MICROCHIP TC2117

TC2117
800mA Fixed Low Dropout Positive Regulator
Features
General Description
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The TC2117 is a fixed, high accuracy (typically ±0.5%)
CMOS low dropout regulator. Designed specifically for
battery operated systems, the TC2117’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is
typically 80µA at full load (20 to 60 times lower than in
bipolar regulators).
Fixed Output Voltages: 1.8V, 2.5V, 3.0V, 3.3V
Very Low Dropout Voltage
Rated 800mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Over-Current and Over-Temperature Protection
Space Saving SOT-223 Package
Applications
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•
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5V to 3.3V Linear Regulator
Portable Computers
Instrumentation
Battery Operated Systems
Linear Post-Regulator for SMPS
Core Voltage Supply for FPGAs, PLDs, CPUs,
DSPs
TC2117 key features include ultra low noise, very low
dropout voltage (typically 450mV at full load), and fast
response to step changes in load. The TC2117 incorporates both over-temperature and over-current protection. The TC2117 is stable with an output capacitor
of only 1µF and has a maximum output current of
800mA. This device is available in 3-Pin SOT-223, and
3-Pin DDPAK packages.
Typical Application
Device Selection Table
VIN
Part Number
Junction
Temperature Range
Package
TC2117-xxVDB 3-Pin SOT-223
-40°C to +125°C
TC2117-xxVEB
-40°C to +125°C
3-Pin DDPAK
VIN
VOUT
VOUT
TC2117
C1
1µF
GND
Note: xx indicates output voltages.
Available Output Voltages: 1.8, 2.5, 3.0, 3.3.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
3-Pin SOT-223
3-Pin DDPAK
Front View
Front View
3
2
VOUT
1
Tab is VOUT
Tab is VOUT
VIN
GND
1
2
3
GND
VOUT
VIN
TC2117
TC2117
 2002 Microchip Technology Inc.
DS21665B-page 1
TC2117
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................... (VSS – 0.3) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V
Operating Temperature ............... -40°C < TJ < +125°C
Storage temperature .......................... -65°C to +150°C
TC2117 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1.5V (Note 1), IL = 100µA, CL = 3.3µF, TA = 25°C, unless otherwise specified. Boldface type
specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
VIN
Input Operating Voltage
IOUTMAX
Maximum Output Current
VOUT
Output Voltage
∆VOUT /∆T
VOUT Temperature Coefficient
Min
Typ
Max
Units
2.7
—
6.0
V
800
—
—
mA
VR – 2.5% VR – 0.5% VR + 2.5%
VR – 2% VR – 0.5% VR + 3%
—
40
—
V
Test Conditions
(Note 2)
VR > 2.5V
VR = 1.8V
ppm/°C (Note 3)
∆VOUT /∆VIN Line Regulation
—
0.007
0.35
%
∆VOUT /VOUT Load Regulation
-0.01
0.002
0
%/mA
(VR + 1V) VIN 6V
IL = 0.1mA to IOUTMAX (Note 4)
VIN - VOUT
Dropout Voltage
—
—
—
—
—
—
—
20
60
190
340
600
700
890
30
160
480
800
1300
1000
1400
mV
VR > 2.5V, IL = 100 µA
IL = 100 µA
IL = 300 µA
IL = 500 µA
IL = 800 µA
VR = 1.8V, IL = 500 µA
IL = 800 µA (Note 5)
IDD
Supply Current
—
80
130
µA
IL = 0
PSRR
Power Supply Rejection Ratio
—
55
—
dB
F < 120Hz
IOUTSC
Output Short Circuit Current
—
1200
—
mA
VOUT = 0V
∆VOUT /∆PD
Thermal Regulation
—
0.04
—
V/W
(Note 6)
eN
Output Noise
—
300
—
nV/√Hz IL = 100mA, F = 10kHz
Note 1: VR is the regulator output voltage setting.
2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX.
3: TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value,
measured at a 1.5V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature, and the thermal resistance from junction-to-air (i.e., TA, TJ , θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data
sheet for more details.
DS21665B-page 2
 2002 Microchip Technology Inc.
TC2117
2.0
PIN DESCRIPTIONS
The descriptions for the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(3-Pin SOT-223)
(3-Pin DDPAK)
PIN FUNCTION TABLE
Symbol
Description
1
GND
Connect this pin to the circuit ground.
2
VOUT
Regulated output voltage.
3
VIN
Unregulated Input voltage.
 2002 Microchip Technology Inc.
DS21665B-page 3
TC2117
3.0
DETAILED DESCRIPTION
3.2.2
The TC2117 is a precision, positive output LDO. Unlike
bipolar regulators, the TC2117 supply current does not
increase proportionally with load current. In addition,
VOUT remains stable and within regulation over the
entire 0mA to 800mA operating load range.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
VIN
C1
1µF
VOUT
TC2117
VOUT
C2
1µF
Battery
POWER DISSIPATION
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case actual power dissipation:
EQUATION 3-1:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
Where:
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Maximum regulator output voltage
ILOADMAX = Maximum output (load) current
GND
The
maximum
allowable
power
dissipation
(Equation 3-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die temperature (125°C) and the thermal resistance from
junction-to-air (θJA).
3.1
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance of 0.2Ω to 10Ω. A 1µF capacitor should be
connected from VIN to GND if there is more than 10
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.)
When operating from sources other than batteries, supply noise rejection and transient response can be
improved by increasing the value of the input and output
capacitors and employing passive filtering techniques.
3.2
3.2.1
Thermal Considerations
THERMAL SHUTDOWN
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to
approximately 150°C.
EQUATION 3-2:
– TAMAX
T
PDMAX = JMAX
θJA
Where all terms are previously defined.
Table 3-1 shows various values of θJA for the TC2117
mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper
foil.
TABLE 3-1:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN SOT-223 PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
Thermal
Resistance
2500 sq mm
2500 sq mm
2500 sq mm
45°C/W
1000 sq mm
2500 sq mm
2500 sq mm
45°C/W
225 sq mm
2500 sq mm
2500 sq mm
53°C/W
100 sq mm
2500 sq mm
2500 sq mm
59°C/W
1000 sq mm
1000 sq mm
1000 sq mm
52°C/W
1000 sq mm
0 sq mm
1000 sq mm
55°C/W
*Tab of device attached to topside copper.
DS21665B-page 4
 2002 Microchip Technology Inc.
TC2117
TABLE 3-2:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN DDPAK PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
Thermal
Resistance
(θJA)
2500 sq mm
2500 sq mm
2500 sq mm
25°C/W
1000 sq mm
2500 sq mm
2500 sq mm
27°C/W
125 sq mm
2500 sq mm
2500 sq mm
35°C/W
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
= [(5.0 x 1.05) – (3.3 x .995)] 400 x 10-3
= 786mW
Maximum allowable power dissipation:
PDMAX
=
(TJMAX – TAMAX)
θJA
=
(125 – 55)
59
=
1.186mW
*Tab of device attached to topside copper.
Equation 3-1 can be used in conjunction with
Equation 3-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 5.0V ± 5%
VOUTMIN = 3.3V ± 0.5%
ILOADMAX = 400mA
In this example, the TC2117 dissipates a maximum of
only 786mW; below the allowable limit of 1.186mW. In
a similar manner, Equation 3-1 and Equation 3-2 can
be used to calculate maximum current and/or input
voltage limits.
TJMAX = 125°C
TAMAX = 55°C
θJA = 59°C/W (SOT-223)
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
 2002 Microchip Technology Inc.
DS21665B-page 5
TC2117
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation vs. Temperature
10.0
LINE REGULATION (%)
CIN = 1µF
COUT = 1µF
V IN = 6.0V
VOUT = 5V
I OUT = 100mA
VIN = 3.5V to 6.0V
VOUT = 2.5V
IOUT = 0.1mA
0.018
0.016
NOISE (µV√HZ)
0.014
0.012
0.010
0.008
0.006
1.0
0.1
0.004
0.002
0.000
-40°C 0°C
25°C
70°C
85°C
0.0
0.01
125°C
TEMPERATURE (°C)
DROPOUT VOLTAGE (V)
120
IDD (µA)
105
VOUT = 5V
90
75
VOUT = 2.5V
60
45
30
0.000
70°C
85°C
125°C
-20
100
0.0080
0.0070
0.0060
0.0050
VOUT = 3V
0.0030
0.0020
0.0010
0°C
25°C
-40°C
125°C
ILOAD = 0.1mA
3.010
3.000
0°C
85°C
3.0V VOUT vs. Temperature
3.030
3.020
70°C
25°C
VOUT = 3V
70°C
TEMPERATURE (°C)
125°C
ILOAD = 300mA
2.990
2.980
ILOAD = 500mA
2.970
2.960
2.950
ILOAD = 800mA
2.940
2.930
0 100 200 300 400 500 600 700 800
Load Step Response
VIN = 4.0V
VOUT = 3.0V
CIN = 1µF Ceramic
COUT = 10µF Tantalum (0.25Ω ESR)
IOUT = 6mA to 600mA
VINDC = 4V
IINAC = 50mVp-p
VOUTDC = 3V
1mA to 800mA
0.0040
0.0100
-40°C
1000
ILOAD (mA)
Power Supply Rejection Ratio
-10
85°C
0.200
0.150
0.100
0.050
25°C
10
0.250
0
TEMPERATURE (°C)
PSRR (dB)
0.600
0.550
0.500
0.450
0.400
0.350
0.300
15
-40°C 0°C
1
0.0090
Dropout Voltage vs. ILOAD
VIN = VOUT +1V
IOUT = 0.1mA
135
0.01
0.0100
FREQUENCY (kHz)
IDD vs. Temperature
150
Load Regulation vs. Temperature
Output Noise vs. Frequency
0.020
LOAD REGULATION %/mA
Note:
VOUT (V)
4.0
-30
2.920
-40°C 0°C
25°C
70°C
85°C
125°C
TEMPERATURE (°C)
Line Step Response
IOUT = 300mA
VIN = 4.0V to 5.0V
COUT = 10µF Tantalum (0.25Ω ESR)
CIN = NA
50mV/DIV
-40
IOUT = 60mA
COUT = 10µF Tantalum
-50
VOUT
600mA/DIV
-60
-70
10
100
1k
10k
100k
50mV/DIV
1M
FREQUENCY (Hz)
DS21665B-page 6
 2002 Microchip Technology Inc.
TC2117
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking information not available at this time.
5.2
Taping Information
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
4000
13 in
3-Pin SOT-223
Component Taping Orientation for 3-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device
Marking
W
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
3-Pin DDPAK
 2002 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
24 mm
16 mm
750
13 in
DS21665B-page 7
TC2117
5.3
Packaging Dimensions
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
.041 (1.04)
.033 (0.84)
PIN 1
.091 (2.30) TYP.
.031 (0.80)
.024 (0.60)
.071
(1.80)
MAX.
.013 (0.33)
.009 (0.24)
10° MAX.
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
.036 (0.91) MIN.
Dimensions: inches (mm)
3-Pin DDPAK
.183 (4.65)
.170 (4.32)
.410 (10.41)
.385 (9.78)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.605 (15.37)
.549 (13.95)
.010 (0.25)
.000 (0.00)
.051 (1.30)
.049 (1.24)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.100 (2.54) TYP.
8° MAX.
Dimensions: inches (mm)
DS21665B-page 8
 2002 Microchip Technology Inc.
TC2117
NOTES:
 2002 Microchip Technology Inc.
DS21665B-page 9
TC2117
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21665B-page 10
 2002 Microchip Technology Inc.
TC2117
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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 2002 Microchip Technology Inc.
DS21665B-page 11
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Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
*DS21665B*
DS21665B-page 12
 2002 Microchip Technology Inc.