AGERE D2500

Data Sheet
February 2000
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Features
■
Integrated optical isolator
■
SONET/SDH compatible up to OC-48/STM-16
■
High-performance, multiquantum-well (MQW), distributed-feedback (DFB) laser
■
Low dispersion penalty for long-reach and
extended-reach applications
■
Industry-standard, 14-pin butterfly package
■
Characterized at 2.488 Gbits/s (NRZ)
■
Wide operating case temperature range of
–40 °C to +70 °C
■
InGaAs, PIN photodetector back-facet monitor
■
Low threshold current
■
High reliability
■
High optical power available
■
Qualified to meet the intent of Telcordia Technologies * 468
The 1.5 µm D2500-Type Laser Module is offered in a 14-pin,
hermetic, butterfly package.
* Telcordia Technologies is a trademark of Bell Communications
Research, Inc.
Applications
■
Telecommunications:
— SONET/SDH
— Long reach
— Interexchange
■
Digital video
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Description
The minimum pigtail length is 39.4 in. (100 cm); the
minimum bend radius is 1.18 in. (30 mm).
The D2500-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, MQW, distributed-feedback (DFB) laser designed for 1.5 µm applications. The laser is designed to be used in OC-12/
STM-4 (622 Mbits/s) and OC-48/STM-16 (2.488 Gbits/
s) for long-reach and extended-reach applications. It is
also capable of low dispersion penalties (<2 dB) for use
with fiber spans exceeding 170 km (3000 ps/nm).
The pigtail is a 900 µm tight buffer fiber. Various connector and pigtail options are available.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard. To eliminate the need for optical amplifiers in
some applications, the module can also be ordered
with higher output powers.
Lucent Technologies Microelectronics Group optoelectric components are qualified to rigorous internal standards that are consistent with Telcordia Technologies
TR-NWT-000468. All design and manufacturing operations are ISO * 9001 certified. The module is fully qualified for central office applications.
* ISO is a registered trademark of The International Organization for
Standardization.
Pin Information
Controlled Feedback
Pin
1
2
3
4
5
6
7
8
9
10
11
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25 °C for case temperatures from –40 °C to +70 °C.
The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature.
Name
Thermistor
Thermistor
Laser dc Bias (cathode) (–)
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)*
Thermoelectric Cooler (–)*
Case Ground
Case Ground
Case Ground
Laser Anode (+)†
RF Laser Input Cathode (–)
12
13
Laser Anode (+)†
Case Ground
14
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in conjunction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the average laser output power.
* A positive current through the thermoelectric heat pump cools the
laser.
† Both leads should be grounded for optimum performance.
7
6
–
5
+
+
4
3
–
2
L1
160 nH
TH
TEC
10 kΩ
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25 Ω
impedance. The laser module is equipped with a single-mode fiber with an 8 µm core and 125 µm cladding.
2
R1
20 Ω
PACKAGE
GROUNDS
+
8
9
1
–
10
11
–
12
ISOLATOR
+
13
14
1-567
Top view.
Figure 1. Circuit Schematic
Lucent Technologies Inc.
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Min
Max
Unit
Laser Reverse Voltage
VRLMAX
—
2
V
dc Forward Current
IFLMAX
—
150
mA
Operating Case Temperature Range
TC
– 40
70
°C
Storage Case Temperature Range*
Tstg
– 40
85
°C
Photodiode Reverse Voltage
VRPDMAX
—
10
V
Photodiode Forward Current
IFPDMAX
—
1
mA
* Does not apply to shipping container.
Handling Precautions
Mounting Instructions
Power Sequencing
The minimum fiber bend radius is 30 mm (1.18 in.).
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this turnon sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both handling
and testing. Follow guidelines such as
JEDEC Publication No. 108-A (Dec.
1988).
Lucent employs a human-body model (HBM) for ESDsusceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to define the model. A standard HBM
(resistance = 1.5 kΩ, capacitance = 100 pF) is widely
used and, therefore, can be used for comparison purposes. The HBM ESD threshold presented here was
obtained using these circuit parameters:
Parameter
Value
Unit
Human-body Model
>400
V
Lucent Technologies Inc.
To avoid degradation in performance, mount the module on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flatness
must be better than 0.001 in. (25.4 µm). Using thermal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conductive grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw-hole locations (see Outline Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
0.062 (1.58)
0.118
(3.00)
0.086
(2.18)
0.031 (0.79)
0.140
(3.56)
0.129 (3.28) R
0.041 (1.04)
1-532
Note: Dimensions are in inches and (millimeters).
Figure 2. Fillister Head Screw
3
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Characteristics
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are
the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements.
Table 1. Electrical Characteristics (at 25 °C Laser Temperature)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
VLF
LF = 2 mW (CW)
—
1.3
1.8
V
η
LF = 2 mW (CW)
0.025
0.10
—
mW/mA
ITH
—
—
12
50
mA
Monitor Reverse-bias Voltage*
VRMON
—
3
5
10
V
Monitor Current
IRMON
PO = 1 mW (CW)
0.1
1.0
2.0
mA
Monitor Dark Current
ID
IF = 0, VRMON = 5 V
—
0.01
0.1
µA
Input Impedance
ZIN
—
—
25
—
Ω
Thermistor Current
ITC
—
10
—
100
µA
Resistance Ratio†
—
—
8.6
—
9.6
—
Thermistor Resistance
RTH
TL = 25 °C
9.5
—
10.5
kΩ
TEC Current
ITEC
TL = 25 °C, TC = 70 °C
—
0.6
1.0
A
TEC Voltage
VTEC
TL = 25 °C, TC = 70 °C
—
1.3
2.0
V
TEC Capacity
∆T
TC = 70 °C
50
—
—
°C
Laser Forward Voltage
Slope Efficiency
Threshold Current
* Standard operating condition is 5.0 V reverse bias.
† Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C.
Table 2. Optical Characteristics (at 25 °C Laser Temperature)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
PPEAK
—
2.0
—
—
mW
Center Wavelength
λC
—
1530
—
1570
nm
Spectral Width:
Full Width at –3 dB
Full Width at –20 dB
∆λ
Modulated at 2.5 Gbits/s at
rated power
—
—
0.20
0.8
0.30
1.0
nm
nm
SMSR
Modulated at 2.5 Gbits/s
30
—
—
dB
—
0 °C to 65 °C
30
—
—
dB
Peak Optical Output Power
Side-mode Suppression Ratio
Optical Isolation
Table 3. Dispersion Performance (examples of dispersion penalty specifications)
Parameter
Dispersion Penalty:*
D2502
D2511
D2517
Symbol
Test Conditions
Min
Typ
Max
Unit
DP
DP
DP
1350 ps/nm
1800 ps/nm
3000 ps/nm
—
—
—
—
—
—
2.0
2.0
2.0
dB
dB
dB
* Other dispersion penalties at various dispersions available.
4
Lucent Technologies Inc.
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Outline Diagram
Dimensions are in inches and (millimeters). Tolerances are ±0.005 in. (±0.127 mm).
1.025 (26.04)
PIN 1
0.508 ± 0.008
(12.90 ± 0.2)
0.10 ± 0.002
(0.25 ± 0.064)
0.020 (0.51) TYP
TRADEMARK, CODE, LASER SERIAL NUMBER,
AND DATE CODE IN APPROX. AREA SHOWN
STRAIN
RELIEF
0.036
(0.91)
0.500
(12.70)
0.605
0.350
(15.37)
(8.89)
MAX
0.200
(5.08)
0.078 (1.98)
0.105 (2.67) DIA
TYP (4) PLACES
PIN 14
0.213 (5.40) TYP
0.100 (2.54) TYP
39.37 (1000.00)
MIN
2.03 (51.6)
0.180 (4.56)
0.820 (20.83)
0.700 (17.78)
0.863 (21.91)
0.575 (14.61)
0.10
(2.5)
0.260 (6.60)
0.056 (1.42)
0.365
(9.27)
MAX
0.030 (0.75)
1.180 (29.97)
HEAT SINK
0.215
(5.47)
REF
0.215 (5.45)
1-520.g
Lucent Technologies Inc.
5
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Class IIIb Laser Product
FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser
Safety requirements. All versions are Class IIIb laser products per IEC * 60825-1:1993. The device has been certified with the FDA under accession number 8720010.
This product complies with 21 CFR 1040.10 and 1040.11.
8 µm/125 µm single-mode fiber pigtail with 900 µm tight buffer jacket and connector
Wavelength = 1.5 µm
Maximum power = 10 mW
Because of size constraints, labeling is not affixed to the module but is contained in the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in
hazardous laser radiation exposure.
* IEC is a registered trademark of The International Electrotechnical Commission.
10 mW
6
1.5 µm
Lucent Technologies Inc.
1.5 µm D2500-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Ordering Information
Table 4. Ordering Information
Device Code
Connector*
Comcode
FC-PC
107952723
D2511G
FC-PC
107952814
D2511D
SC
108036898
D2517G
FC-PC
108198318
D2517D
SC
108054719
D2502G
Description
1.5 µm Digital DFB Laser
* Other connectors available upon request.
Lucent Technologies Inc.
7
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1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
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Tel. (65) 778 8833, FAX (65) 777 7495
CHINA:
Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652
JAPAN:
Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700
EUROPE:
Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148
Technical Inquiries: OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Ascot UK)
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
Copyright © 2000 Lucent Technologies Inc.
All Rights Reserved
February 2000
DS00-166OPTO (Replaces DS98-339LWP)
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