TI SN74ALVC32D

SN74ALVC32
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCES108G – JULY 1997 – REVISED NOVEMBER 2004
FEATURES
•
•
•
•
•
D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
Operates From 1.65 V to 3.6 V
Max tpd of 2.8 ns at 3.3 V
±24-mA Output Drive at 3.3 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
DESCRIPTION/ORDERING INFORMATION
This quadruple 2-input positive-OR gate is designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVC32 performs the Boolean function Y = A ⋅ B or Y = A + B in positive logic.
ORDERING INFORMATION
PACKAGE (1)
TA
SOIC - D
-40°C to 85°C
SOP - NS
TSSOP - PW
TVSOP - DGV
(1)
ORDERABLE PART NUMBER
Tube
SN74ALVC32D
Tape and reel
SN74ALVC32DR
Tape and reel
SN74ALVC32NSR
Tube
SN74ALVC32PW
Tape and reel
SN74ALVC32PWR
Tape and reel
SN74ALVC32DGVR
TOP-SIDE MARKING
ALVC32
ALVC32
VA32
VA32
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
B
OUTPUT
Y
H
X
H
X
H
H
L
L
L
A
LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC)
A
Y
B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2004, Texas Instruments Incorporated
SN74ALVC32
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCES108G – JULY 1997 – REVISED NOVEMBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
VO
Output voltage range (2) (3)
-0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through VCC or GND
D package
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(2)
(3)
(4)
mA
-50
mA
±50
mA
±100
mA
86
DGV package
127
NS package
°C/W
76
PW package
(1)
V
-50
113
-65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
2
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
0
3.6
V
0
VCC
V
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
5
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74ALVC32
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCES108G – JULY 1997 – REVISED NOVEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = -100 µA
1.65 V to 3.6 V
1.65 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
IOH = -12 mA
(1)
V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
II
VI = VCC or GND
ICC
VI = VCC or GND,
IO = 0
One input at VCC - 0.6 V,
Other inputs at VCC or GND
UNIT
1.2
1.65 V to 3.6 V
IOL = 24 mA
Ci
MAX
IOL = 4 mA
IOL = 12 mA
∆ICC
TYP (1)
VCC - 0.2
IOH = -4 mA
VOH
VOL
MIN
2.7 V
0.4
3V
0.55
V
±5
µA
3.6 V
10
µA
3 V to 3.6 V
750
µA
3.6 V
VI = VCC or GND
3.3 V
4
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
MIN MAX
MIN
MAX
1
4.7
1
3.1
2.9
1
2.8
UNIT
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance per gate
TEST CONDITIONS
CL = 0,
f = 10 MHz
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
TYP
TYP
TYP
23
24
26
UNIT
pF
3
SN74ALVC32
QUADRUPLE 2-INPUT POSITIVE-OR GATE
www.ti.com
SCES108G – JULY 1997 – REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ALVC32D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DGVRG4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC32PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ALVC32DGVR
DGV
14
SITE 41
330
12
6.8
4.0
1.6
8
16
Q1
SN74ALVC32DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74ALVC32NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74ALVC32PWR
PW
14
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74ALVC32DGVR
DGV
14
SITE 41
346.0
346.0
29.0
SN74ALVC32DR
D
14
SITE 41
346.0
346.0
33.0
SN74ALVC32NSR
NS
14
SITE 41
346.0
346.0
33.0
SN74ALVC32PWR
PW
14
SITE 41
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265