SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 FEATURES • • • • • • • • Available in the Texas Instruments NanoFree™ Package Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 5.9 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) • • • DCT PACKAGE (TOP VIEW) DCU PACKAGE (TOP VIEW) CLK 1 8 VCC D 2 7 PRE Q 3 6 CLR GND 4 5 Q CLK D Q GND YZP PACKAGE (BOTTOM VIEW) 1 8 VCC 2 7 3 6 4 5 PRE CLR Q GND Q D CLK 4 5 3 6 2 7 1 8 Q CLR PRE VCC See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (2) TOP-SIDE MARKING (2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74LVC2G74YZPR _ _ _CP_ SSOP – DCT Reel of 3000 SN74LVC2G74DCTR C74_ _ _ Reel of 3000 SN74LVC2G74DCUR Reel of 250 SN74LVC2G74DCUT VSSOP – DCU (1) ORDERABLE PART NUMBER C74_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2007, Texas Instruments Incorporated SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 FUNCTION TABLE INPUTS (1) OUTPUTS PRE CLR CLK D Q L H X X H Q L H L X X L H L L X X H (1) H (1) H H ↑ H H L H H ↑ L L H H H L X Q0 Q0 This configuration is nonstable; that is, it does not persist when PRE or CLR returns to its inactive (high) level. LOGIC DIAGRAM (POSITIVE LOGIC) PRE CLK 7 1 C C C 5 Q TG C C C C D 2 TG TG TG 3 C CLR 2 C C 6 Submit Documentation Feedback Q SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Tstg (1) (2) (3) (4) Package thermal impedance (4) DCT package 220 DCU package 227 YZP package 102 Storage temperature range –65 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback 3 SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V MIN MAX 1.65 5.5 1.5 Low-level input voltage 1.7 V 2 0.7 × VCC 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 V 0.3 × VCC VCC = 4.5 V to 5.5 V VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V IOH High-level output current –8 –16 VCC = 3 V –32 VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current ∆t/∆v Input transition rise or fall rate 8 16 VCC = 3 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 VCC = 3.3 V ± 0.3 V 10 (1) Operating free-air temperature ns/V 5 –40 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback mA 24 VCC = 4.5 V VCC = 5 V ± 0.5 V TA mA –24 VCC = 4.5 V 4 V 0.65 × VCC VCC = 1.65 V to 1.95 V VIL UNIT °C SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH 1.65 V to 5.5 V 1.65 V 1.2 IOH = –8 mA 2.3 V 1.9 4.5 V IOL = 100 µA 1.65 V to 5.5 V 0.1 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 IOL = 32 mA Data or control inputs 0.4 ICC VI = 5.5 V or GND, IO = 0 ∆ICC One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND 0.55 0 to 5.5 V ±5 µA 0 ±10 µA 1.65 V to 5.5 V 10 µA 3 V to 5.5 V 500 µA VI = 5.5 V or GND VI or VO = 5.5 V V 0.55 4.5 V Ioff (1) 3.8 3V IOL = 24 mA II 2.3 IOH = –32 mA IOL = 16 mA UNIT V 2.4 3V IOH = –24 mA MAX VCC – 0.1 IOH = –4 mA IOH = –16 mA VOL MIN TYP (1) VCC 3.3 V 5 pF All typical values are at VCC = 3.3 V, TA = 25°C. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V ± 0.15 V MIN fclock MAX VCC = 2.5 V ± 0.2 V MIN 80 tw Pulse duration tsu Setup time, before CLK↑ th Hold time, data after CLK↑ VCC = 3.3 V ± 0.3 V MAX MIN MAX 175 VCC = 5 V ± 0.5 V MIN 175 200 CLK 6.2 2.7 2.7 2 PRE or CLR low 6.2 2.7 2.7 2 Data 2.9 1.7 1.3 1.1 PRE or CLR inactive 1.9 1.4 1.2 1 0 0.3 1.2 0.5 UNIT MAX MHz ns ns ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd VCC = 1.8 V ± 0.15 V MIN MAX 80 CLK PRE or CLR VCC = 2.5 V ± 0.2 V MIN VCC = 3.3 V ± 0.3 V MAX 175 MIN MAX 175 VCC = 5 V ± 0.5 V MIN 200 MHz Q 4.8 13.4 2.2 7.1 2.2 5.9 1.4 4.1 Q 6 14.4 3 7.7 2.6 6.2 1.6 4.4 4.4 12.9 2.3 7 1.7 5.9 1.6 4.1 Q or Q Submit Documentation Feedback UNIT MAX ns 5 SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 Operating Characteristics TA = 25°C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 35 35 37 40 Submit Documentation Feedback UNIT pF SN74LVC2G74 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET www.ti.com SCES203M – APRIL 1999 – REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5 V ± 0.5 V VI tr/tf VCC VCC 3V VCC £2 ns £2 ns £2.5 ns £2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 × VCC 2 × VCC 6V 2 × VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC2G74DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCURE4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUTE4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G74YZPR ACTIVE WCSP YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LVC2G74DCUR Package Package Pins Type Drawing US8 DCU 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 3000 180.0 9.2 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 2.25 3.35 1.05 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC2G74DCUR US8 DCU 8 3000 202.0 201.0 28.0 Pack Materials-Page 2 MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice. 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