Quick Reference Guide High Speed Backplane Interconnect Solutions The emergence of faster data rates, and decreasing signal rise times, requires better performing, high speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provides system designers the flexibility they require to solve their specific performance challenges. Industry APPLICATIONS • Servers- blade, rack mount and mainframe stackable, carrier grade, core, edge and Metro Ethernet • Switches- Stackable, carrier grade, core, edge and Metro Ethernet • Routers- edge, core, enterprise class, carrier Ethernet, BRAS and Multi Service Edge www.te.com/products/2Piece-High-Speed • Optical- Transport: carrier grade optical, metro WDM, optical multi-service provisioning, long haul optical and enterprise LAN optical Ethernet TE Connectivity High Speed Backplane Connectors Signal Integrity at TE TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product. Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation, modeling, and system layout experts next to the customer. Modeling and Simulation At TE the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint via pattern performance prior to production. TE has the tools and expertise to get the right answer. nAnsys HFSS and CST Microwave Studio Full-wave 3D tools nBoth connector and footprint via pattern(s) analyzed before production nS-parameter and SPICE analysis nSophisticated ADS and MATLAB system analysis Test Capability With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon companies to provide active device measurements that can be invaluable to assure the successful implementation of a design. nAdvanced calibration techniques de-embed fixture nFrequency domain to 50 GHz nTime domain eye pattern/BERT to 12.5 Gbps nActive silicon testing – multiple vendors 2 – 10+ Gbps nBoth system and “connector only” boards Customer Support and Tools From test boards to simulation models, TE provides a library of tools that help you successfully implement your system. Requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models nAnsys HFSS and CST Microwave Studio Full-wave 3D tools nBoth connector and footprint via pattern(s) analyzed before production n S-parameter and SPICE analysis nSophisticated ADS and MATLAB system analysis nMeasurement based S-parameter connector models (64+ ports) nModeling based S-parameter connector models (64+ ports) nFootprint via pattern S-parameter and SPICE models nSPICE connector models nConnector evaluation test boards nSystem test boards www.te.com/products/2Piece-High-Speed TE Connectivity High Speed Backplane Connectors STRADA Whisper Connectors nUp to 40Gb/s performance nDensity up to 20 differential pairs per cm (52 DP per in) nAvailable in 4, 6, and 8 pairs/column, supporting cardpitch of 16.4 mm (.64"), 20.4 mm (.8"), and 25.4 mm (1") respectively nSee back panel for representative part numbers nWebsite: www.te.com/products/stradawhisper DATA RATE 3-6 GB/s 6-10 GB/s 10-15 GB/s 15-20 GB/s 20-25 GB/s 25+ GB/s STRADA Whisper Connector 52 DP/in 20 DP/cm IMPACT Connector 80 DP/in 32 DP/cm Z-PACK TinMan100 Ohm and 85 Ohm Connector 80 DP/in 32 DP/cm Z-PACK Slim UHD Common Speed Connector 36 DP/in 14 DP/cm Z-PACK Slim UHD High Speed Connector Z-PACK HM-Zd Connector Z-PACK HM-Zd Plus Connector 40 DP/in 16 DP/cm MULTIGIG RT Connector 57 DP/in 23 DP/cm Z-PACK HS3 Connector 50 DP/in 24 DP/cm www.te.com/products/2Piece-High-Speed 36 DP/in 14 DP/cm 40 DP/in 16 DP/cm TE Connectivity High Speed Backplane Connectors Z-PACK HM-Zd and Hm-Zd Plus Connectors nUp to 12.5 Gb/s performance nDensity up to 16 differential pairs per cm (40 DP per inch), in 25.4 mm (1") slot-pitch nAvailable in 2, 3 and 4 pairs/column, fitting 20.32 mm (0.8") slot-pitch for 2 and 3 pair version and 25.4 mm (1") slot-pitch for the 4 pair version nHM-Zd Plus provides enhanced signal integrity in a design backwards compatible with standard HM-Zd nAdvanced Differential Fabric (ADF) Connector specified in the PICMG 3.X Advanced TCA specifications n See back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" nWebsite: http://hmzd.te.com Z-PACK HS3 Connectors n Up to 6.25 Gb/s performance nDensity up to 40 high speed signal lines (20 DP) per cm board space, in 25.4 mm (1") slot-pitch nAvailable in 2 versions: six row and ten row, respectively fitting 20.32 mm (0.8") and 25.40 mm (1") slot-pitches nHigh-speed connector designed for both single ended and differential signals nSee back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" nWebsite: http://hs3.te.com MULTIGIG RT Connectors nUp to 6.25 Gb/s performance nDensity available in 2 versions per tier: 0.8" and 1", respectively fitting 20.32 mm (0.8") and 25.4 mm (1") slot-pitches nBackplane connector system specified in VME standards: VXS (VITA 41) & VPX (VITA 46) nPinless backplane connector utilizes a PCB construction which allows the connector system to have extreme flexibility. 100 Ohm differential, 50 Ohm single ended, open pin field, and power wafers can be mixed within one connector module. nSee back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" nWebsite: http://www.multigigrt.com www.te.com/products/2Piece-High-Speed TE Connectivity High Speed Backplane Connectors IMPACT Connectors nUp to 25 Gb/s performance nDensity up to 32 high speed differential pairs per cm (80 DP per inch) n100 Ohm nModular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns offered in increments of 2 columns nSee back panel for representative part numbers n Order catalog 7-1773458-1, "IMPACT Backplane Connector System" nWebsite: www.te.com/products/Impact Z-PACK TinMan 100 Ohm and 85 Ohm Connectors n Up to 12.5 Gb/s performance nDensity up to 14 high speed differential pairs per cm (80 DP per inch); 6-16 columns available nModular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm (.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch n85 ohm impedance version for QPCle and Intel QPI standards, and other 85 ohm system applications nSee back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" nWebsite: http://www.te.com/ZPackTinMan Z-PACK Slim UHD Connectors n2 versions nCS n (Common Speed) 8 Gb/s HS (High Speed) 12.5 Gb/s, scalable to 20 Gb/s nDensity (in a 2 DP/Column assignment): 55 lines per cm, 141 lines per inch (in a SE assignment) nLow profile — 12.5 mm wide nFlexible pin assignments nSee back panel for representative part numbers n Order catalog 1773095, "High Speed Backplane Connector" nWebsite: http://www.te.com/products/zpackuhd www.te.com/products/2Piece-High-Speed High Speed Backplane Interconnects Once you have determined which connector description best suits your needs, use the chart below to find a part number to search the TE website. Representative Part Numbers Connector Description STRADA Whisper Connectors Z-Pack HM-Zd Connectors and Z-Pack Hm-Zd Plus Connectors Z-Pack HS3 Connectors MULTIGIG RT Connectors IMPACT Connectors Z-Pack TinMan 100 Ohm and 85 Ohm Connectors Z-Pack Slim UHD Connectors Plug Receptacle 2149967-3 2149968-3 6469002-1 6469001-1 5120658-1 5120790-1 1410187-3 1410142-1 2007777-1 2007703-1 1934269-1 1934218-1 2042088-2 1982738-2 FOR MORE INFORMATION TE Technical Support USA: Canada: Mexico Latin/S. America: Germany: UK: France: Netherlands: China: Center +1 (800) 522-6752 +1 (905) 475-6222 +52 (0) 55-1106-0800 +54 (0) 11-4733-2200 +49 (0) 6251-133-1999 +44 (0) 800-267666 +33 (0) 1-3420-8686 +31 (0) 73-6246-999 +86 (0) 400-820-6015 Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined www.te.com/leadfree te.com © 2011 Tyco Electronics Corporation, a TE Connectivity Ltd. Company. All Rights Reserved. 1654263-1 CIS LUG FP 3M 08/2011 MULTIGIG RT, TE Connectivity, the TE connectivity (logo), Z-PACK and Z-PACK TinMan are trademarks. Other logos, product and/or company names might be trademarks of their respective owners. Advanced TCA is a trademark of PICMG-PCI Industrial Computer Mfg’s Group. Ansys HFSS is a trademark of Ansoft Corporation. CST Microwave Studio is a trademark of CST Computer Simulation Technology AG. IMPACT is a trademark of Molex Inc. MATLAB is a trademark of The MathWorks, Inc. VITA is a trademark of VMEbus International Trade Association. While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. The dimensions in this catalog are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications.