FREESCALE MPX53DP

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Pressure
Freescale Semiconductor
MPX53
Rev 7, 05/2009
50 kPa Uncompensated
Silicon Pressure Sensors
MPX53
Series
The MPX53 series silicon piezoresistive pressure sensors provide a very
accurate and linear voltage output, directly proportional to the applied
pressure. These standard, low cost, uncompensated sensors permit
manufacturers to design and add their own external temperature
compensating and signal conditioning networks. Compensation techniques
are simplified because of the predictability of Freescale's single element
strain gauge design.
0 to 50 kPa (0 to 7.25 psi)
60 mV Full Scale Span
(Typical)
Application Examples
•
•
•
•
•
•
•
•
Features
•
•
•
•
•
•
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
60 mV Span (Typical)
Differential and Gauge Options
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics
ORDERING INFORMATION
Package
Case
Device Name
Options
No.
None
Unibody Package (MPX53 Series)
MPX53D
Tape & Reel
344
•
MPX53DP
Rail
344C
MPX53GP
Rail
344B
Small Outline Package (MPXV53G Series)
MPXV53GC7U
Rail
482C
# of Ports
Single
Dual
Pressure Type
Differential
Absolute
Device
Marking
•
•
MPX53D
MPX53DP
MPX53GP
•
•
MPXV53G
•
•
•
SMALL OUTLINE PACKAGE
MPXV53GC7U
CASE 482C-03
Gauge
UNIBODY PACKAGES
MPX53D
CASE 344-15
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
MPX53GP
CASE 344B-01
MPX53DP
CASE 344C-01
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
50
kPa
VS
—
3.0
6.0
VDC
IO
—
6.0
—
mAdc
VFSS
45
60
90
mV
VOFF
0
20
35
mV
ΔV/ΔΡ
—
1.2
—
mV/kPa
Linearity
—
–0.6
—
0.4
%VFSS
Pressure Hysteresis (0 to 50 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span
TCVFSS
–0.22
—
-0.16
%VFSS/°C
Temperature Coefficient of Offset
TCVOFF
—
±15
—
µV/°C
TCR
0.21
—
0.27
%ZIN/°C
ZIN
355
—
505
Ω
ZOUT
750
—
1875
Ω
tR
—
1.0
—
ms
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Pressure
Range(1)
Supply Voltage
(2)
Supply Current
Full Scale
Offset
Span(3)
(4)
Sensitivity
Temperature Coefficient of Resistance
Input Impedance
Output Impedance
Response
Time(5)
Warm-Up
Time(6)
Offset
Stability(7)
(10% to 90%)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX53
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
175
kPa
Burst Pressure (P1 > P2)
PBurst
200
kPa
Storage Temperature
TSTG
–40 to +125
°C
TA
–40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip.
3
+VS
2
+VOUT
Sensor
4
-VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure (P1) relative to the
vacuum side (P2). Similarly, output voltage increases as
increasing vacuum is applied to the vacuum side (P2) relative
to the pressure side (P1).
MPX53
Sensors
Freescale Semiconductor
3
Pressure
Temperature Compensation
Figure 2 shows the typical output characteristics of the
MPX53 series over temperature.
The piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This device
uses a unique transverse voltage diffused semiconductor
strain gauge which is sensitive to stresses produced in a thin
silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components, or
by designing your system using the MPX2053 series sensors.
Several approaches to external temperature
compensation over –40 to +125°C and 0 to +80°C are
presented in Freescale Application Note, AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + (sensitivity x P) over the operating
pressure range (see Figure 3). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 4 illustrates the differential or gauge configuration in
the unibody chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MPX53 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Refer to application
note AN3728, for more information regarding media
compatibility.
100
Output (mVdc)
90
80
70
MPX53
VS = 3 Vdc
P1 > P2
+25°C
–40°C
60
50
40
30
20
10
0
PSI 0
kPa 0
Span
Range
(Typ)
+125ºC
Offset
(Typ)
1
2
10
3
4
5
6
20
30
40
Pressure Differential
7
50
8
Figure 2. Output vs. Pressure Differential
90
Linearity
80
70
Silicone
Die Coat
Actual
60
Span
(VFSS)
Output (mVdc)
50
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Epoxy
Case
40
Theoretical
30
Lead Frame
20
P2
Offset
(VOFF)
10
0
RTV Die
Bond
0
Pressure (kPa)
MAX
POP
Figure 3. Linearity Specification Comparison
Figure 4. Unibody Package — Cross-Sectional Diagram
(Not to Scale)
MPX53
4
Sensors
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX53D
Case Type
344
Pressure (P1) Side
Identifier
Stainless Steep Cap
MPX53DP
344C
Side with Port Marking
MPX53GP
344B
Side with Port Attached
MPXV53 Series
482C
Side with Port Attached
MPX53
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
Z
4
3
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4 - OUTPUT
MPX53
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1. GROUND
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX53
Sensors
Freescale Semiconductor
7
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MPX53
Rev. 7
05/2009
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