DCPL-WB-00D3 Wide-band, dual-path directional coupler with ISO port Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range: – 824 MHz-2170 MHz ■ Low insertion loss (< 0.2 dB) ■ High directivity (> 20 dB) ■ High ESD ruggedness ■ Lead-free CSP package ■ Small footprint: 1670 x 1440 µm ■ Very low profile (< 650 µm thickness) Lead-free Flip Chip (8 bumps) Figure 1. Pin configuration (bump view) A3 High RF performance ■ RF module size reduction B3 IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Applications Multi-band equipment such as: ■ Power amplifier module ■ Front end module ■ GSM/WCDMA mobile phone B1 HB Path C3 Complies with the following standards: ■ A1 LB Path Benefits ■ A2 C2 C1 Description The DCPL-WB-00D3 is a wide-band, dual-path directional coupler designed to measure cell phone transmission output power in GSM/WCDMA applications. This dual path CPL has been customized for wide-band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA band I) with less than 0.2 dB insertion losses in the transmission bandwidth (824 MHz 1980 MHz). This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled and isolated ports.The DCPL-WB-00-D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. April 2011 Doc ID 17967 Rev 1 1/11 www.st.com 11 Characteristics 1 DCPL-WB-00D3 Characteristics Table 1. Device pin configuration Bump Name A1 Lbin LB coupler RF input A2 GND RF ground A3 Lbout LB coupler RF output B1 CPLD Coupler port B3 ISO Isolated port C1 Hbin HB coupler RF input C2 GND RF ground C3 Hbout HB coupler output Table 2. Description Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN VESD (IEC) Input Power RFIN (CW mode) ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω) LBIN, LBOUT, HBIN, HBOUT, air discharge LBIN, LBOUT, HBIN, HBOUT, contact discharge Machine model, JESD 22-A115-A, all I/O VESD (CDM) Charge device model, JESD 22-C101-C, all I/O TOP Table 3. Max. 35 VESD (HBM) Human body model, JESD 22-A114F, all I/O VESD (MM) Typ. Operating temperature dBm ±15 ±8 kV 2 kV 100 V 500 V -30 +85 °C Electrical characteristics - impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. Max. Nominal output impedance (LB and HB paths) 50 Ω Nominal input impedance (LB and HB paths) 50 Ω ZCPL Nominal coupled port impedance 50 Ω ZISO Nominal isolated port impedance 50 Ω ZOUT ZIN 2/11 Typ. Doc ID 17967 Rev 1 DCPL-WB-00D3 Characteristics Table 4. Electrical characteristics - LB path RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. f Frequency range (bandwidth) 824 ILLB LB path insertion loss From 824 MHz to 960 MHz RLLB LB path return loss From 824 MHz to 960 MHz 15 CPLDLB LB path coupling factor From 824 MHz to 915 MHz 32 RippleLB Coupling ripple in LB (824 to 849 MHz) (880 to 915 MHz) DIRLB Table 5. Typ. From 824 MHz to 915 MHz LB coupler directivity 0.1 Max. 960 MHz 0.2 dB dB 37 dB 0.5 dB 20 dB Electrical characteristics - HB path RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. f Frequency range (bandwidth) 1710 ILHB HB path insertion loss From 1710 MHz to 2170 MHz RLHB HB path return loss From 1710 MHz to 2170 MHz 15 From 1710 MHz to 1980 MHz 29 CPLDHB HB path coupling factor RippleH Coupling ripple in HB (1710 to 1785 MHz) (1850 to 1910 MHz) (1920 to 1980 MHz) HB coupler directivity From 1710 MHz to 1980 MHz B DIRHB Typ. Doc ID 17967 Rev 1 0.1 20 Max. 1980 MHz 0.2 dB dB 34 dB 0.5 dB dB 3/11 Characteristics 1.1 DCPL-WB-00D3 RF measurement (on reference evaluation board) Measurements done on reference evaluation board under 50 Ω, de-embedding at DCPL-WB-00D3 bumps. Figure 2. Low band path insertion loss -0.00 IL dB -0.05 -0.10 -0.15 -0.20 F(Hz) -0.25 7.5E8 Figure 3. 8.0E8 8.5E8 9.0E8 9.5E8 1.0E9 High band path insertion loss -0.00 IL dB -0.05 -0.10 -0.15 -0.20 F(Hz) -0.25 1.5E9 Figure 4. 1.7E9 1.9E9 2.1E9 2.3E9 2.5E9 Low band path coupling factor CPLD dB -31 -32 -33 -34 -35 -36 -37 F(Hz) -38 7.5E8 4/11 8.0E8 8.5E8 Doc ID 17967 Rev 1 9.0E8 9.5E8 1.0E9 DCPL-WB-00D3 Figure 5. Characteristics High band path coupling factor CPLD -28 dB -29 -30 -31 -32 -33 -34 F(Hz) -35 1.5E9 Figure 6. 1.7E9 1.9E9 2.1E9 2.3E9 2.5E9 Low band path directivity 30 DIR dB 28 26 24 22 F(Hz) 20 0.75 Figure 7. 0.80 0.85 0.90 0.95 1.00 High band path directivity 30 DIR dB 28 26 24 22 F(Hz) 20 1.5 1.7 1.9 Doc ID 17967 Rev 1 2.1 2.3 2.5 5/11 Characteristics Figure 8. DCPL-WB-00D3 Demo board description - layer 1 pad diameter 220um Figure 9. Solder mask 1 + layer 1 Solder mask diameter >300µm (320µm) 6/11 Doc ID 17967 Rev 1 DCPL-WB-00D3 2 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme DCPL – WB – 00 – D3 Dual high directivity coupler Wide band Version Pitch D3 = bump diameter = 255 µm Doc ID 17967 Rev 1 7/11 Package information 3 DCPL-WB-00D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. Package dimensions GND LB in A3 A2 A1 GND LB in A3 A2 A1 B3 HB Path C3 C2 HB out GND B1 CPLD LB Path ISO B1 CPLD B3 LB out 517µm LB out LB Path ISO 1.44mm +/- 50µm Ø255µm +/-40µm HB Path C1 HB in C3 C2 HB out GND 1.67mm +/- 50µm C1 HB in 630µm +/-60µm 632 µm Figure 12. Footprint Copper pad diameter: 220 µm recommended Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended 8/11 Figure 13. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Doc ID 17967 Rev 1 x x z y ww DCPL-WB-00D3 Package information Figure 14. Flip-Chip tape and reel specifications 4.0 ± 0.1 Ø 1.50 ± 0.10 1.75 ± 0.1 2.0 ± 0.05 0.73 ± 0.05 All dimensions in mm Note: 3.5 ±- 0.05 1.77± 0.05 8.0 +0.3 -0.10 0.20 ± 0.02 1.54 ± 0.05 2.0 ± 0.1 User direction of unreeling More packing information is available in the application notes: AN2348: “400 µm Flip-Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Doc ID 17967 Rev 1 9/11 Ordering information 4 Ordering information Table 6. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode DCPL-WB-00D3 RS Flip Chip 2.5 mg 5000 Tape and reel 7” Revision history Table 7. 10/11 DCPL-WB-00D3 Document revision history Date Revision 14-Apr-2010 1 Changes Initial release Doc ID 17967 Rev 1 DCPL-WB-00D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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