SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 D Operating Range 2-V to 5.5-V VCC D Latch-Up Performance Exceeds 250 mA Per SN54AHC244 . . . J OR W PACKAGE SN74AHC244 . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) JESD 17 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description/ordering information These octal buffers/drivers are designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’AHC244 devices are organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 1A2 2Y3 1A3 2Y2 1A4 2OE 2Y4 1A1 1OE VCC SN54AHC244 . . . FK PACKAGE (TOP VIEW) ORDERING INFORMATION PDIP − N SN74AHC244N Tube SN74AHC244DW Tape and reel SN74AHC244DWR SOP − NS Tape and reel SN74AHC244NSR AHC244 SSOP − DB Tape and reel SN74AHC244DBR HA244 Tube SN74AHC244PW Tape and reel SN74AHC244PWR TVSOP − DGV Tape and reel SN74AHC244DGVR HA244 CDIP − J Tube SNJ54AHC244J SNJ54AHC244J CFP − W Tube SNJ54AHC244W SNJ54AHC244W LCCC − FK Tube SNJ54AHC244FK SNJ54AHC244FK TSSOP − PW −55°C 55 C to 125 125°C C † TOP-SIDE MARKING Tube SOIC − DW 40°C to 85°C −40°C ORDERABLE PART NUMBER PACKAGE† TA SN74AHC244N AHC244 HA244 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 FUNCTION TABLE (each 4-bit buffer/driver) INPUTS OE A OUTPUT Y L H H L L L H X Z logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 recommended operating conditions (see Note 3) SN54AHC244 VCC Supply voltage VCC = 2 V VIH MAX 2 5.5 1.5 VCC = 3 V High-level High level input voltage MIN VCC = 5.5 V Input voltage VO Output voltage High-level High level output current IOL Low-level Low level output current Δt/Δv Input transition rise or fall rate TA Operating free-air temperature 5.5 2.1 0.5 0.5 0.9 0.9 1.65 1.65 5.5 0 5.5 0 VCC 0 V −50 mA −4 −4 −8 −8 VCC = 2 V 50 50 VCC = 3.3 V ± 0.3 V 4 4 VCC = 5 V ± 0.5 V 8 8 100 100 20 20 −55 V VCC VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V V −50 VCC = 5 V ± 0.5 V VCC = 3.3 V ± 0.3 V V V 0 VCC = 2 V IOH 2 UNIT 1.5 3.85 VCC = 5.5 V VI MAX 2.1 VCC = 3 V Low-level Low level input voltage MIN 3.85 VCC = 2 V VIL SN74AHC244 125 −40 85 mA mA mA ns/V °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHC244 TYP 2V 1.9 2 1.9 1.9 3V 2.9 3 2.9 2.9 4.5 V 4.4 4.5 4.4 4.4 IOH = −4 mA 3V 2.58 2.48 2.48 IOH = −8 mA 4.5 V 3.94 IOH = −50 50 mA VOH IOL = 50 mA VOL IOL = 4 mA IOL = 8 mA MIN MAX 3.8 MIN MAX UNIT V 3.8 2V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 V 4.5 V 0.36 0.5 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA 5.5 V ±0.25 ±2.5 ±2.5 mA 4 40 40 mA 10 pF II VI = 5.5 V or GND IOZ VO = VCC or GND, VI (OE) = VIL or VIH ICC VI = VCC or GND, Ci VI = VCC or GND 5V 2 Co VO = VCC or GND 5V 3.5 IO = 0 MAX SN74AHC244 MIN 5.5 V 10 pF * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A Y CL = 15 pF OE Y CL = 15 pF OE Y CL = 15 pF A Y CL = 50 pF OE Y CL = 50 pF OE Y CL = 50 pF tsk(o) ∗ TA = 25°C MIN SN54AHC244 SN74AHC244 TYP MAX MIN MAX MIN MAX 5.8* 8.4* 1* 10* 1 10 5.8* 8.4* 1* 10* 1 10 6.6* 10.6* 1* 12.5* 1 12.5 6.6* 10.6* 1* 12.5* 1 12.5 5* 9.7* 1* 11* 1 11 5* 9.7* 1* 11* 1 11 8.3 11.9 1 13.5 1 13.5 8.3 11.9 1 13.5 1 13.5 9.1 14.1 1 16 1 16 9.1 14.1 1 16 1 16 10.3 14 1 16 1 16 10.3 14 1 16 1 16 CL = 50 pF 1.5** 1.5 UNIT ns ns ns ns ns ns ns On products compliant to MIL-PRF-38535, this parameter is not production tested. On products compliant to MIL-PRF-38535, this parameter does not apply. ∗∗ switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ tPLH tPHL tPZH tPZL tPHZ tPLZ tsk(o) FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE A Y CL = 15 pF OE Y CL = 15 pF OE Y CL = 15 pF A Y CL = 50 pF OE Y CL = 50 pF OE Y CL = 50 pF TA = 25°C MIN MAX MIN MAX MIN MAX 3.9* 5.5* 1* 6.5* 1 6.5 3.9* 5.5* 1* 6.5* 1 6.5 4.7* 7.3* 1* 8.5* 1 8.5 4.7* 7.3* 1* 8.5* 1 8.5 5* 7.2* 1* 8.5* 1 8.5 5* 7.2* 1* 8.5* 1 8.5 5.4 7.5 1 8.5 1 8.5 5.4 7.5 1 8.5 1 8.5 6.2 9.3 1 10.5 1 10.5 6.2 9.3 1 10.5 1 10.5 6.7 9.2 1 10.5 1 10.5 6.7 9.2 1 10.5 1 10.5 CL = 50 pF 1** On products compliant to MIL-PRF-38535, this parameter is not production tested. ∗∗ On products compliant to MIL-PRF-38535, this parameter does not apply. POST OFFICE BOX 655303 SN74AHC244 TYP ∗ 4 SN54AHC244 • DALLAS, TEXAS 75265 1 UNIT ns ns ns ns ns ns ns SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHC244 PARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.5 V VOL(V) Quiet output, minimum dynamic VOL −0.2 V VOH(V) Quiet output, minimum dynamic VOH 4.8 V VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage 3.5 V 1.5 V TYP UNIT 8.6 pF NOTE 4: Characteristics are for surface-mount packages only. operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 5 SN54AHC244, SN74AHC244 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SCLS226J − OCTOBER 1995 − REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC 50% VCC 50% VCC Input 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC 50% VCC Input 50% VCC 0V tPLH tPHL VOH In-Phase Output 50% VCC tPHL Out-of-Phase Output 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) 50% VCC VOH 50% VCC VOL tPLZ ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 0V tPZL tPZH tPLH 50% VCC VCC Output Control VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-9678201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Purchase Samples 5962-9678201QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Purchase Samples 5962-9678201QSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Purchase Samples 5962-9678201SA ACTIVE CFP W 20 TBD Call TI Call TI Purchase Samples 5962-9678201VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Purchase Samples 1 TBD Call TI N / A for Pkg Type TBD Call TI Call TI Samples Not Available 5962-9678201VSA ACTIVE CFP W 20 SN74AHC244DBLE OBSOLETE SSOP DB 20 SN74AHC244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office Addendum-Page 1 Purchase Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-May-2010 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SN74AHC244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) SN74AHC244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74AHC244PWLE OBSOLETE TSSOP PW 20 Call TI Samples Not Available SN74AHC244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74AHC244PWRG3 PREVIEW TSSOP PW 20 2000 TBD SN74AHC244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) SNJ54AHC244FK ACTIVE LCCC FK 20 1 TBD SNJ54AHC244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Contact TI Distributor or Sales Office SNJ54AHC244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Contact TI Distributor or Sales Office TBD (1) CU NIPDAU N / A for Pkg Type Call TI Call TI Call TI Samples Not Available CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Contact TI Distributor or Sales Office Contact TI Distributor or Sales Office PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AHC244, SN54AHC244-SP, SN74AHC244 : • Catalog: SN74AHC244, SN54AHC244 • Automotive: SN74AHC244-Q1, SN74AHC244-Q1 • Enhanced Product: SN74AHC244-EP, SN74AHC244-EP • Military: SN54AHC244 • Space: SN54AHC244-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.2 7.5 2.5 12.0 16.0 Q1 SN74AHC244DBR SSOP DB 20 2000 330.0 16.4 SN74AHC244DGVR TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74AHC244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74AHC244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74AHC244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AHC244DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74AHC244DGVR TVSOP DGV 20 2000 346.0 346.0 29.0 SN74AHC244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74AHC244NSR SO NS 20 2000 346.0 346.0 41.0 SN74AHC244PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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