TI CD74AC280M96

CD54/74AC280,
CD54/74ACT280
Data sheet acquired from Harris Semiconductor
SCHS250A
9-Bit Odd/Even Parity Generator/Checker
August 1998 - Revised May 2000
Features
data inputs is HIGH. Odd parity is indicated (∑O output is
HIGH) when an odd number of data inputs is HIGH. Parity
checking for words larger than nine bits can be accomplished by tying the ∑E output to any input of an additional
’AC280, ’ACT280 parity checker.
• Buffered Inputs
• Typical Propagation Delay
- 10ns at VCC = 5V, TA = 25oC, CL = 50pF
• Exceeds 2kV ESD Protection per MIL-STD-883,
Method 3015
Ordering Information
PART
NUMBER
• SCR-Latchup-Resistant CMOS Process and Circuit
Design
TEMP.
RANGE (oC)
CD54AC280F3A
• Speed of Bipolar FAST™/AS/S with Significantly
Reduced Power Consumption
-55 to 125
14 Ld CERDIP
0 to 70oC, -40 to 85,
CD74AC280E
PACKAGE
14 Ld PDIP
-55 to 125
• Balanced Propagation Delays
0 to 70oC, -40 to 85,
-55 to 125
CD74AC280M
• AC Types Feature 1.5V to 5.5V Operation and
Balanced Noise Immunity at 30% of the Supply
CD54ACT280F3A
• ±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50Ω Transmission Lines
-55 to 125
14 Ld CERDIP
0 to 70oC, -40 to 85,
CD74ACT280E
14 Ld SOIC
14 Ld PDIP
-55 to 125
0 to 70oC, -40 to 85,
-55 to 125
CD74ACT280M
Description
14 Ld SOIC
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
The ’AC280 and ’ACT280 are 9-bit odd/even parity generator/checkers that utilize Advanced CMOS Logic technology.
Both even and odd parity outputs are available for checking
or generating parity for words up to nine bits long. Even parity is indicated (∑E output is HIGH) when an even number of
2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information.
Pinout
Functional Diagram
CD54AC280, CD54ACT280
(CERDIP)
CD74AC280, CD74ACT280
(PDIP, SOIC)
TOP VIEW
I0
I1
I6 1
I2
14 VCC
I7 2
13 I5
NC 3
12 I4
I8 4
11 I3
I3
10 I2
∑O 6
9 I1
GND 7
8 I0
9
10
5
11
I6
I7
I8
6
13
1
∑ ODD
1
2
4
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
Copyright © 2000, Texas Instruments Incorporated
∑ EVEN
12
I4
I5
∑E 5
8
GND = 7
VCC = 14
NC = 3
CD54/74AC280, CD54/74ACT280
F
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA
Thermal Resistance (Typical, Note 5)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
___
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
___
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Slew Rate, dt/dv
AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)
AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)
ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. For up to 4 outputs per device, add ±25mA for each additional output.
4. Unless otherwise specified, all voltages are referenced to ground.
5. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VIH
-
-
1.5
1.2
-
1.2
-
1.2
-
V
AC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
VIL
VOH
-
VIH or VIL
3
2.1
-
2.1
-
2.1
-
V
5.5
3.85
-
3.85
-
3.85
-
V
1.5
-
0.3
-
0.3
-
0.3
V
3
-
0.9
-
0.9
-
0.9
V
5.5
-
1.65
-
1.65
-
1.65
V
-0.05
1.5
1.4
-
1.4
-
1.4
-
V
-0.05
3
2.9
-
2.9
-
2.9
-
V
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-4
3
2.58
-
2.48
-
2.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
-
2
CD54/74AC280, CD54/74ACT280
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
PARAMETER
Low Level Output Voltage
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VOL
VIH or VIL
0.05
1.5
-
0.1
-
0.1
-
0.1
V
0.05
3
-
0.1
-
0.1
-
0.1
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
12
3
-
0.36
-
0.44
-
0.5
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
High Level Input Voltage
VIH
-
-
4.5 to
5.5
2
-
2
-
2
-
V
Low Level Input Voltage
VIL
-
-
4.5 to
5.5
-
0.8
-
0.8
-
0.8
V
High Level Output Voltage
VOH
VIH or VIL
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
Input Leakage Current
Quiescent Supply Current
MSI
ACT TYPES
Low Level Output Voltage
Input Leakage Current
Quiescent Supply Current
MSI
Additional Supply Current per
Input Pin TTL Inputs High
1 Unit Load
VOL
VIH or VIL
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
∆ICC
VCC
-2.1
-
4.5 to
5.5
-
2.4
-
2.8
-
3
mA
NOTES:
6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize
power dissipation.
7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC.
ACT Input Load Table
INPUT
UNIT LOAD
All
1.43
NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications
Table, e.g., 2.4mA max at 25oC.
3
CD54/74AC280, CD54/74ACT280
Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case)
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
tPLH, tPHL
1.5
-
-
239
-
-
263
ns
3.3
(Note 9)
7.5
-
26
7.3
-
29
ns
5
(Note 10)
5.4
-
19.1
5.3
-
21
ns
1.5
-
-
227
-
-
250
ns
3.3
7.2
-
25
7
-
28
ns
5
5.2
-
18.2
5
-
20
ns
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
115
-
-
115
-
pF
Propagation Delay,
Any Input to ∑O
tPLH, tPHL
5
(Note 10)
5.6
-
19.6
5.4
-
21.6
ns
Propagation Delay,
Any Input to ∑E
tPLH, tPHL
5
5.6
-
19.6
5.4
-
21.6
ns
Input Capacitance
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
115
-
-
115
-
pF
PARAMETER
AC TYPES
Propagation Delay,
Any Input to ∑O
Propagation Delay,
Any Input to ∑E
tPLH, tPHL
Input Capacitance
Power Dissipation Capacitance
ACT TYPES
Power Dissipation Capacitance
NOTES:
8. Limits tested 100%
9. 3.3V Min is at 3.6V, Max is at 3V.
10. 5V Min is at 5.5V, Max is at 4.5V.
11. CPD is used to determine the dynamic power consumption per package.
AC: PD = VCC2 fi (CPD + CL)
ACT: PD = VCC2 fi (CPD + CL) + VCC ∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
tr = 3ns
OUTPUT
tf = 3ns
RL (NOTE)
500Ω
INPUT
LEVEL
In
0V
VS
VS
10%
DUT
10%
tPHL
ΣO
OUTPUT
LOAD
tPLH
NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.
VS
VS
CL
50pF
0V
tPLH
ΣE
VS
tPHL
AC
ACT
VCC
3V
Input Switching Voltage, VS
0.5 VCC
1.5V
Output Switching Voltage, VS
0.5 VCC
0.5 VCC
Input Level
VS
0V
FIGURE 1.
FIGURE 2. PROPAGATION DELAY TIMES
4
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
CD54AC280F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD54ACT280F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD74AC280E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC280EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC280M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC280M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC280M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC280M96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC280ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC280MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT280EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT280M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280M96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT280MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74AC280M96
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
CD74ACT280M96
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74AC280M96
D
14
SITE 41
346.0
346.0
33.0
CD74ACT280M96
D
14
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2