SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 D D D D D Members of the Texas Instruments SCOPE Family of Testability Products Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture Control Operation of Up to Six Parallel Target Scan Paths Accommodate Pipeline Delay to Target of Up to 31 Clock Cycles Scan Data Up to 232 Clock Cycles D D D D D Execute Instructions for Up to 232 Clock Cycles Each Device Includes Four Bidirectional Event Pins for Additional Test Capability Inputs Are TTL-Voltage Compatible EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process Packaged in 44-Pin Plastic Leaded Chip Carrier (FN), 68-Pin Ceramic Pin Grid Array (GB), and 68-Pin Ceramic Quad Flat Packages (HV) description The ’ACT8990 test-bus controllers (TBC) are members of the Texas Instruments SCOPE testability integrated-circuit family. This family of components supports IEEE Standard 1149.1-1990 (JTAG) boundary scan to facilitate testing of complex circuit-board assemblies. The ’ACT8990 differ from other SCOPE integrated circuits. Their function is to control the JTAG serial-test bus rather than being target boundary -scannable devices. The required signals of the JTAG serial-test bus – test clock (TCK), test mode select (TMS), test data input (TDI), and test data output (TDO) can be connected from the TBC to a target device without additional logic. This is done as a chain of IEEE Standard 1149.1-1990 boundary-scannable components that share the same serial-test bus. The TBC generates TMS and TDI signals for its target(s), receives TDO signals from its target(s), and buffers its test clock input (TCKI) to a test clock output (TCKO) for distribution to its target(s). The TMS, TDI, and TDO signals can be connected to a target directly or via a pipeline, with a retiming delay of up to 31 bits. Since the TBC can be configured to generate up to six separate TMS signals [TMS (5 – 0)], it can be used to control up to six target scan paths that are connected in parallel (i.e., sharing common TCK, TDI, and TDO signals). While most operations of the TBC are synchronous to TCKI, a test-off (TOFF) input is provided for output control of the target interface, and a test-reset (TRST) input is provided for hardware/software reset of the TBC. In addition, four event [EVENT (3 – 0)] I/Os are provided for asynchronous communication to target device(s). Each event has its own event generation/detection logic, and detected events can be counted by two 16-bit counters. The TBC operates under the control of a host microprocessor/microcontroller via the 5-bit address bus [ADRS (4 – 0)] and the 16-bit read/write data bus [DATA (15 – 0)]. Read (RD) and write (WR) strobes are implemented such that the critical host-interface timing is independent of the TCKI period. Any one of 24 registers can be addressed for read and/or write operations. In addition to control and status registers, the TBC contains two command registers, a read buffer, and a write buffer. Status of the TBC is transmitted to the host via ready (RDY) and interrupt (INT) outputs. Major commands can be issued by the host to cause the TBC to generate the TMS sequences necessary to move the target(s) from any stable test-access-port (TAP) controller state to any other stable TAP state, to execute instructions in the Run-Test/Idle TAP state, or to scan instruction or test data through the target(s). A 32-bit counter can be preset to allow a predetermined number of execution or scan operations. Serial data that appears at the selected TDI input (TDI1 or TDI0) is transferred into the read buffer, which can be read by the host to obtain up to 16 bits of the serial-data stream. Serial data that is transmitted from the TDO output is written by the host to the write buffer. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SCOPE and EPIC are trademarks of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 description (continued) The SN54ACT8990 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ACT8990 is characterized for operation from 0°C to 70°C. 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 60 10 11 59 12 58 13 57 14 56 15 55 16 54 17 53 18 52 19 51 20 50 21 49 22 48 23 47 24 46 25 45 DATA14 NC DATA15 TOFF NC TDI0 TDI1 NC VCC 44 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 NC DATA9 DATA10 NC DATA11 DATA12 NC DATA13 NC DATA0 DATA1 NC DATA2 DATA3 NC DATA4 GND VCC NC DATA5 DATA6 NC DATA7 DATA8 NC NC – No internal connection 2 TRST NC NC ADRS4 ADRS3 NC ADRS2 ADRS1 NC ADRS0 GND INT NC RDY RD NC WR SN54ACT8990 . . . HV PACKAGE (TOP VIEW) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 NC TMS5/EVENT3 TMS4/EVENT2 NC TMS3/EVENT1 TMS2/EVENT0 NC VCC GND TMS1 NC TMS0 TDO NC TCKO TCKI NC SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 ADRS4 ADRS3 ADRS2 ADRS1 ADRS0 GND INT RDY RD WR TRST SN74ACT8990 . . . FN PACKAGE (TOP VIEW) 7 2 1 44 43 42 41 40 39 8 38 9 37 10 36 11 35 12 34 13 33 14 32 15 31 6 5 4 3 TMS5/EVENT3 TMS4/EVENT2 TMS3/EVENT1 TMS2/EVENT0 VCC GND TMS1 TMS0 TDO TCKO TCKI 16 VCC DATA14 DATA15 TOFF TDI0 TDI1 30 17 29 18 19 20 21 22 23 24 25 26 27 28 DATA9 DATA10 DATA11 DATA12 DATA13 DATA0 DATA1 DATA2 DATA3 DATA4 GND VCC DATA5 DATA6 DATA7 DATA8 SN54ACT8990 . . . GB PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 Table 1. Terminal Assignments TERMINAL TERMINAL TERMINAL TERMINAL NO. NAME NO. NAME NO. NAME NO. A2 NC B10 NC F11 NC K6 NAME NC A3 ADRS4 B11 NC G1 DATA5 K7 A4 NC C1 DATA2 G2 NC K8 VCC DATA15 A5 ADRS1 C2 DATA1 G10 NC K9 TDI0 A6 ADRS0 C3 NC G11 TMS1 K10 NC A7 NC C10 TMS4/EVENT2 H1 NC K11 TCKI A8 INT C11 TMS5/EVENT3 H2 DATA6 L2 DATA9 A9 RD D1 DATA4 H10 TDO L3 NC A10 TRST D2 DATA3 H11 TMS0 L4 DATA12 B1 DATA0 D10 TMS3/EVENT1 J1 DATA8 L5 DATA13 B2 NC D11 NC J2 DATA7 L6 NC B3 ADRS3 E1 NC J10 TCKO L7 DATA14 B4 ADRS2 E2 GND J11 NC L8 TOFF B5 NC E10 K1 NC L9 TDI1 B6 NC E11 VCC TMS2/EVENT0 K2 NC L10 NC B7 GND F1 K3 DATA10 B8 RDY F2 VCC NC K4 DATA11 B9 WR F10 GND K5 NC NC – No internal connection functional block diagram Target Interface Host Interface Read Data Bus 16 Write Data Bus 16 16 DATA(15 – 0)† 5 ADRS(4 – 0) TMS(5 – 2)/ EVENT(3 – 0)† 4 Event Block RD Counter Block WR RDY Command Block TMS(1 – 0) TDI(1 – 0)† TDO 2 2 Sequencer Block Serial Block TOFF† TCKO TCKI TRST † † Inputs have internal pullup resistors. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Host Block INT SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 Terminal Functions TERMINAL NAME I/O DESCRIPTION ADRS4 – ADRS0 I Address inputs. ADRS4 – ADRS0 form the 5-bit address bus that interfaces the TBC to its host. These inputs specify the TBC register to be read from or written to. DATA15 – DATA0 I/O Data inputs and outputs. DATA15 – DATA0 form the 16-bit bidirectional data bus that interfaces the TBC to its host. Data is read from or written to the TBC register using this data bus. GND INT Ground O NC Interrupt. INT transmits an interrupt signal to the host. When the TBC requires service from the host, INT is asserted (low). INT will remain asserted (low) until the host has completed the required service. No connection RD I Read strobe. RD is the active low output enable for the data bus. RD is used as the strobe for reading data from the selected TBC register. RDY O Ready. RDY transmits a status signal to the host. When the TBC is ready to accept a read or write operation from the host, RDY is asserted (low). RDY is not asserted (high) when the TBC is in recovery from a read, write, command, or reset operation. TCKI I Test clock input. TCKI is the clock input for the TBC. Most operations of the TBC are synchronous to TCKI. When enabled, all target interface outputs change on the falling edge of TCKI. Sampling of target interface inputs are configured to occur on either the rising edge or falling edge of TCKI. TCKO O Test clock output. TCKO distributes TCK to the target(s). The TCKO is configured to be disabled, constant zero, constant one, or to follow TCKI. When TCKO follows TCKI, it is delayed to match the delay of generating the TDO and TMS signals. TDI1 – TDI0 I Test data inputs. The TDI1 – TDI0 serial inputs are used for shifting test data from the target(s). The TDI inputs can be directly connected to the TDO pin(s) of the target(s). TDO O Test data output. TDO is used for shifting test data into the target(s). TDO can be directly connected to the TDI terminal(s) of the target(s). TMS1 – TMS0 O Test mode select outputs. These parallel outputs transmit TMS signals to the target(s), which direct them through their TAP controller states. TMS1 – TMS0 can be directly connected to the TMS terminals of the target(s). TMS5 – TMS2/ EVENT3 – EVENT0 I/O Test mode select outputs or event inputs/outputs. These I/Os can be configured for use as either TMS outputs or event inputs/outputs. As TMS outputs, they function similarly to TMS1 – TMS0 above. As event I/Os, they can be used to receive/transmit interrupt signals to/from the target(s). TOFF I Test-off input. TOFF is the active low output disable for all outputs and I/Os of the target interface (TCKO, TDO, TMS, TMS/EVENT). TRST I Test-reset input. TRST is used to initiate hardware and software reset operations of the TBC. Hardware reset begins when TRST is asserted (low). Software reset begins when TRST is released (high) and proceeds synchronously to TCKI to completion in a predetermined number of cycles. WR I Write input. WR is the strobe for writing data to a TBC data register. Signals present at the data and address buses are captured on the rising edge of WR. VCC Supply voltage POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2): FN package . . . . . . . . . . . . . . . . . . . 1.5W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 75 mils. For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data Book, literature number SCBD002. recommended operating conditions SN54ACT8990 SN74ACT8990 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current –8 –8 mA IOL TA Low-level output current 8 8 mA 70 °C 6 High-level input voltage 2 2 0.8 Operating free-air temperature –55 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VCC VCC 125 0 0 0 V V 0.8 V VCC VCC V V SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS ICC Ci Cio Co SN54ACT8990 MIN MAX SN74ACT8990 MIN MAX IOH = –20 µA IOH = – 8 mA 4.4 4.4 4.4 3.7 3.7 3.7 5V VCC = 5 5.5 IOH = –20 µA IOH = –8 mA 5.4 5.4 5.4 VCC = 4.5 V to 5.5 V IOL = 20 µA IOL = 8 mA 0.1 0.1 0.1 0.5 0.5 0.5 ADRS, RD, WR, TCKI VCC = 5.5 V, VI = VCC or GND ±1 ±1 ±1 TDI, TOFF, TRST VCC = 5 5.5 5V VI = VCC VI = GND ±1 ±1 ±1 INT, RDY, TCKO, TDO, TMS VCC = 5.5 V, VO = VCC or GND ±10 ±10 ±10 DATA,, TMS/EVENT VCC = 5 5.5 5V VO = VCC VO = GND ±10 ±10 ±10 VCC = 5.5 V, IO = 0, VI = VCC or GND VOL IOZ‡ TA = 25°C TYP† MAX VCC = 4 4.5 5V VOH II MIN 4.7 –35 –35 4.7 –70 –70 –250 –250 450* VCC = 5.5 V, CL = 50 pF fclock = 30 MHz VI = VCC or GND VI = VCC or GND VI = VCC or GND –35 –35 UNIT V 4.7 –250 –250 450 –35 –35 V A µA –250 A µA –250 450 µA 100 mA 5* 9* pF 8* pF pF * On products compliant to MIL-PRF-38535, this parameter does not apply. † Typical values are at VCC = 5 V. ‡ For I/O ports, the parameter IOZ includes the input leakage. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 timing requirements over recommended ranges of supply voltage and operating free-air temperature (see Figure 1) SN54ACT8990 fclock Clock frequency MIN MAX 0 30 RD low† Pulse duration 5.5 EVENT high or low TCKI high or low TRST low ADRS† before RD↑ tsu th Setup time Hold time MAX 0 30 8 8 10.5 10.5 6 6 6.5 6.5 6.5 DATA before WR↑ 6 6 EVENT before TCKI↑ 6 5.5 EVENT before TCKI↓ 5 5 TDI before TCKI↑ 2 2 TDI before TCKI↓ ADRS† after RD↑ 2 2 5 ADRS after WR↑ 5.5 5 DATA after WR↑ 5.5 5.5 EVENT after TCKI↑ 5.5 5 EVENT after TCKI↓ 5 5 TDI after TCKI↑ 4 2.5 TDI after TCKI↓ 4 2.5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MHz ns 5.5 ADRS before WR↑ † Applies only in the case where ADRS (4-0) = 10110 (read buffer). 8 MIN 5.5 WR low tw SN74ACT8990 ns ns ns ns ns SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature (see Figure 1) PARAMETER fmax tPLH tPHL tPLH tPLH tPHL tPHL tPLH FROM (INPUT) TO (OUTPUT) SN54ACT8990 MIN MIN 8 43 19.5 39.3 8 43 19.5 39.3 5.3 17 5.3 13.8 2.5 16 2.5 13 3.7 16 3.7 12.9 5.5 15 5.5 13.1 30 ADRS DATA RD↑ RDY WR↑ INT TCKI↑ SN74ACT8990 MAX MAX 30 UNIT MHz ns ns ns TCKI↑ RDY 4.4 15 4.4 13.4 ns TCKI↑ TCKO 3.3 17 3.3 14.1 ns tPLH tPHL TCKI↓ TCKO 2.3 19 2.3 15.9 3.6 17 3.6 15.6 tPLH tPHL TCKI↓ TDO 2.9 19 2.9 17.5 5.2 20 5.2 17.9 tPLH tPHL TCKI↓ TMS 3.1 19 3.1 17.5 5.1 19 5.1 18.2 tPLH tPHL TCKI↓ TMS/EVENT 1.5 19 1.5 17.5 3.5 20 3.5 18.9 tPZH tPZL DATA 3.8 21 3.8 17.6 RD↓ 6.8 28 6.8 22.6 tPZH INT 4.9 19 4.9 15.3 TCKI↑ RDY 3.6 19 3.6 15.3 tPZH tPZL TCKI↓ TCKO 4.1 23 4.1 19.2 4.8 20 4.8 17.4 tPZH tPZL TCKI↓ TDO 4.3 22 4.3 19.5 5 20 5 17.7 tPZH tPZL TCKI↓ TMS 4.6 23 4.6 19.9 5.1 20 5.1 18.5 tPZH tPZL TCKI↓ TMS/EVENT 2 21 2 18.8 3.2 20 3.2 18.7 tPZH tPZL TCKO 4.6 16 4.6 12.2 TOFF↑ 3.1 14 3.1 10.3 tPZH tPZL TDO 4.4 15 4.4 12.2 TOFF↑ 3.5 14 3.5 10.8 tPZH tPZL TOFF↑ TMS 3.1 16.2 3.1 14.7 1.9 16.7 1.9 13.6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ns ns ns ns ns ns ns ns ns ns ns ns ns 9 SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature (continued) (see Figure 1) 10 PARAMETER FROM (INPUT) TO (OUTPUT) tPZH tPZL TOFF↑ TMS/EVENT tPHZ tPLZ RD↑ DATA tPHZ tPLZ TCKI↓ TCKO tPHZ tPLZ TCKI↓ TDO tPHZ tPLZ TCKI↓ TMS tPHZ tPLZ TCKI↓ TMS/EVENT tPHZ tPLZ TOFF↓ TCKO tPHZ tPLZ TOFF↓ TDO tPHZ tPLZ TOFF↓ TMS tPHZ tPLZ TOFF↓ TMS/EVENT tPHZ tPLZ TRST↓ DATA tPHZ tPLZ TRST↓ INT tPHZ tPLZ TRST↓ RDY tPHZ tPLZ TRST↓ TMS/EVENT POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ACT8990 SN74ACT8990 MIN MAX MIN MAX 2.3 15.3 2.3 13.8 2.7 16.4 2.7 13.9 3.8 18.4 3.8 15.4 4.1 17.1 4.1 14.8 6.7 20.4 6.7 19.8 4.8 21.1 4.8 20.4 5.1 21.7 5.1 21.3 5 20.7 5 20.3 6.9 22.4 6.9 21.9 4.6 20.6 4.6 20.1 4.7 22.5 4.7 22.1 2.8 20.5 2.8 20.1 5 15.6 5 15.4 4.4 15.5 4.4 15.3 5.6 16.6 5.6 16.5 4.6 15.4 4.6 15.4 4.8 19.1 4.8 17.1 4.4 17 4.4 15.8 4.5 18.8 4.5 17.3 2.4 17.1 2.4 16.2 5.7 23 5.7 20.8 4.2 20.3 4.2 20 6 19.6 8 19.5 6.1 18 6.1 17.8 6.5 18.8 6.5 18.7 4.8 17.8 4.8 17.8 6 21.1 6 21.1 4.2 20 4.2 19.9 UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns SN54ACT8990, SN74ACT8990 TEST-BUS CONTROLLERS IEEE STD 1149.1 (JTAG) TAP MASTERS WITH 16-BIT GENERIC HOST INTERFACES SCAS190E – JUNE 1990 – REVISED JANUARY 1997 PARAMETER MEASUREMENT INFORMATION VCC S1 1 kΩ From Output Under Test Open GND TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VCC GND CL = 50 pF (see Note A) tw LOAD CIRCUIT 3V Input 1.5 V 1.5 V 0V 3V 1.5 V Timing Input VOLTAGE WAVEFORMS PULSE DURATION 0V tsu th 3V 1.5 V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 1.5 V 1.5 V 0V tPLH Output VOH 50% VCC VOL Output Waveform 2 S1 at GND (see Note B) 1.5 V 0V tPLZ ≈ VCC Output Waveform 1 S1 at VCC (see Note B) tPHL 50% VCC 1.5 V tPZL 3V Input 3V Output Control (high-level enabling) 50% VCC tPZH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 10% VCC VOL tPHZ 50% VCC 90% VCC VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. For testing pulse duration: tr = tf = 1 to 3 ns. Pulse polarity can be either high-to-low-to-high or low-to-high-to-low. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) 5962-9322801MXA ACTIVE CFP HV 68 1 TBD Call TI Call TI 5962-9322801MYA ACTIVE CPGA GB 68 1 TBD Call TI Call TI SN74ACT8990FN ACTIVE PLCC FN 44 26 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT8990FNR ACTIVE PLCC FN 44 500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SNJ54ACT8990GB ACTIVE CPGA GB 68 1 TBD Call TI Call TI SNJ54ACT8990HV ACTIVE CFP HV 68 1 TBD Call TI Call TI Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. 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