TI SN74S196N

PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
7601501CA
OBSOLETE
CDIP
J
14
TBD
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7601501DA
OBSOLETE
CFP
W
14
TBD
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7601501DA
OBSOLETE
CFP
W
14
TBD
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SN54196J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SN54196J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SN54197J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SN54197J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SN54LS197J
OBSOLETE
CDIP
J
14
TBD
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SN54LS197J
OBSOLETE
CDIP
J
14
TBD
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SN74196N
OBSOLETE
PDIP
N
14
TBD
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SN74196N
OBSOLETE
PDIP
N
14
TBD
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SN74197N
OBSOLETE
PDIP
N
14
TBD
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SN74197N
OBSOLETE
PDIP
N
14
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SN74LS196D
OBSOLETE
SOIC
D
14
TBD
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Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SN74LS196D
OBSOLETE
SOIC
D
14
TBD
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SN74LS196DR
OBSOLETE
SOIC
D
14
TBD
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SN74LS196DR
OBSOLETE
SOIC
D
14
TBD
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SN74LS196N
OBSOLETE
PDIP
N
14
TBD
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SN74LS196N
OBSOLETE
PDIP
N
14
TBD
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SN74LS197D
OBSOLETE
SOIC
D
14
TBD
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SN74LS197D
OBSOLETE
SOIC
D
14
TBD
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SN74LS197J
OBSOLETE
CDIP
J
14
TBD
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SN74LS197J
OBSOLETE
CDIP
J
14
TBD
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SN74LS197N
OBSOLETE
PDIP
N
14
TBD
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SN74LS197N
OBSOLETE
PDIP
N
14
TBD
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SN74S196N
OBSOLETE
PDIP
N
14
TBD
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SN74S196N
OBSOLETE
PDIP
N
14
TBD
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SN74S197N
OBSOLETE
PDIP
N
14
TBD
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SN74S197N
OBSOLETE
PDIP
N
14
TBD
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SNJ54196J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SNJ54196J
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
SNJ54197J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SNJ54197J
ACTIVE
CDIP
J
14
1
TBD
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Level-NC-NC-NC
SNJ54197W
OBSOLETE
CFP
W
14
TBD
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SNJ54197W
OBSOLETE
CFP
W
14
TBD
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SNJ54LS197FK
OBSOLETE
LCCC
FK
20
TBD
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SNJ54LS197FK
OBSOLETE
LCCC
FK
20
TBD
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SNJ54LS197J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ54LS197J
OBSOLETE
CDIP
J
14
TBD
Call TI
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SNJ54LS197W
OBSOLETE
CFP
W
14
TBD
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SNJ54LS197W
OBSOLETE
CFP
W
14
TBD
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Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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