ETC DR-11800D4-324S

DR-11800
16-BIT DIGITAL-TO-RESOLVER CONVERTER
FEATURES
DESCRIPTION
The DR-11800 is a small size, high
accuracy, 16-bit digital-to-sine/cosine
converter. Available in accuracies up
to 1 arc minute, the DR-11800 is contained in a 28-pin, one-square-inch
hermetically sealed package and
requires +15 Vdc and -15 Vdc power
supplies. The reference conditioner
allows for either 115 Vrms or 26 Vrms
reference input for a 6.8 Vrms sin/cos
output. Two registers for the input of
the 16-bit (CMOS/TTL) natural binary
angle data allow for compatibility with
an 8-bit or 16-bit data bus.
Internally, the DR-11800 has a multiplying digital-to-sin/cos converter
made of two function generators and
a quadrant select network. Quadrant
information is available from the two
most significant bits. The two function
generators use the remaining angular
data along with the buffered reference
voltage. Similar to a multiplying DAC
(digital-to-analog converter), the DR-
11800 uses high accuracy resistive
ladder networks and solid state
switching to control the attenuation of
the reference voltage. The output
buffer amplifiers allow for up to 2 mA
output drive.
• 28-Pin Square Package
• 1 Arc Minute Accuracy
• 0.03% Radius Accuracy
• Microprocessor Compatible -
APPLICATIONS
8- and 16-Bit
High accuracy, high reliability, small
size, low power consumption and
MIL-PRF-38534 processing availability, make the DR-11800 suitable
for industrial and military ground or
avionics applications. Possible applications include digital remote positioning, resolver angle simulators,
flight trainer, flight instrumentation,
radar and navigational systems, and
PPI displays including moving target
indicators. Other applications are synchro/resolver system development
and test, and wraparound test of synchro/resolver-to-digital converters.
• Double-Buffered Inputs
• Pin-Programmable Reference
Input (for 26 and 115 Vrms)
• DC-Coupled Reference and
Outputs
• Requires Only ±15 V Power
Supplies
• TTL and CMOS Compatible
• Pin-for-Pin Replacement for
Natel’s HDR2406
+VS
–VS
24
25
HBE 9
(MSB) B1 1
CK
B2 2
Q1
8-BIT
INPUT
REGISTER
B3 3
B4 4
B5 5
(MSB
BIT 1)
D
B9 11
B10 12
B11 13
B12 14
B13 15
INPUT BUFFERS
B6 6
B7 7
B8 8
16-BIT
HOLDING
REGISTER
BUFFER
AMPLIFIERS
D
Q16
(LSB) B16 18
28 SINθ
20 COSθ
8-BIT
INPUT
REGISTER
B14 16
B15 17
16-BIT
HIGH
ACCURACY
MULTIPLYING
DIGITAL
TO SIN / COS
CONVERTER
CK
CK PE
BIT 16
(LSB)
LBE 10
LDC 19
+
REFERENCE
CONDITIONER
23
GND
21
27
22
RL26 RH115 RL115
26
RH26
FIGURE 1. DR-11800 BLOCK DIAGRAM
© 1996, 1999 Data Device Corporation
TABLE 1. DR-11800 SPECIFICATIONS
PARAMETER
VALUE
REMARKS
DIGITAL ANGULAR
Resolution
16 Bits
Bit 1 = MSB, Bit 16 = LSB
Accuracy
±4 arc-minutes
Accuracy applies over
±2 arc-minutes
operating temperature
±1 arc-minutes
range.
TABLE 1. DR-11800 SPECIFICATIONS (CONTINUED)
PARAMETER
VALUE
REMARKS
REGISTER CONTROLS
(Continued)
200 ηsec min
Before data transfer.
Data Set-up Time
Data Hold Time
Before input data
200 ηsec min
changes.
SCALE FACTOR
VARIATION
Scale Factor Variation
POWER SUPPLIES
Supply Voltages (±Vs)
Supply Current
Supply Rejection
±15 V dc ±10%
±35 mA max
70 db
TEMPEATURE RANGES
Operating Case
-3XXX and -8XXX
-1XXX and -4XXX
Storage
0°C to +70°C
-55°C to +125°C
-65°C to +135°C
REFERENCE INPUT
(RH-RL)
Voltage
Frequency Range
Input Resistance
±0.1% max
115 V rms or
26 V rms
dc to 1000 Hz
Simultaneous amplitude variation in both
outputs as a function
of digital angle.
Differential solid-state
input.
PHYSICAL
CHARACTERISTICS
Type
Size
Differential 230 kΩ 115 V rms reference
Differential 52 kΩ 26 V rms reference
ANALOG OUTPUTS
Max SIN θ, COS θ
6.8 V rms, ±1.5 %
Output Current
Output Impedance
Zero Offset (dc)
2 mA rms
< 1 ohm
±10 mV typical
±25 mV max
25 µV/°C typical,
50 µV/°C max
50 µsec max to
accuracy of converter.
Offset Drift
Output Settling Time
DIGITAL INPUTS
Logic Levels
Logic 0
Logic 1
Loading
Input Current
Data Bits (B1-B16)
HBE, LBE, LDC
REGISTER CONTROLS
HBE
LBE
-0.3 Vdc to 0.8 V dc
2.4 Vdc to 5.5 V dc
0.1 TTL load
For any digital step
change.
CMOS transient protected.
8 MSBs enter high
byte input register.
High byte register
remains unaffected.
Logic 1
8 LSBs enter low byte
input register.
Low byte register
remains unaffected
600 ηsec min
Twice Normal Voltage
±18 V dc
-0.3 V dc to +6.5 V dc
NOTE. Although digital inputs are CMOS protected, storage in conductive foam
is recommended.
Logic 1
’
Logic 0
Logic 0
Pulse Width
Op amp output.
15 µA typ, “active” For less than 16 bits,
unused pins can float.
pull-down to gnd
-15 µA typ, “active” Unused pins can float.
pull-up to internal
logic supply
Logic 1
28 Pin Square
1.0 x 1.0 x 0.21 in.
(25 x 25 x 5.3) mm
0.6 oz
(17 g) max
ABSOLUTE MAXIMUM RATINGS
Reference Input:
Power Supply Voltage (±Vs):
Digital Inputs:
No external logic voltages required.
Logic 0
LDC
Weight
Output voltage varies
in direct proportion to
reference voltage.
Without output clipping.
Typ.
Data from input registers transferred to
holding register.
Data in holding register remains unaffected
For guaranteed data
transfer.
2
ANALOG OUTPUT PHASING
DIGITAL INTERFACE
The DR-11800 provides an output of 6.8V sinθ and 6.8V cosθ
for either a 26 Vrms reference (use pin 26; RH26, and pin 22;
RL26) or 115 Vrms reference (use pin 21; RH115, and pin 27;
RL115). FIGURE 2 illustrates the input connection for a 26V or
115V reference. FIGURE 3 illustrates the output phasing.
The DR-11800 has double-buffered input registers which allow
for easy implementation of an interface with 8-bit or 16-bit data
buses. The DR-11800 can also be set up for asynchronous data
inputs. If the LBE, HBE and LDC input pins are left open, the
internal pull-up circuitry will set these pins to a high state and the
information at the data inputs (B1-B16) will be continuously converted to sinθ and cosθ at the analog outputs. In applications
requiring less than 16-bit resolution, the unused pins can be left
open. The data bits (B1-B16) are internally pulled-down to apply
a logic 0 to unconnected data inputs.
+VS –VS
+VS –VS
N/C
RL 26 22
26 V
REFERENCE
N/C
RH 115 21
N/C
RL115
27
RH26
26
SIN θ
RL 26 22
21
SIN θ
RH 115
COS θ
115 V
REFERENCE
COS θ
RL 115 27
N/C RH 26
26
16-BIT ANGULAR DATA
16-BIT ANGULAR DATA
HBE
HBE
LBE
GND
LDC
LBE
LDC
NOTE: N/C NO CONNECTION
FIGURE 2. CONNECTIONS TO 26 V/115 V REFERENCE
Vmax
SIN θ
IN PHASE
WITH VIN
0˚
180
90
270
COS θ
-Vmax
SIN OUTPUT = 6.8V rms(1+n)SINθ
COS OUTPUT = 6.8V rms(1+n)COSθ
n IS THE SCALE FACTOR VARIATION AS A
FUNCTION OF DIGITAL ANGLE(± 0.1%)
FIGURE 3. OUTPUT PHASING
3
360˚
θ
DEGREES
GND
DATA TRANSFER FROM AN 8-BIT DATA BUS
DATA TRANSFER FROM A 16-BIT DATA BUS
Applications with an 8-bit data bus require two-byte loading of
the digital input (see FIGURE 4).
Applications interfacing with a 16-bit data bus require only single
byte loading, as shown in FIGURE 6. LBE and HBE are either
unconnected or tied together and pulsed high to load data.
FIGURE 5 shows the timing for two-byte data transfers.
As shown in the timing diagram (see FIGURE 7) 200 nsec after
the data is stable the LDC is set high (logic 1) to transfer the data
to the holding register. Since LDC is level actuated, it must
remain high for the time specified (600 nsec) to transfer the data.
1. LDC is low (logic 0) so that the contents of the holding register are latched and will remain unaffected by the changes on the
input registers.
2.When the LBE is set high (logic 1) the 8 LSBs (B9-B16) are
transferred to the low byte. The LBE must remain high for a minimum of 800 nsec after the data is stable. The data should
remain stable for 200 nsec after the LBE is set low (logic 0).
8 LSBs TRANSFERRED
TO INPUT REGISTERS
3.When the HBE is set high (logic 1) the 8 MSBs (B1-B8) are
transferred to the low byte. The HBE must remain high for a minimum of 800 nsec after the data is stable. The data should
remain stable for 200 nsec after the HBE is set low (logic 0).
DATA
CHANGING
DATA
STEADY
(MSBs)
(LSBs)
DATA
DATA SET UP
4.When the LDC is set high (logic 1) the data is transferred from
the two input registers to the holding register. The LDC should
be held high for 600 nsec minimum. Once the LDC is set low,
the cycle can begin again.
200 ns
MIN
8 MSBs TRANSFERRED
TO INPUT REGISTERS
PULSE
WIDTH
600 ns
MIN
LBE
Note: LBE, HBE, and LDC are level-actuated functions.
DATA HOLD
200ns
MIN
HBE
600 ns
MIN
600ns
MIN
PULSE
WIDTH
LDC
1
DATA TRANSFERRED TO
HOLDING REGISTERS
FIGURE 5. TIMING FOR 8-BIT BUS TRANSFER
2
3
4
5
6
DATA BUS
(MSB)
(LSB)
7
LBE
LOAD LSBs
HBE
LOAD MSBs
LDC
LOAD
CONVERTER
8 DR-11800
11
D7
D6
12
D5
13
B1
1
D4
14
B2
2
D3
15
B3
3
D2
16
B4
4
D1
17
B5
5
D0
18
B6
6
B7
7
B8
8
(MSB)
HBE
LBE
B9
11
B10
12
B11
B12
13
14
B13
15
B14
16
B15
17
DR-11800
10
9
19
LBE
HBE
LDC
NOT CONNECTED
OR LOAD DATA PULSE
LOAD
CONVERTER
18
B16
(LSB)
FIGURE 4. DATA TRANSFER FROM 8-BIT BUS
FIGURE 6. DATA TRANSFER FROM 16-BIT BUS
4
DIGITAL-TO-RESOLVER/SYNCHRO CONVERTERS
The DR-11800 provides single-ended sin/cos outputs.
FIGURE 8 shows the DR-11800 connected as a 4-Wire Digitalto-Resolver Converter (S1, S2, S3, and S4) using external Power
Amplifiers and transformers.
DATA TRANSFERRED
TO INPUT REGISTERS
FIGURE 9 shows the DR-11800 connected as a 3-Wire Digitalto-Synchro Converter (S1, S2, and S3) using external Power
Amplifiers and transformers.
DATA
STEADY
DATA
CHANGING
DATA
ALL 16 BITS
POWER SUPPLY DECOUPLING
200 ns
MIN
200 ns
MIN
HBE LBE
Decoupling capacitors are recommended on the +Vs and -Vs
supplies. A 1 µF tantalum capacitor in parallel with a 0.01 µF
ceramic capacitor should be mounted as close to the supply as
possible.
600 ns
MIN
DATA TRANSFERRED TO
HOLDING REGISTERS
600 ns
MIN
LDC
FIGURE 7. TIMING FOR 16-BIT BUS TRANSFER
RH
RL
1:n
RH
RH
RL
28
SIN θ
P.A.
RL
1:N
S1
1:n
RH
RL
28
SIN θ
1:N
P.A.
S1
S3
S3
DR-11800
DR-11800
20
16-BIT ANGULAR DATA
COS θ
P.A.
1:N
20
S4
S2
16-BIT ANGULAR DATA
FIGURE 8. 4-WIRE DIGITAL-TO-RESOLVER CONVERTER
COS θ
P.A.
1: √ 3 N
2
S2
FIGURE 9. 3-WIRE DIGITAL-TO-SYNCHRO CONVERTER
5
TABLE 2. DR-11800 PINOUTS
PIN
FUNCTION
PIN
FUNCTION
1
B1
15
B13
2
B2
16
B14
3
B3
17
B15
4
B4
18
B16
5
B5
19
LDC
6
B6
20
COS θ
7
B7
21
RL115
8
B8
22
RL26
9
HBE
23
GND
10
LBE
24
+Vs
11
B9
25
-Vs
12
B10
26
RH26
13
B11
27
RH115
14
B12
28
SIN θ
BOTTOM VIEW
.995 ± .020
(25.2)
15
16
17
.800
(20.3)
18
19
.10
TYP
.100
(2.54)
20
22
13
23
12
24
11
25
10
26
9
27
8
28
6
5
4
3
2
SIDE VIEW
1
TOLERANCES
.XX = ± .02
.XXX = ± .005
NOTES:
1. CASE IS ELECTRICALLY FLOATING
2. CONTAINER IS KOVAR ELECTROLESS NICKEL
PLATED. 100 TO 200 MICRO INCHES THK. PINS
GOLD PLATED PER MIL-G-45204 TYPE 1 CLASS
150 MICRO INCHES THK.
3. DESIGNATIONS ARE FOR REFERENCE ONLY
AND DO NOT APPEAR ON UNIT.
4. PIN #1 IS DESIGNATED BY A CONTRASTING
COLORED BEAD
5. DIMENSIONS SHOWN IN INCHES AND (MM).
21
14
7
.10
(2.54)
.100 TYP
(2.54)
± .020
.995
(25.2)
.800
(20.3)
.100 TYP
(2.54)
.018 DIA. TYP.
(0.46)
.20
(5.1)
DENOTES PIN 1
.25 TYPICAL
(6.3)
FIGURE 10. DR-11800 MECHANICAL OUTLINE
6
ORDERING INFORMATION
DR-11800DX-XXXX
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Accuracy:
3 = ±4 Minutes
4 = ±2 Minutes
5 = ±1 Minute
Process Requirements*:
0 = Standard DDC Processing, no Burn-In (See table below.)
2 = B*
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (See table below.)
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data
Frequency Range:
4 = DC to 1 kHz
* For availability of Fully Compliant MIL-PRF-38534 parts, please contact the DDC office nearest you.
**Standard DDC Processing with burn-in and full temperature test — see table below.
STANDARD DDC PROCESSING
MIL-STD-883
TEST
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017, and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
A
BURN-IN
1015, Table 1
—
7
The information in this data sheet is believed to be accurate; however, no responsibility is
assumed by Data Device Corporation for its use, and no license or rights are
granted by implication or otherwise in connection therewith.
Specifications are subject to change without notice.
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ILC DATA DEVICE CORPORATION
REGISTERED TO ISO 9001
FILE NO. A5976
A-02/98-1M
PRINTED IN THE U.S.A.
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