PTC thermistors for overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Series/Type: B59606, B59607, B59707, B59807, B59907, B5962* Date: November 2011 © EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Applications Overcurrent protection Short circuit protection Features Qualification based on AEC-Q200 rev. D for type A907 Thermistor chip with lead-free tinned terminations Small size Short response times Suitable for reflow soldering only Suitable for automatic placement UL approval for selcted types (case size 1210) RoHS-compatible Delivery mode Blister tape (case size 1210) or cardboard tape (case size 0603), 180-mm reel with 8-mm tape, taping to IEC 60286-3 Dimensional drawings in mm EIA case size 0603 Solder pad EIA case size 1210 Solder pad Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Recommended maximum dimensions (mm) Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V General technical data Switching cycles Tolerance of RR Tolerance of RR Operating temperature range Operating temperature range Operating temperature range N ∆RR ∆RR Top Top Top (except A907) (for A907) (V = 0) (V = Vmax, except A907) (V = Vmax, for A907) 100 ±25 ±35 40/+125 20/+85 40/+85 % % °C °C °C Electrical specifications and ordering codes Approvals IR 1) Type IS1) mA mA ISmax (V = Vmax) A RR Rmin Ω Ω Vmax = 30 V DC or V AC, VR = 24 V DC or V AC A606 90 180 0.5 27 17 A607 70 130 0.4 55 30 Vmax = 60 V DC or V AC, VR = 42 V DC or V AC A622 22 47 0.22 220 150 Vmax = 80 V DC or V AC, VR = 63 V DC or V AC A623 15 33 0.15 470 300 A707 50 90 0.3 125 75 Vmax = 265 V DC or V AC, VR = 230 V DC or V AC A807 15 40 0.2 400 200 Vmax = 400 V DC or V AC, VR = 230 V DC or V AC A907 12 22 0.15 1500 640 EIA case size Approvals Ordering code 1210 1210 X X B59606A0110A062 B59607A0120A062 0603 B59622A0090A062 0603 1210 X B59623A0090A062 B59707A0120A062 1210 X B59807A0090A062 1210 X B59907A0120A062 1) Measured on component soldered to standardized PCB Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Reliability data Test Electrical endurance, cycling Electrical endurance, constant Damp heat Standard IEC 60738-1 Rapid change of temperature IEC 60738-1 Vibration IEC 60738-1 Shock IEC 60738-1 Climatic sequence IEC 60738-1 Bending test IEC 60738-1 IEC 60738-1 IEC 60738-1 Adhesive strength on PCB Please read Cautions and warnings and Important notes at the end of this document. Test conditions Room temperature, ISmax; Vmax Number of cycles: 100 Storage at Vmax /Top,max (Vmax) Test duration: 1000 h Temperature of air: 40 °C Relative humidity of air: 93% Duration: 56 days Test according to IEC 60068-2-78 T1 = Top,min (0 V), T2 = Top,max (0 V) Number of cycles: 5 Test duration: 30 min Test according to IEC 60068-2-14, test Na Frequency range: 10 to 55 Hz Displacement amplitude: 0.75 mm Test duration: 3 × 2 h Test according to IEC 60068-2-6, test Fc Acceleration: 390 m/s2 Pulse duration: 6 ms; 6 × 4000 pulses Dry heat: T = Top,max (0 V) Test duration: 16 h Damp heat first cycle Cold: T = Top,min (0 V) Test duration: 2 h Damp heat 5 cycles Tests performed according to IEC 60068-2-30 Components reflow-soldered to test board Maximum bending: 2 mm Test according to IEC 60068-2-21, test Ue A shear force of 5 N is applied perpendicular to the longitudinal axis of the component which is soldered on PCB. Page 5 of 27 ∆R25/R25 < 25% < 25% < 10% < 10% < 5% < 5% < 10% < 10% No visible damage Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Characteristics (typical) for A606, A607 and A707 PTC resistance RPTC versus PTC temperature TPTC (measured at low signal voltage) Switching time tS versus switching current IS (measured at 25 °C in still air) Rated current IR versus ambient temperature TA (measured in still air) Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Characteristics (typical) for A807 PTC resistance RPTC versus PTC temperature TPTC (measured at low signal voltage) Switching time tS versus switching current IS (measured at 25 °C in still air) Rated current IR versus ambient temperature TA (measured in still air) Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Characteristics (typical) for A907 PTC resistance RPTC versus PTC temperature TPTC (measured at low signal voltage) Switching time tS versus switching current IS (measured at 25 °C in still air) Rated current IR versus ambient temperature TA (measured in still air) Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Characteristics (typical) for A622 and A623 PTC resistance RPTC versus PTC temperature TPTC (measured at low signal voltage) Switching time tS versus switching current IS (measured at 25 °C in still air) Rated current IR versus ambient temperature TA (measured in still air) Taping and packing Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Many of the components presented in this data book are suitable for processing on automatic insertion or placement machines. These thermistors can be supplied on tape for easy handling by automatic systems. The individual modes of taping and packing will be described in the following. 1 Taping of SMD thermistors 1.1 Blister tape (to IEC 60286-3) Figure 1 Dimension 8-mm tape (mm) D0 1.50 D1 1.00 P0 4.00 P2 2.00 P1 4.00 W 8.00 E 1.75 F 3.50 G 0.75 16-mm tape 1.50 1.50 4.00 2.00 12.00 16.00 1.75 7.50 0.75 Tolerance (mm) + 0.10/0 min. ± 0.10 1) ± 0.05 ± 0.10 ± 0.30 ± 0.10 ± 0.05 min. 24-mm tape 1.50 1.50 4.00 2.00 16.00 24.00 1.75 11.50 0.75 Tolerance (mm) + 0.10 + 0.10 ± 0.10 ± 0.10 ± 0.10 + 0.30/0.1 ± 0.10 ± 0.10 min. A0 x B0, K0, T2: The rated dimensions of the component compartment have been derived from the relevant component specification and are chosen such that the components cannot change their orientation within the tape. 1) ≤ 0.2 mm over 10 sprocket holes Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Part orientation in tape pocket for blister tape For chip thermistors case sizes 0805 and 1210 Figure 2 Additional taping information For chip thermistors case sizes 0805 and 1210 Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Please read Cautions and warnings and Important notes at the end of this document. Polystyrol (PS) Polystyrol (PS) or Polycarbonat (PC) or PVC min. 10 N min. 10 N 0.2 ... 0.6 N for 8-mm tape and 0.2 ... 0.8 N for 12-mm tape at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165° ... 180° Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20° Page 11 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.2 Cardboard tape (to IEC 60286-3) Figure 3 Dimensions (mm) Tolerance (mm) 8-mm tape Case size 0402 0603 A0 0.6 0.95 ±0.2 B0 1.15 1.8 ±0.2 T T2 0.6 0.75 0.95 1.1 ±0.05 max. D0 P0 P2 P1 1.5 4.0 2.0 2.0 +0.1/0 4.0 2.0 4.0 ±0.12) ±0.05 ±0.1 W 8.0 ±0.3 E 1.75 ±0.1 F 3.5 ±0.05 G 0.75 min. 2) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Part orientation in tape pocket for cardboard tape For chip thermistors case sizes 0402 and 0603 Figure 4 Additional taping information Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Please read Cautions and warnings and Important notes at the end of this document. Polystyrol (PS) Cardboard min. 10 N min. 10 N 0.1 ... 0.65 N at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165° ... 180° Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20° Page 13 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.3 Reel dimensions 180-mm reel with 8-mm tape Figure 5 Dimension A W1 W2 180-mm reel 180 2/+0 8.4 +1.5/0 14.4 max. 330-mm reel with 16-mm tape Figure 6 Dimension A W1 W2 330-mm reel 330 2/+0 16.4 +2.0/0 22.4 max. 330-mm reel with 24-mm tape Figure 7 Dimension A W1 W2 330-mm reel 330 2/+0 24.4 min. 30.4 max. 380-mm reel with 24-mm tape Figure 8 Dimension A W1 W2 Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 27 380-mm reel 380 2/+0 24.4 min. 30.4 max. Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Mounting instructions 1 Soldering 1.1 Leaded PTC thermistors Leaded PTC thermistors follow the solderability requirements of IEC 60068-2-20. During soldering, care must be taken that the thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Solderability Resistance to soldering heat Solder containing lead (SnPb 60/40) Solder bath temperature 230 °C Soldering time 3 s Soldering iron temperature 350 °C Soldering time 3 s Lead-free solder (Sn96.5Ag3Cu0.5) Solder bath temperature 245 °C Soldering time 3 s Solder bath temperature 260 °C Soldering time 10 s Distance to thermistor has to be ≥6 mm. Under more severe soldering conditions the resistance may change. Soldering conditions for wave soldering are given in chapter 1.4.1. 1.2 Leadless PTC thermistors In case of PTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. In addition, soldering methods should be employed which permit short soldering times. Soldering conditions for wave soldering are given in chapter 1.4.1. 1.3 SMD PTC thermistors The notes on soldering leadless thermistors also apply to the SMD versions (refer to IEC 60068-2-58). Soldering conditions for wave soldering are given in chapter 1.4.1., for reflow soldering in chapter 1.4.2. 1.3.1 Chrome/nickel/tin terminations (Sizes 0402, 0603, 0805, 1210) As shown in the figure above, the terminations consists of three metallic layers. A primary chrome layer provides for good electrical contact. "Leaching" is prevented by a nickel barrier layer. The outer tin coating prevents corrosion of the nickel and ensures good component solderability. Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.3.2 Test methods for wetting and resistance to soldering heat a) Solder bath method according to IEC 60068-2-58 Applicable for SMD components with wire or tag terminations. In case the SMD-component does not have a completely closed housing, only the wires or tags may be immersed into the solder bath. Wetting test Resistance to soldering heat Lead-free solder (Sn96.5Ag3Cu0.5) Bath temperature 250 °C Soldering time 3 s Bath temperature 260 °C Soldering time 10 s Solder containing lead (SnPb 60/40) Bath temperature 215 °C Soldering time 3 s Bath temperature 260 °C Soldering time 10 s b) Solder reflow method according to IEC 60068-2-58 Applicable for chip-style SMD components. Reflow temperature profile is stated in IEC 60068-2-58, 8.1.2.1 for wetting test and 8.1.2.2 for resistance to soldering heat test. Wetting test Resistance to soldering heat Lead-free solder (Sn96.5Ag3Cu0.5) Peak temperature 225 ... 235 °C Duration maximum 20 s Peak temperature 245 ... 255 °C Duration maximum 20 s Please read Cautions and warnings and Important notes at the end of this document. Solder containing lead (SnPb 60/40) Peak temperature 215 °C Duration maximum 10 s Peak temperature 235 °C Duration maximum 30 s Page 16 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.3.3 Placement and orientation of SMDs on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked. b) Cracks When placing a component near an area which is apt to bend or a grid groove on the PC board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line. c) Component orientation Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Please read Cautions and warnings and Important notes at the end of this document. Page 17 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.4 Soldering profiles 1.4.1 Wave soldering Recommended temperature profile for wave soldering following IEC 61760-1. Applicable for leaded PTCs and selected SMD PTCs (case sizes 3225 and 4032 as well as superior series for case sizes 0402, 0603 and 0805 limit temperature sensors). Please read Cautions and warnings and Important notes at the end of this document. Page 18 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.4.2 Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 °C of specified classification temperature (Tc) Average ramp-down rate Time 25 °C to peak temperature Tsmin Tsmax tsmin to tsmax Tsmax to Tp TL tL Tp1) Tp to Tsmax Sn-Pb eutectic assembly Pb-free assembly 100 °C 150 °C 60 ... 120 s 3 °C/ s max. 183 °C 60 ... 150 s 220 °C ... 235 °C2) 150 °C 200 °C 60 ... 180 s 3 °C/ s max. 217 °C 60 ... 150 s 245 °C ... 260 °C2) 20 s3) 30 s3) 6 °C/ s max. maximum 6 min 6 °C/ s max. maximum 8 min 1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Please read Cautions and warnings and Important notes at the end of this document. Page 19 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V 1.4.3 Solder joint profiles for PTC theristors with chrome/nickel/tin terminations 2 Storage of PTC thermistors PTC thermistors should be soldered after shipment from EPCOS within the time specified: Use thermistor within the following period after delivery: Through-hole devices (housed and leaded PTCs) Motor protection sensors, glass-encapsulated sensors and probe assemblies Telecom pair and quattro protectors (TPP, TQP) Leadless PTC thermistors for pressure contacting Leadless PTC thermistors for soldering SMDs in EIA sizes 3225 and 4032, and for PTCs with metal tags SMDs in EIA sizes 0402, 0603, 0805 and 1210 24 months 24 months 24 months 12 months 6 months 24 months 12 months The parts are to be left in the original packing. Storage temperature: Relative humidity: 25 ... + 45 °C ≤ 75% annual average, ≤ 95% on 30 days in a year The solderability of the external electrodes may be deteriorated if SMDs are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfuric acid gas or hydrogen sulfide). Please read Cautions and warnings and Important notes at the end of this document. Page 20 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the components as soon as possible. 3 Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benfit of this method is that it involves no thermal stress. The adhesives used must be chemically inert and suitable for the temperatures arising at the surface of the termistor. 4 Clamp contacting Pressure contacting by springs is required for applications involving frequent switching and high turn-on powers. Soldering is not allowed for such applications in order to avoid operational failure in the long term. PTC thermistors for heating and motor starting have metallized surfaces for clamp contacting. 5 Robustness of terminations The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Tensile strength: Test Ua1: Leads ∅ ≤ 0.5 mm = 5 N ∅ > 0.5 mm = 10 N Bending strength: Test Ub: Two 90°-bends in opposite directions at a weight of 0.25 kg. Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). Please read Cautions and warnings and Important notes at the end of this document. Page 21 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Twisting of leads The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the thermistor body. 6 Sealing and potting When thermistors are sealed or potted, there must be no mechanical stress through differing thermal expansion in the curing process and during later operation. In the curing process the upper category temperature of the thermistor must not be exceeded. It is also necessary to ensure that the potting compound is chemically inert. Sealing and potting compounds may degenerate the titanate ceramic of PTC thermistors and lead to the formation of low-ohmic conduction bridges. In conjunction with a change in dissipation conditions due to the potting compound, local overheating may finally damage the thermistor. Therefore sealing and potting should be avoided whenever possible. 7 Cleaning You may use common cleaners based on organic solvents (eg dowanol or alcohol) to clean ceramic and solder joints. For sufficient cleaning flux must be completely removed. Solvents may cause plastic encapsulations to swell or detach. So be sure to check the suitability of a solvent before using it. Caution is required with ultrasonic processes. If the sound power is too high, for example, it can degrade the adhesive strength of the terminal metallization or couse the encapsulation to detach. After cleaning drying is promptly necessary. Please read Cautions and warnings and Important notes at the end of this document. Page 22 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Cautions and warnings General EPCOS thermistors are designed for specific applications and should not be used for purposes not identified in our specifications, application notes and data books unless otherwise agreed with EPCOS during the design-in-phase. Ensure suitability of thermistor through reliability testing during the design-in phase. The thermistors should be evaluated taking into consideration worst-case conditions. Storage Store thermistors only in original packaging. Do not open the package before storage. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, maximum 95%, dew precipitation is inadmissible. Avoid contamination of thermistors surface during storage, handling and processing. Avoid storage of thermistor in harmful environment with effect on function on long-term operation (examples given under operation precautions). Use thermistor within the following period after delivery: Through-hole devices (housed and leaded PTCs): 24 months Motor protection sensors, glass-encapsulated sensors and probe assemblies: 24 months Telecom pair and quattro protectors (TPP, TQP): 24 months Leadless PTC thermistors for pressure contacting: 12 months Leadless PTC thermistors for soldering: 6 months SMDs in EIA sizes 3225 and 4032, and for PTCs with metal tags: 24 months SMDs in EIA sizes 0402, 0603, 0805 and 1210: 12 months Handling PTCs must not be dropped. Chip-offs must not be caused during handling of PTCs. Components must not be touched with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Soldering (where applicable) Use rosin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended. Standard PTC heaters are not suitable for soldering. Please read Cautions and warnings and Important notes at the end of this document. Page 23 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Mounting Electrode must not be scratched before/during/after the mounting process. Contacts and housing used for assembly with thermistor have to be clean before mounting. Especially grease or oil must be removed. When PTC thermistors are encapsulated with sealing material, the precautions given in chapter "Mounting instructions", "Sealing and potting" must be observed. When the thermistor is mounted, there must not be any foreign body between the electrode of the thermistor and the clamping contact. The minimum force of the clamping contacts pressing against the PTC must be 10 N. During operation, the thermistor’s surface temperature can be very high. Ensure that adjacent components are placed at a sufficient distance from the thermistor to allow for proper cooling at the thermistors. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of thermistor. Be sure that surrounding parts and materials can withstand this temperature. Avoid contamination of thermistor surface during processing. Operation Use thermistors only within the specified temperature operating range. Use thermistors only within the specified voltage and current ranges. Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases (chlorine gas, hydrogen sulfide gas, ammonia gas, sulfuric acid gas etc), corrosive agents, humid or salty conditions. Contact with any liquids and solvents should be prevented. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by abnormal function (e.g. use VDR for limitation of overvoltage condition). Please read Cautions and warnings and Important notes at the end of this document. Page 24 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V Symbols and terms A Cth f I Imax IR IPTC Ir Ir,oil Ir,air IRMS IS ISmax LCT N Nc Nf P P25 Pel Pdiss RG Rmin RR ∆RR RP RPTC Rref RS R25 R25,match ∆R25 T t TA ta TC Area Heat capacity Frequency Current Maximum current Rated current PTC current Residual currrent Residual currrent in oil (for level sensors) Residual currrent in air (for level sensors) Root-mean-square value of current Switching current Maximum switching current Lower category temperature Number (integer) Operating cycles at Vmax, charging of capacitor Switching cycles at Vmax, failure mode Power Maximum power at 25 °C Electrical power Dissipation power Generator internal resistance Minimum resistance Rated resistance Tolerance of RR Parallel resistance PTC resistance Reference resistance Series resistance Resistance at 25 °C Resistance matching per reel/ packing unit at 25 °C Tolerance of R25 Temperature Time Ambient temperature Thermal threshold time Ferroelectric Curie temperature Please read Cautions and warnings and Important notes at the end of this document. Page 25 of 27 Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 V tE TR Tsense Top TPTC tR Tref TRmin tS Tsurf UCT V or Vel VRMS VBD Vins Vlink,max Vmax Vmax,dyn Vmeas Vmeas,max VR VPTC Settling time (for level sensors) Rated temperature Sensing temperature Operating temperature PTC temperature Response time Reference temperature Temperature at minimum resistance Switching time Surface temperature Upper category temperature Voltage (with subscript only for distinction from volume) Root-mean-square value of voltage Breakdown voltage Insulation test voltage Maximum link voltage Maximum operating voltage Maximum dynamic (short-time) operating voltage Measuring voltage Maximum measuring voltage Rated voltage Voltage drop across a PTC thermistor α ∆ δth τth λ Temperature coefficient Tolerance, change Dissipation factor Thermal cooling time constant Failure rate Lead spacing (in mm) Abbreviations / Notes Surface-mount devices * To be replaced by a number in ordering codes, type designations etc. + To be replaced by a letter All dimensions are given in mm. The commas used in numerical values denote decimal points. Please read Cautions and warnings and Important notes at the end of this document. Page 26 of 27 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, FormFit, MiniBlue, MiniCell, MKK, MKD, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 27 of 27