SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTER SDAS156D – APRIL 1982 – REVISED AUGUST 2000 D D D D Synchronous Load Direct Overriding Clear Parallel-to-Serial Conversion Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages and Standard Plastic (N) DIP D, DB, OR N PACKAGE (TOP VIEW) SER A B C D CLK INH CLK GND description The SN74ALS166 parallel-load 8-bit shift register is compatible with most other TTL logic families. All inputs are buffered to lower the drive requirements. Input clamping diodes minimize switching transients and simplify system design. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC SH/LD H QH G F E CLR These parallel-in or serial-in, serial-out registers have a complexity of 77 equivalent gates on the chip. They feature gated clocks (CLK and CLK INH) inputs and an overriding clear (CLR) input. The parallel-in or serial-in modes are established by the shift/load (SH/LD) input. When high, SH/LD enables the serial data (SER) input and couples the eight flip-flops for serial shifting with each clock pulse. When low, the parallel (broadside) data (A–H) inputs are enabled and synchronous loading occurs on the next clock pulse. During parallel loading, serial data flow is inhibited. Clocking is accomplished on the low-to-high-level edge of the clock pulse through a two-input positive-NOR gate, permitting one input to be used as a clock-enable or clock-inhibit function. Holding either of the clock inputs high inhibits clocking; holding either low enables the other clock input. This allows the system clock to be free running and the register can be stopped on command with the clock input. CLK INH should be changed to the high level only when CLK is high. The buffered CLR overrides all other inputs, including CLK, and sets all flip-flops to zero. The SN74ALS166 is characterized for operation from 0°C to 70°C. FUNCTION TABLE INPUTS PARALLEL INTERNAL OUTPUTS OUTPUT QH CLR SH/LD CLK INH CLK SER A...H QA L X X X X X L L L H X L L X X QA0 QB0 QH0 QB H L L ↑ X a...h a b h H H L ↑ H X H QAn QGn H H L ↑ L X L QAn QGn H X H ↑ X X QA0 QB0 QH0 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTER SDAS156D – APRIL 1982 – REVISED AUGUST 2000 logic symbol† CLR 9 R 15 M1 [Shift] M2 [Load] SH/LD CLK INH CLK SER A B C D E F G H SRG8 6 ≥1 7 1 C3/1 1, 3D 2 2, 3D 3 2, 3D 4 5 10 11 12 14 13 QH † This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12. logic diagram (positive logic) SER 1 SH/LD CLR B 2 C 3 D 4 E 5 F G H 10 11 12 14 R 1A C1 1S R 1A C1 1S R 1A C1 1S R 1A C1 1S 15 9 7 CLK CLK INH 6 2 A R 1A C1 1S R 1A C1 1S R 1A C1 1S POST OFFICE BOX 655303 R 1A C1 1S • DALLAS, TEXAS 75265 13 QH SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTER SDAS156D – APRIL 1982 – REVISED AUGUST 2000 typical clear, shift, load, inhibit, and shift sequences CLK CLK INH CLR SER SH/LD Parallel Inputs A H B L C H D L E H F L G H H H QH Serial Shift Clear H Inhibit H L H L L H H Serial Shift Load absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Package thermal impedance, θJA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions VCC VIH Supply voltage VIL IOH Low-level input voltage IOL TA Low-level output current High-level input voltage MIN NOM MAX 4.5 5 5.5 2 High-level output current Operating free-air temperature 0 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT V V 0.8 V –0.4 mA 8 mA 70 °C 3 SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTER SDAS156D – APRIL 1982 – REVISED AUGUST 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS MIN VCC = 4.5 V, VCC = 4.5 V to 5.5 V, II = –18 mA IOH = –0.4 mA VOL VCC = 4 4.5 5V IOL = 4 mA IOL = 8 mA II IIH VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V IIL IO‡ VCC = 5.5 V, VCC = 5.5 V, VI = 0.4 V VO = 2.25 V TYP† MAX UNIT –1.5 V VCC–2 V 0.25 0.4 0.35 0.5 0.1 –30 V mA 20 µA –0.1 mA –112 mA ICC VCC = 5.5 V, See Note 2 14 24 mA † All typical values are at VCC = 5 V, TA = 25°C. ‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS. NOTE 2: With 4.5 V applied to SER and all other inputs, except the clock, grounded, ICC is measured after a clock transition from 0 V to 4.5 V. timing requirements over recommended operating free-air temperature range (unless otherwise noted) MIN fclock tw tsu Clock frequency Pulse duration Setup time before CLK↑ ↑ CLR low 9 CLK high 10 CLK low 10 SH/LD 16 Data UNIT 45 MHz ns ns 7 CLR inactive th MAX 11 Hold time, data after CLK↑ 3 ns switching characteristics over recommended operating conditions (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tPHL CLR QH tPLH tPHL CLK QH PARAMETER fmax MAX 4 9 14 2 7 12 2 9 13 45 † All typical values are at VCC = 5 V, TA = 25°C. 4 TYP† MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MHz ns ns SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTER SDAS156D – APRIL 1982 – REVISED AUGUST 2000 PARAMETER MEASUREMENT INFORMATION Test Point TEST TABLE FOR SYNCHRONOUS INPUTS From Output Under Test CL = 50 pF (see Note A) RL = 500 Ω DATA INPUT FOR TEST SH/LD OUTPUT TESTED (see Note B) H 0V QH at tn + 1 Serial input 4.5 V QH at tn + 1 LOAD CIRCUIT FOR OUTPUT UNDER TEST tw(clear) 3.5 V CLR (see Note C) CLK (see Note E) 1.3 V 1.3 V 0.3 V tn 1.3 V 1.3 V tn + 1 (see Note D) tn 1.3 V tn + 1 3.5 V 1.3 V 0.3 V tw(CLK) tsu th tsu 1.3 V 1.3 V th 3.5 Data Input (see Test Table) 1.3 V 1.3 V 0.3 V tPHL tPLH tPHL VOH Output QH VOL VOLTAGE WAVEFORMS NOTES: A. B. C. D. E. CL includes probe and jig capacitance. Propagation delay times (tPLH and tPHL) are measured at tn+1. Proper shifting of data is verified at tn+8 with a functional test. A clear pulse is applied prior to each test. tn = bit time before clocking transition, tn+1 = bit time after one clocking transition, and tn+8 = bit time after eight clocking transitions. The clock pulse has the following characteristics: tw(clock) ≤ 20 ns and PRR = 1 MHz. The clear pulse has the following characteristics: tw(clear) ≤ 20 ns. F. All pulse generators have the following characteristics: ZO ≈ 50 Ω; tr = tf = 2 ns. Duty cycle = 50% when testing fmax. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALS166D ACTIVE SOIC D 16 SN74ALS166DBR ACTIVE SSOP DB SN74ALS166DBRE4 ACTIVE SSOP SN74ALS166DBRG4 ACTIVE SN74ALS166DE4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS166NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS166NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS166NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ALS166DBR DB 16 SITE 41 330 16 8.2 6.6 2.5 12 16 Q1 SN74ALS166DR D 16 SITE 27 330 16 6.5 10.3 2.1 8 16 Q1 SN74ALS166NSR NS 16 SITE 41 330 16 8.2 10.5 2.5 12 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) SN74ALS166DBR DB 16 SITE 41 346.0 346.0 33.0 SN74ALS166DR D 16 SITE 27 342.9 336.6 28.58 SN74ALS166NSR NS 16 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 Height (mm) MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated