TI SN74AUC1G19DBVR

SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
FEATURES
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ Package
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
±8-mA Output Drive at 1.8 V VCC
DCK PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
A
1
•
Max tpd of 3 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
A
1
6
Y0
GND
2
5
VCC
E
3
4
Y1
Y0
6
GND
2
5
VCC
E
3
4
Y1
DRY PACKAGE
(TOP VIEW)
WY0
E
GND 2 V5I VCC
E
Y1
4
EPR3
A
1
DRL PACKAGE
(TOP VIEW)
6
A
1
6
Y0
GND
2
5
VCC
E
3
4
Y1
YZP PACKAGE
(BOTTOM VIEW)
E
3 4
Y1
GND
2 5
VCC
A
1 6
Y0
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to
1.95-V VCC operation.
The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to
the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
ORDERING INFORMATION
PACKAGE (1) (2)
TA
–40°C to 85°C
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000
SN74AUC1G19YZPR
U5_
SON – DRY
Reel of 5000
SN74AUC1G19DRYR
PREVIEW
Reel of 3000
SN74AUC1G19DBVR
U19_
Reel of 250
SN74AUC1G19DBVT
U19_
Reel of 3000
SN74AUC1G19DCKR
Reel of 250
SN74AUC1G19DCKT
Reel of 4000
SN74AUC1G19DRLR
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1)
(2)
(3)
U5_
U5_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUTS
E
A
Y0
Y1
L
L
L
H
L
H
H
L
H
X
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
A
6
4
E
2
TOP-SIDE MARKING (3)
Submit Documentation Feedback
Y0
Y1
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
–0.5
3.6
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (4)
DBV package
206
DCK package
252
DRL package
142
DRY package
234
YZP package
Tstg
(1)
(2)
(3)
(4)
Storage temperature range
V
°C/W
132
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
3
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
Recommended Operating Conditions (1)
VCC
Supply voltage
High-level control input voltage
MAX
0.8
2.7
VCC
3.6
0.65 × VCC
3.6
1.7
3.6
VCC = 1.1 V to 1.95 V
0
0.35 × VCC
VCC = 2.3 V to 2.7 V
0
0.7
0
VCC
VCC = 0.8 V
VIH
MIN
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 0.8 V
VIL
Low-level control input voltage
VO
Output voltage
IOH
High-level control output current
IOL
Low-level control output current
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
V
0
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC= 1.4 V
–5
VCC = 1.65 V
–8
VCC= 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC= 2.3 V
∆t/∆v
UNIT
V
V
mA
mA
9
VCC = 0.8 V to 1.95 V
20
VCC = 2.3 V to 2.7 V
15
–40
ns/V
°C
85
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
4
MIN
TYP (1)
MAX
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 µA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
2.3 V
0.6
IOL = 9 mA
(1)
VCC
IOH = –100 µA
UNIT
VCC – 0.1
0.55
V
0.2
0.25
V
II
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
ICC
VI = VCC or GND,
10
µA
CI
VI = VCC or GND
IO = 0
0.8 V to 2.7 V
2.5 V
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
Submit Documentation Feedback
3
pF
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
VCC = 1.1 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
A or E
Y
7.5
0.5
4.6
0.4
3.0
0.3
2.4
0.2
1.7
UNIT
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A or E
Y0 or Y1
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
MAX
MIN
MAX
0.5
2.8
0.4
2.0
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC =1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
13
13
13
13
14
Submit Documentation Feedback
UNIT
pF
5
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
www.ti.com
SCES626D – MARCH 2005 – REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
RL
LOAD CIRCUIT
VCC
CL
RL
V∆
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tw
tsu
th
VCC
VCC/2
Input
VCC/2
VCC
VCC/2
VCC/2
Data Input
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VOH
VCC/2
Output
VCC/2
VOL
tPHL
VCC/2
VCC/2
VOL
tPZL
tPLZ
VCC
VCC/2
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC/2
0V
tPZH
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VCC/2
VCC
Output
Control
VOL + V∆
VOL
tPHZ
VCC/2
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUC1G19DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DBVRE4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DBVTE4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKRE4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKTE4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19DRLRG4
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC1G19YZPR
ACTIVE
DSBGA
YZP
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2008
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
SN74AUC1G19DBVR
SOT-23
3000
180.0
9.2
DBV
6
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
SN74AUC1G19DBVT
SOT-23
DBV
6
250
180.0
9.2
3.23
3.17
1.37
4.0
8.0
Q3
SN74AUC1G19DCKR
SC70
DCK
6
3000
180.0
8.4
2.24
2.34
1.22
4.0
8.0
Q3
SN74AUC1G19DCKT
SC70
DCK
6
250
180.0
8.4
2.24
2.34
1.22
4.0
8.0
Q3
SN74AUC1G19DRLR
SOT
DRL
6
4000
180.0
9.2
1.78
1.78
0.69
4.0
8.0
Q3
SN74AUC1G19YZPR
DSBGA
YZP
6
3000
180.0
8.4
1.02
1.52
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUC1G19DBVR
SOT-23
DBV
6
3000
202.0
201.0
28.0
SN74AUC1G19DBVT
SOT-23
DBV
6
250
202.0
201.0
28.0
SN74AUC1G19DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
SN74AUC1G19DCKT
SC70
DCK
6
250
202.0
201.0
28.0
SN74AUC1G19DRLR
SOT
DRL
6
4000
202.0
201.0
28.0
SN74AUC1G19YZPR
DSBGA
YZP
6
3000
220.0
220.0
34.0
Pack Materials-Page 2
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