BAT30 Small signal Schottky diodes Features BAT30JFILM (Single) ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ Extremely fast switching ■ Surface mount device ■ Low capacitance diode SOD-323 BAT30KFILM (Single) SOD-523 BAT30LFILM (Single) SOD-923 Description The BAT30 series uses 30 V Schottky barrier diodes encapsulated in a wide range of packages such as SOD-323, SOD-523, SOD-923, SOT-23, SOT-323, or SOT-666. This device is specially suited for switching mode applications needing low forward voltage drop diodes. BAT30FILM (Single) BAT30AFILM (Common anode) SOT-23 BAT30SFILM (Series) BAT30CFILM (Common cathode) BAT30WFILM (Single) SOT-323 BAT30CWFILM (Common cathode) BAT30AWFILM (Common anode) BAT30SWFILM (Series) Table 1. Device summary Symbol Value IF 300 mA VRRM 30 V C(typ) 14 pF Tj (max) 150 °C October 2009 BAT30-07P6FILM (2 parallel diodes) SOT-666 BAT30-09P6FILM (2 opposite diodes) Configurations in top view Doc ID 12564 Rev 3 1/14 www.st.com 14 Characteristics 1 BAT30 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 30 V Continuous forward current 300 mA 1 A -65 to +150 °C 150 °C 260 °C Value Unit IFSM Surge non repetitive forward current Tstg Storage temperature range tp = 10 ms Sinusoidal Tj Maximum operating junction temperature TL Maximum soldering temperature (1) 1. Pulse test: tp = 5 ms, δ < 2 % Table 3. Thermal parameters Symbol Rth(j-a) Parameter Junction to ambient(1) SOT-23 500 SOT-323, SOD-323, 550 SOD-523, SOT-666 600 SOD-923 900 °C/W 1. On epoxy printed circuit board with recommended pad layout Table 4. Symbol Static electrical characteristics Parameter Test conditions Min. Typ. Max. VR = 5 V - - 0.5 VR = 10 V - - 1 VR = 25 V - 0.65 3 VR = 30 V - - 5 - 7 20 - 18 50 IF = 0.1 mA - - 240 IF = 1 mA - - 300 IF = 10 mA - - 375 Tj = 25° C IF = 30 mA - - 430 IF = 100 mA - - 500 IF = 200 mA - - 580 IF = 300 mA - 530 - Tj = 25 °C IR(1) Reverse leakage current Tj = 70 °C Tj = 85 °C VF(2) Forward voltage drop VR = 10 V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % 2/14 Doc ID 12564 Rev 3 Unit µA mV BAT30 Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter C Diode capacitance Figure 1. Min. Typ Max. VR = 0 V, F = 1 MHz - 22 - VR = 1 V, F = 1 MHz - 14 - VR = 10 V, F = 1 MHz - 6 - Power dissipation versus average forward current Figure 2. Unit pF Average forward current versus ambient temperature (δ = 1) IF(AV) (A) P (W) 0.175 0.35 δ=0.05 0.150 δ=0.1 δ=1 δ=0.5 δ=0.2 0.30 0.125 0.25 0.100 0.20 0.075 0.15 0.050 0.10 T 0.025 IF(AV) (A) 0.000 0.00 δ=tp/T T 0.05 tp δ=tp/T Tamb (° C) tp 0.00 0.05 Figure 3. 0.10 0.15 0.20 0.25 0.30 0.35 Relative variation of thermal impedance junction to ambient versus pulse duration 0 25 Figure 4. 50 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a) /Rth(j-a) Zth(j-a) /Rth(j-a) 1.E+00 1.E+00 Single pulse SOT-23 Single pulse SOT-323/SOD-323 Epoxy printed board FR4 Copper surface = 2.25 mm2 Coppr thickness = 35 µm 1.E-01 1.E-01 1.E-02 Alumine substrate 10 x 8 x 0.5 mm 1.E-02 1.E-03 tP(s) tP(s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E-03 1.E-03 Doc ID 12564 Rev 3 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/14 Characteristics Figure 5. BAT30 Relative variation of thermal impedance junction to ambient versus pulse duration Figure 6. Zth(j-a) /Rth(j-a) Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a) /Rth(j-a) 1.E+00 1.E+00 Single pulse SOT-666 Single pulse SOD-923 Epoxy printed board FR4 Coppr thickness = 35 µm 1.E-01 1.E-01 tP(s) tP(s) 1.E-02 1.E-03 1.E-02 Figure 7. 1.E-01 1.E+00 1.E+01 Relative variation of thermal impedance junction to ambient versus pulse duration 1.E-02 1.E-03 Figure 8. Zth(j-a) /Rth(j-a) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Thermal resistance junction to ambient versus copper surface under each lead (SOD-923) Rth(j-a) (°C/W) 1.E+00 900 Single pulse SOD-523 Epoxy printed board FR4 Copper thichness = 35 µm 800 Epoxy printed board FR4 Coppr thickness = 35 µm 700 1.E-01 600 500 400 300 1.E-02 200 100 tP(s) SCU(cm²) 0 1.E-03 1.E-03 1.E-02 Figure 9. 1.E-01 1.E+00 1.E+01 Thermal resistance junction to ambient versus copper surface under each lead (SOD-323) Rth(j-a) (°C/W) 0.0 Epoxy printed board FR4 Copper thichness = 35 µm 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 10. Leakage current versus reverse applied voltage (typical values) 1.E+04 600 0.2 IR (µA) Tj=150°C 1.E+03 Tj=125°C 500 1.E+02 Tj=85°C 1.E+01 400 1.E+00 Tj=25°C 300 1.E-01 200 1.E-02 0 4/14 VR (V) SCU(mm²) 5 10 15 20 25 30 35 40 45 50 0 Doc ID 12564 Rev 3 5 10 15 20 25 30 BAT30 Characteristics Figure 11. Relative variation of reverse leakage current versus junction temperature (typical values) Figure 12. Junction capacitance versus reverse applied voltage (typical values) IR[T j] / IR[T j=25°C] C(pF) 1.E+04 100 VR=30 V F=1 MHz VOSC=30 mVRMS Tj=25 °C 1.E+03 1.E+02 1.E+01 10 1.E+00 1.E-01 Tj(°C) VR(V) 1 1.E-02 -40 -20 0 20 40 60 80 100 120 140 160 Figure 13. Forward voltage drop versus forward current (typical values) 1.E+01 1 10 Figure 14. Forward voltage drop versus forward current (typical values) IFM(A) IFM(A) 1.E+01 1.E+00 1.E-01 100 1.E+00 Tj=150 °C 1.E-01 Tj=125 °C Tj=25 °C Tj=85 °C 1.E-02 1.E-02 Tj=-40 °C 1.E-03 1.E-03 VFM(V) VFM(V) 1.E-04 0.0 1.E-04 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 0.0 Doc ID 12564 Rev 3 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 5/14 Ordering information scheme 2 BAT30 Ordering information scheme Figure 15. Ordering information scheme BAT30 Signal Schottky diodes VRRM = 30 V Configuration Blank = Single diode A = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 K = SOD-523 L = SOD-923 P6 = SOT-666 W = SOT-323 Packing FILM = Tape and reel 6/14 Doc ID 12564 Rev 3 xx xx FILM BAT30 3 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SOD-323 dimensions Dimensions Ref. H Millimeters Inches A1 Min. Max. Min. Max. A - 1.17 - 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 b E A D c Q1 L Figure 16. SOD-323 footprint (dimensions in mm) 3.20 0.30 1.06 1.08 Doc ID 12564 Rev 3 1.06 7/14 Package information Table 7. BAT30 SOD-523 dimensions Dimensions E Ref. 0.15 M C A B E1 Millimeters B D 2xb 0.20 M C A B A Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.60 0.70 0.020 0.024 0.028 E 1.50 1.60 1.70 0.059 0.063 0.067 E1 1.10 1.20 1.30 0.043 0.047 0.051 D 0.70 0.80 0.90 0.028 0.031 0.035 b 0.25 - 0.35 0.010 - 0.014 c 0.07 - 0.20 0.003 - 0.008 L 0.15 0.20 0.25 0.006 0.008 0.010 L1 0.05 - 0.20 0.002 - 0.008 8° R0.1 A c SEATING PLANE C 7° L L1 Figure 17. SOD-523 footprint (dimensions in mm) 0.7 0.3 2 8/14 Doc ID 12564 Rev 3 BAT30 Package information Table 8. SOD-923 dimensions Dimensions L Ref. Millimeters Min. Typ. A C A b Max. Inches Min. Typ. 0.40 Max. 0.016 b 0.25 0.30 0.35 0.010 0.012 0.014 c 0.08 0.145 0.21 0.003 0.006 0.008 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 E1 0.75 0.825 0.90 0.030 0.032 0.035 L - - 0.20 - - 0.008 D E1 E Figure 18. SOD-923 footprint (dimensions in mm) 0.37 0.34 0.58 1.32 Doc ID 12564 Rev 3 9/14 Package information Table 9. BAT30 SOT-23 dimensions Dimensions Ref. Millimeters A Inches Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 E e B D e1 S A1 L c H L 0.6 typ. S 0.35 0.65 Figure 19. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 10/14 3.25 Doc ID 12564 Rev 3 0.024 typ. 0.014 0.026 BAT30 Package information Table 10. SOT-323 dimensions Dimensions Ref. A E e Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.8 - 1.1 0.031 - 0.043 A1 0.0 - 0.1 0.0 - 0.004 b 0.25 - 0.4 0.010 - 0.016 c 0.1 - 0.26 0.004 - 0.010 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 e - 0.65 - - 0.026 - H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 q 0 - 30° 0 - 30° D b A1 c θ L H Figure 20. SOT-323 footprint (dimensions in mm) 0.95 1.0 0.8 Doc ID 12564 Rev 3 2.9 0.50 11/14 Package information BAT30 Table 11. SOT-666 dimensions Dimensions b1 Ref. Millimeters Inches L1 L3 Min. Typ. A 0.45 - A3 0.08 b Max. Min. Typ. Max. 0.60 0.018 - 0.024 - 0.18 0.003 - 0.007 0.17 - 0.34 0.007 - 0.013 b1 0.19 0.27 D 1.50 - 1.70 0.059 - 0.067 E 1.50 - 1.70 0.059 - 0.067 E1 1.10 - 1.30 0.043 - 0.051 e - 0.50 - - 0.020 - L1 - 0.19 - - 0.007 - L2 0.10 L3 - b D E1 0.34 0.007 0.011 0.013 A L2 E A3 0.30 0.004 0.012 e 0.10 Figure 21. SOT-666 footprint (dimensions in mm) 0.50 0.62 0.99 0.30 12/14 Doc ID 12564 Rev 3 2.60 - - 0.004 - BAT30 4 Ordering information Ordering information Table 12. 5 Ordering information Order code Marking Package Weight Base qty Packing mode BAT30-07P6FILM P3 SOT-666 Parallel 2.9 mg 5000 Tape and reel BAT30-09P6FILM Q3 SOT-666 Opposite 2.9 mg 5000 Tape and reel BAT30AFILM A30 SOT-23 Common anode 10 mg 3000 Tape and reel BAT30AWFILM A30 SOT-323 Common anode 6 mg 3000 Tape and reel BAT30CFILM C30 SOT-23 Common cathode 10 mg 3000 Tape and reel BAT30CWFILM C30 SOT-323 Common cathode 6 mg 3000 Tape and reel BAT30FILM B30 SOT-23 Single 10 mg 3000 Tape and reel BAT30JFILM 30 SOD-323 Single 5 mg 3000 Tape and reel BAT30KFILM 30 SOD-523 Single 1.4 mg 3000 Tape and reel BAT30LFILM 31 SOD-923 Single 0.56 mg 10000 Tape and reel BAT30SFILM S30 SOT-23 Serial 10 mg 3000 Tape and reel BAT30SWFILM S30 SOT-323 Serial 6 mg 3000 Tape and reel BAT30WFILM B30 SOT-323 Single 6 mg 3000 Tape and reel Revision history Table 13. Document revision history Date Revision Changes 24-Jul-2006 1 First issue 08-Jul-2009 2 Added SOD-923 package. Table 12 sorted on alphabetic sequence of order code. Updated ECOPACK statement. 13-Oct-2009 3 Updated Table 7 quote “L1” from 0.10 to 0.05. Doc ID 12564 Rev 3 13/14 BAT30 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 Doc ID 12564 Rev 3