DCPL-WB-02D3 Wide-band, dual-path directional coupler with integrated 50 ohm loaded isolated port Datasheet − production data Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range: – 2400 MHz-5850 MHz ■ Low insertion loss ■ High ESD ruggedness ■ Lead-free CSP ■ Small footprint: 1670 x 1440 µm ■ Very low profile (< 600 µm after reflow) Flip Chip (7 bumps) Figure 1. Benefits ■ High RF performance ■ RF module size reduction Pin configuration (bump view) 3 2 1 LB out GND LB in A CPLD B1 B HB in C 50 Ω LB Path HB Path Applications HB out Multi-band equipment such as: ■ Power amplifier module ■ Front end module ■ WLAN GND C2 Description The DCPL-WB-02D3 is a wide-band, dual-path directional coupler designed to measure transmission output power in WLAN applications. This dual path CPL has been customized for wide-band operating frequencies (2G/5G WLAN) with low insertion losses in the transmission bandwidth (2400 MHz - 5850 MHz). This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled ports. Isolated port is loaded with an integrated 50 Ω resistor. The DCPL-WB-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. June 2012 This is information on a product in full production. Doc ID 023285 Rev 1 1/8 www.st.com 8 Characteristics 1 DCPL-WB-02D3 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Input Power RFIN (CW mode) Machine model, JESD 22-A115-A, all I/O VESD (CDM) Charge device model, JESD 22-C101-C, all I/O TOP Table 2. Max. 25 VESD (HBM) Human body model, JESD 22-A114F, all I/O VESD (MM) Typ. Operating temperature dBm 2 kV 100 V 500 V -30 +85 °C Electrical characteristics - impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. ZOUT ZIN ZCPL 2/8 Typ. Max. Nominal output impedance (LB and HB paths) 50 Ω Nominal input impedance (LB and HB paths) 50 Ω Nominal coupled port impedance 50 Ω Doc ID 023285 Rev 1 DCPL-WB-02D3 Characteristics Table 3. Electrical characteristics - LB WLAN path RF performance (Tamb = 25 °C) Value Symbol f Parameter Test condition Frequency range (bandwidth) Unit Min. Typ. Max. 2400 2450 2500 MHz 0.2 dB ILLB LB path insertion loss From 2400 MHz to 2500 MHz RLLB LB path return loss (IN, OUT pins) From 2400 MHz to 2500 MHz 15 CPLDLB LB path coupling factor at 2.45 GHz 17 RippleLB Coupling ripple in LB From 2400 MHz to 2500 MHz Table 4. dB 18 19 dB 0.5 dB Electrical characteristics - HB WLAN path RF performance (Tamb = 25 °C) Value Symbol f Parameter Test condition Frequency range (bandwidth) Unit Min. Typ. Max. 4900 5375 5850 MHz 0.5 dB ILHB HB path insertion loss From 4900 MHz to 5850 MHz RLHB HB path return loss (IN, OUT pins) From 4900 MHz to 5850 MHz 15 CPLDHB HB path coupling factor at 5.375 GHz 11 RippleHB Coupling ripple in HB From 4900 MHz to 5850 MHz Doc ID 023285 Rev 1 dB 12 13 dB 1.2 dB 3/8 PCB recommendation 2 DCPL-WB-02D3 PCB recommendation Figure 2. Recommended land pattern LB_IN GND Pad Ø220 µm LB_OUT Top layer CPL HB_IN GND HB_OUT Aperture 130 µm 3 Ordering information scheme Figure 3. Ordering information scheme DCPL – Dual high directivity coupler Wide band Version Package D3 = Bump diameter, 255 µm 4/8 Doc ID 023285 Rev 1 WB – 02 D3 DCPL-WB-02D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Package dimensions 630 µm ±60 µm Ø 255 µm ± 40 µm LB out LB in GND 50 Ω 517 µm - Figure 4. 1.44 mm ± 50 µm 4 Package information LB Path CPLD B1 HB Path HB out GND C2 HB in 200 µm 632 µm 1.67 mm ± 50 µm Figure 5. Footprint Copper pad diameter: 220 µm recommended Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Figure 6. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Doc ID 023285 Rev 1 x x z y ww 5/8 Package information Figure 7. DCPL-WB-02D3 Tape and reel specifications Ø 1.50 2.0 4.0 1.77 3.5 1.75 0.20 8.0 x x z y ww 0.73 1.54 All dimensions in mm(typical values) Note: x x z y ww x x z y ww 4.0 User direction of unreeling More packing information is available in the STMicroelectronics Application notes: AN2348: “IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751: “EMI Filters: recommendations and measurements” 6/8 Doc ID 023285 Rev 1 DCPL-WB-02D3 5 Ordering information Ordering information Table 5. 6 Ordering information Order code Marking Package Weight Base qty Delivery mode DCPL-WB-02D3 SF Flip Chip 2.5 mg 5000 Tape and reel 7” Revision history Table 6. Document revision history Date Revision 18-Jun-2012 1 Changes Initial release Doc ID 023285 Rev 1 7/8 DCPL-WB-02D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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