SAMSUNG CIM10N121

201208
Chip Bead
For EMI Suppression
CIB/CIM10 Series (1608/ EIA 0603)
APPLICATION
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
FEATURES
RECOMMENDED LAND PATTERN
0.6~0.8mm
 Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or
reflow soldering
 Monolithic inorganic material construction for high reliability
 Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
0.6~0.8mm
0.6~0.8mm
0.6~0.8mm
DIMENSION
Type
10
Dimension [mm]
L
W
t
d
1.6±0.15 0.8±0.15 0.8±0.15
0.3±0.2
DESCRIPTION
Thickness
Impedance
DC Resistance
Rated Current
(mm)
(Ω)±[email protected]
(Ω) Max.
(mA) Max.
CIB10P100
0.8±0.15
10
0.05
1000
CIB10P220
0.8±0.15
22
0.05
1500
CIB10P260
0.8±0.15
26
0.08
1000
CIB10P300
0.8±0.15
30
0.08
1000
Part no.
CIB10P330
0.8±0.15
33
0.08
1000
CIM10U800
0.8±0.15
80
0.10
600
CIM10U121
0.8±0.15
120
0.15
500
CIM10U221
0.8±0.15
220
0.25
400
CIM10U241
0.8±0.15
240
0.25
400
CIM10U301
0.8±0.15
300
0.30
400
CIM10U471
0.8±0.15
470
0.35
300
CIM10U601
0.8±0.15
600
0.38
500
CIM10U102
0.8±0.15
1000
0.50
400
CIM10U202
0.8±0.15
2000(at 70MHz)
1.20
200
CIB10J300
0.8±0.15
30
0.10
1000
CIM10J400
0.8±0.15
40
0.12
600
CIM10J470
0.8±0.15
47
0.12
600
CIM10J600
0.8±0.15
60
0.12
600
CIM10J750
0.8±0.15
75
0.15
550
CIM10J800
0.8±0.15
80
0.15
550
CIM10J121
0.8±0.15
120
0.20
500
CIM10J151
0.8±0.15
150
0.20
400
CIM10J221
0.8±0.15
220
0.30
400
CIM10J241
0.8±0.15
240
0.30
400
Ver 201208
Thickness
Impedance
DC Resistance
Rated Current
(mm)
(Ω)±[email protected]
(Ω) Max.
(mA) Max.
CIM10J301
0.8±0.15
300
0.35
400
CIM10J471
0.8±0.15
470
0.35
300
CIM10J601
0.8±0.15
600
0.45
300
CIM10J751
0.8±0.15
750
0.50
300
CIM10J102
0.8±0.15
1000
0.60
250
CIM10J152
0.8±0.15
1500
0.70
250
Part no.
CIM10J252
0.8±0.15
2500
1.50
200
CIM10K152
0.8±0.15
1500
0.80
250
CIM10K202
0.8±0.15
2000
1.00
200
200
CIM10K252
0.8±0.15
2500
1.20
CIM10N700
0.8±0.15
70
0.30
500
CIM10N121
0.8±0.15
120
0.45
400
CIM10N241
0.8±0.15
240
0.60
300
CIM10F470
0.8±0.15
47
0.25
550
CIM10F600
0.8±0.15
60
0.25
550
CIM10F121
0.8±0.15
120
0.30
500
CIM10F331
0.8±0.15
330
0.58
400
CIM10F471
0.8±0.15
470
0.85
300
CHARACTERISTIC DATA
Ver 201208
Ver 201208
Ver 201208
PRODUCT IDENTIFICATION
CI
(1)
(1)
(3)
(5)
(6)
(7)
M
(2)
10 U
(3) (4)
121
(5)
N C
(6) (7)
Chip Beads
(2) M: Multi-layer type B:Mono-layer type
Dimension
(4) Material Code
Nominal impedance (121:120Ω, 202:2000Ω )
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
FLOW SOLDERING
PACKAGING
Packaging Style
Card Board Taping
Quantity(pcs/reel)
4000
■ NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.