB Typ) Low Power Consumption (ICC = 10 µA Max) Bidirectional Data Flow With Near-Zero Propagation Delay Low ON-State Resistance (ron = 3 Ω Typ) Rail-to-Rail Switching on Data I/O Ports (0 to VCC) VCC Operating Range From 3 V to 3.6 V Ioff Supports Partial-Power-Down Mode Operation Data and Control Inputs Provide Undershoot Clamp Diode Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Suitable for Both RGB and Composite-Video Switching GND • DESCRIPTION/ORDERING INFORMATION The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer. Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY SOIC – D –40°C to 85°C SSOP (QSOP) – DBQ TSSOP – PW TVSOP – DGV (1) ORDERABLE PART NUMBER Tape and reel TS3V330RGYR Tube TS3V330D Tape and reel TS3V330DR Tape and reel TS3V330DBQR Tube TS3V330PW Tape and reel TS3V330PWR Tape and reel TS3V330DGVR TOP-SIDE MARKING TF330 TS3V330 TF330 TF330 TF330 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 DESCRIPTION/ORDERING INFORMATION This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off. To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS IN INPUT/OUTPUT D FUNCTION L L S1 D port = S1 port L H S2 D port = S2 port H X Z Disconnect EN PIN DESCRIPTION NAME 2 DESCRIPTION S1, S2 Analog video I/Os D Analog video I/Os IN Select input EN Switch-enable input TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER DEFINITIONS PARAMETER DESCRIPTION Ron Resistance between the D and S ports, with the switch in the ON state IOZ Output leakage current measured at the D and S ports, with the switch in the OFF state IOS Short-circuit current measured at the I/O pins VIN Voltage at IN VEN Voltage at EN CIN Capacitance at the control (EN, IN) inputs COFF Capacitance at the analog I/O port when the switch is OFF CON Capacitance at the analog I/O port when the switch is ON VIH Minimum input voltage for logic high for the control (EN, IN) inputs VIL Minimum input voltage for logic low for the control (EN, IN) inputs VH Hysteresis voltage at the control (EN, IN) inputs VIK I/O and control (EN, IN) inputs diode clamp voltage VI Voltage applied to the D or S pins when D or S is the switch input VO Voltage applied to the D or S pins when D or S is the switch output IIH Input high leakage current of the control (EN, IN) inputs IIL Input low leakage current of the control (EN, IN) inputs II Current into the D or S pins when D or S is the switch input IO Current into the D or S pins when D or S is the switch output Ioff Output leakage current measured at the D or S ports, with VCC = 0 tON Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned ON tOFF Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned OFF BW Frequency response of the switch in the ON state measured at –3 dB XTALK Unwanted signal coupled from channel to channel. Measured in –dB. XTALK = 20 log VO/VI. This is a nonadjacent crosstalk. OIRR Off isolation is the resistance (measured in –dB) between the input and output with the switch OFF. DG Magnitude variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. DP Phase variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58 MHz, and dc offset is from 0 to 0.714 V. ICC Static power-supply current ICCD Variation of ICC for a change in frequency in the control (EN, IN) inputs ∆ICC This is the increase in supply current for each control input that is at the specified voltage level, rather than VCC or GND. 3 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 FUNCTIONAL DIAGRAM (POSITIVE LOGIC) 2 4 S1A DA 3 S2A DB 7 5 S1B 6 S2B 9 11 DC 10 DD 12 14 13 IN 1 15 EN 4 Control Logic S1C S2C S1D S2D TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 4.6 V VI/O Switch I/O voltage range (2) (3) (4) 4.6 V IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±128 mA ±100 mA II/O ON-state switch –0.5 current (5) Continuous current through VCC or GND D package (6) 73 DBQ package (6) θJA Package thermal impedance Tstg (1) (2) (3) (4) (5) (6) (7) Storage temperature range UNIT 90 DGV package 120 PW package (6) 108 RGY package (7) 39 –65 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) MIN MAX VCC Supply voltage 3 3.6 V VIH High-level control input voltage (EN, IN) 2 VCC V VIL Low-level control input voltage (EN, IN) 0 0.8 V VANALOG Analog I/O voltage 0 VCC V TA Operating free-air temperature –40 85 °C (1) UNIT All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 5 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 Electrical Characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER IIN = –18 mA UNIT VIK EN, IN Vhys EN, IN IIH EN, IN VCC = 3.6 V, VIN and VEN = VCC ±1 µA IIL EN, IN VCC = 3.6 V, VIN and VEN = GND ±1 µA IOZ (3) VCC = 3.6 V, VO = 0 to 3.6 V, VI = 0, Switch OFF ±1 µA (4) Switch ON IOS VCC = 3 V, MIN TYP (2) MAX –1.8 V 150 mV VCC = 3.6 V, VO = 0.5 VCC, VI = 0, Ioff VCC = 0 V, VO = 0 to 3.6 V, VI = 0 15 µA ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF 10 µA VCC = 3.6 V, One input at 3.4 V, Other inputs at VCC or GND VCC = 3.6 V, VEN = GND D and S ports open, ∆ICC EN, IN ICCD 50 mA VIN input switching 50% duty cycle CIN EN, IN 750 µA 0.45 mA/ MHz VIN of VEN = 0, f = 1 MHz VI = 0, f = 1 MHz, Outputs open, Switch OFF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 17 ron (5) VCC = 3 V VI = 1 V, IO = 13 mA, RL = 75 Ω 5 7 VI = 2 V, IO = 26 mA, RL = 75 Ω 7 10 D port COFF (1) (2) (3) (4) (5) S port 3.5 pF 10 pF 5 pF Ω VI, VO, II, and IO refer to I/O pins. All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. For I/O ports, IOZ includes the input leakage current. The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second. Measured by the voltage drop between the D and S terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (D or S) terminals. Switching Characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, RL = 75 Ω, CL = 20 pF (unless otherwise noted) (see Figure 5) PARAMETER FROM (INPUT) TO (OUTPUT) tON S tOFF S MIN TYP MAX UNIT D 2.5 6.5 ns D 1.1 3.5 ns Dynamic Characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER 6 UNIT RL = 150 Ω, f = 3.58 MHz, See Figure 6 0.82 % DP (2) RL = 150 Ω, f = 3.58 MHz, See Figure 6 0.1 Deg BW RL = 150 Ω, See Figure 7 300 MHz XTALK RL = 150 Ω, f = 10 MHz, RIN = 10 Ω, See Figure 8 –80 dB OIRR RL = 150 Ω, f = 10 MHz, See Figure 9 –50 dB DG (1) (2) TYP (1) TEST CONDITIONS (2) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. DG and DP are expressed in absolute magnitude. TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 TYPICAL CHARACTERISTICS 0 0 Phase −1 −10 −20 −2 −30 Gain −4 −40 −5 −50 −6 −60 −7 −70 −8 −80 −90 1000 −9 1 10 Phase − Deg Gain − dB −3 100 Frequency − MHz Gain 3 dB at 400 MHz Phase at 3-dB Frequency, −38.28 Degrees 0.0 0.08 −0.2 0.07 0.06 Differential Gain − % −0.4 Differental Gain 0.05 −0.6 −0.8 0.04 −1.0 0.03 −1.2 0.02 Differental Phase −1.4 0.01 −1.6 0.00 Differential Phase − Deg Figure 1. Gain/Phase vs Frequency −0.01 −1.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VBIAS − V Differential Gain at 0.714 V, −0.81% Differential Phase at 0.714 V, 0.06 Degree Figure 2. Differential Gain/Phase vs VBIAS 7 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com 0 160 −10 140 −20 120 Phase −30 100 −40 80 −50 60 Off Isolation −60 40 20 −70 −80 Phase − Deg Off Isolation − dB SCDS162C – MAY 2004 – REVISED JULY 2005 1 10 100 Frequency − MHz Off Isolation Differential at 10Gain Mhz,at−50.08 0.714 V, dB−0.81% Phase Differential at 10 MHz,Phase 87.8 Degrees at 0.714 V, 0.06 Degrees 0 1000 Figure 3. Off Isolation vs Frequency 0 250 −20 200 Phase −60 100 −80 50 Crosstalk 0 −100 −120 −50 −140 −100 −160 −150 −180 −200 −200 1 100 10 Frequency − MHz Crosstalk at 10 MHz, −80 dB Phase at 10 MHz, 100.62 Degrees Figure 4. Crosstalk vs Frequency 8 150 −250 1000 Phase − Deg Crosstalk − dB −40 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω IN 50 Ω VG1 S1 DUT VS1 VO D S2 CL (see Note A) EN RL VS2 TEST VCC RL CL VS1 VS2 tON 3.3 V ± 0.3 V 3.3 V ± 0.3 V 75 75 20 20 GND VCC VCC GND tOFF 3.3 V ± 0.3 V 3.3 V ± 0.3 V 75 75 20 20 GND VCC VCC GND TEST CIRCUIT VCC Output Control (VIN) 50% 50% 0V tON Analog Output Waveform (VO) tOFF 90% 90% VOH 0V VOLTAGE WAVEFORMS tON AND tOFF TIMES NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. The outputs are measured one at a time, with one transition per measurement. Figure 5. Test Circuit and Voltage Waveforms 9 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER VBIAS BIAS Network Analyzer (HP8753ES) Sawtooth Waveform Generator P1 P2 VCC S1A DA RL = 150 Ω IN DUT VIN EN VEN NOTE: For additional information on measurement method, refer to the TI application report, Measuring Differential Gain and Phase, literature number SLOA040. Figure 6. Test Circuit for Differential Gain/Phase Measurement Differential gain and phase are measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. HP8753ES Setup Average = 20 RBW = 300 Hz ST = 1.381 s P1 = -7 dBM CW frequency = 3.58 MHz Sawtooth Waveform Generator Setup VBIAS = 0 to 1 V Frequency = 0.905 Hz 10 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC DA S1A RL = 150 Ω IN DUT VIN EN VEN Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 11 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC S1A DA RL = 150 Ω IN DUT VIN S2A EN RL = 150 Ω 50 Ω† VEN † A 50-Ω termination resistor is needed for the Network Analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1B. All unused analog input (D) ports and output (S) ports are connected to GND through 10-Ω and 50-Ω pulldown resistors, respectively. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC S1A DA RL = 150 Ω IN 50 Ω† VIN EN DUT VEN DB RIN = 10 Ω † S1B RL = 150 Ω A 50-Ω termination resistor is needed for the network analyzer. Figure 9. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel. For example, when VIN = VCC, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog input (D) ports are left open, and output (S) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 13 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3V330D ACTIVE SOIC D 16 TS3V330DBQR ACTIVE SSOP/ QSOP DBQ TS3V330DBQRE4 ACTIVE SSOP/ QSOP TS3V330DBQRG4 ACTIVE TS3V330DE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3V330RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3V330RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3V330DGVR Package Package Pins Type Drawing TVSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 TS3V330DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TS3V330PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TS3V330RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3V330DGVR TVSOP DGV 16 2000 346.0 346.0 29.0 TS3V330DR SOIC D 16 2500 333.2 345.9 28.6 TS3V330PWR TSSOP PW 16 2000 346.0 346.0 29.0 TS3V330RGYR VQFN RGY 16 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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