www.ti.com SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION SLLS697 – DECEMBER 2005 FEATURES • • • • • • • D, DB, DW, OR PW PACKAGE (TOP VIEW) Operate With 3-V to 5.5-V VCC Supply Operate up to 1 Mbit/s Low Supply Current . . . 300 µA Typ External Capacitors . . . 4 × 0.1 µF Accept 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection for RS-232 Pins – ±15-kV Human-Body Model (HBM) – ±15-kV IEC 61000-4-2 Air-Gap Discharge – ±8-kV IEC 61000-4-2 Contact Discharge C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ORDERING INFORMATION The SN65C3232E and SN75C3232E consist of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). These devices provide the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 14 V/µs to 150 V/µs. ORDERING INFORMATION PACKAGE (1) TA SOIC – D –40°C to 85°C SOIC – DW SSOP – DB TSSOP – PW SOIC – D 0°C to 70°C SOIC – DW SSOP – DB TSSOP – PW (1) ORDERABLE PART NUMBER Tube of 40 SN65C3232ED Reel of 2500 SN65C3232EDR Tube of 40 SN65C3232EDW Reel of 2000 SN65C3232EDWR Reel of 2000 SN65C3232EDBR Tube of 90 SN65C3232EPW Reel of 2000 SN65C3232EPWR Tube of 40 SN75C3232ED Reel of 2500 SN75C3232EDR Tube of 40 SN75C3232EDW Reel of 2000 SN75C3232EDWR Reel of 2000 SN75C3232EDBR Tube of 90 SN75C3232EPW Reel of 2000 SN75C3232EPWR TOP-SIDE MARKING 65C3232 65C3232 65C3232 CB3232 75C3232 75C3232 75C3232 CA3232 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS697 – DECEMBER 2005 Table 1. 1-Mbit/s RS-232 Parts TEMPERATURE RANGE NO. OF DRIVERS NO. OF RECEIVERS ESD SUPPLY VCC (V) FEATURE PIN/PACKAGE SN65C3221E 1 1 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN65C3232E 2 2 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP MAX3227I 1 1 ±8-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown plus, ready signal 16-pin SSOP SN65C3221 1 1 ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN65C3223 2 2 ±15-kV HBM 3.3 or 5 Auto powerdown, enable signal 20-pin SOIC, SSOP, TSSOP SN65C3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP SN65C3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP SN65C3238 5 3 ±15-kV HBM 3.3 or 5 Auto powerdown plus 28-pin SOIC, SSOP, TSSOP SN65C3243 3 5 ±15-kV HBM 3.3 or 5 Auto powerdown 28-pin SOIC, SSOP, TSSOP SN75C3221E 1 1 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN75C3232E 2 2 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP MAX3227C 1 1 ±8-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown plus, ready signal 16-pin SSOP SN75C3221 1 1 ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN75C3223 2 2 ±15-kV HBM 3.5 or 5 Auto powerdown, enable signal 20-pin SOIC, SSOP, TSSOP SN75C3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP SN75C3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP SN75C3238 5 3 ±15-kV HBM 3.3 or 5 Auto powerdown plus 28-pin SOIC, SSOP, TSSOP SN75C3243 3 5 ±15-kV HBM 3.3 or 5 Auto powerdown 28-pin SOIC, SSOP, TSSOP PART NO. –40°C to 85°C 0°C to 70°C 2 www.ti.com SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION SLLS697 – DECEMBER 2005 FUNCTION TABLES xxx EACH DRIVER (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 5 k 9 8 ROUT2 RIN2 5 k 3 SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS697 – DECEMBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative output supply voltage V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA range (2) Package thermal impedance (3) (4) Operating virtual junction temperature Storage temperature range (4) 6 Receivers –25 25 Receivers Tstg (2) (3) –0.3 Drivers TJ (1) Drivers –13.2 13.2 –0.3 VCC + 0.3 D package 82 DB package 46 DW package 57 PW package 108 –65 UNIT V V °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC = 3.3 V Supply voltage VCC = 5 V Driver high-level input voltage VIL Driver low-level input voltage DIN Driver input voltage DIN VI TA (1) DIN VCC = 3.3 V VIH NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 VCC = 5 V V 2.4 0.8 0 5.5 –25 25 SN65C3232E –40 85 SN75C3232E 0 70 Receiver input voltage Operating free-air temperature MIN V V °C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4). Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER ICC (1) (2) 4 Supply current TEST CONDITIONS No load, VCC = 3.3 V or 5 V MIN TYP (2) MAX 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS697 – DECEMBER 2005 DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.5 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current ro Output resistance (1) (2) (3) MAX V V ±0.01 ±1 µA µA ±0.01 ±1 VCC = 3.6 V, VO = 0 V ±35 ±60 VCC = 5.5 V, VO = 0 V ±35 ±90 VCC, V+, and V– = 0 V, VO = ±2 V 300 UNIT mA Ω 10M Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4) . All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER MIN TYP (2) MAX UNIT TEST CONDITIONS CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 3.5 V to 5.5 V 1000 Maximum data rate (see Figure 1) RL = 3 kΩ, One DOUT switching tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V (1) (2) (3) kbit/s 300 14 ns 150 V/µs Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TERMINAL NAME NO. DOUT 7, 14 TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2 Air-Gap Discharge ±15 IEC 61000-4-2 Contact Discharge ±8 UNIT kV 5 SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS697 – DECEMBER 2005 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP (2) VCC – 0.6 VCC – 0.1 MAX UNIT V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 V V V 0.3 VI = ±3 V to ±25 V 3 5 V 7 kΩ Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tsk(p) Pulse skew (3) (1) (2) (3) CL = 150 pF TYP (2) UNIT 300 ns 300 ns 300 ns Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TERMINAL NAME NO. RIN 8, 13 6 TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2 Air-Gap Discharge ±15 IEC 61000-4-2 Contact Discharge ±8 UNIT kV www.ti.com SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION SLLS697 – DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) Output tTLH 3V −3 V TEST CIRCUIT SR(tr) t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 7 SN65C3232E,, SN75C3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-MBIT/S LINE DRIVERS/RECEIVERS WITH ±15-kV IEC ESD PROTECTION SLLS697 – DECEMBER 2005 APPLICATION INFORMATION 1 − 16 + CBYPASS = 0.1 µF − + C1 VCC C1+ 2 V+ + C3 GND 15 − 14 3 DOUT1 C1− 13 4 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 V− − 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ VCC vs CAPACITOR VALUES A. VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF C3 can be connected to VCC or GND. Figure 4. Typical Operating Circuit and Capacitor Values 8 www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65C3232ED ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDW ACTIVE SOIC DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3232EPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232ED ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDE4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDW ACTIVE SOIC DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3232EPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 40 40 40 The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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