TI SN74AUP1T97DCKR

SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
D Available in the Texas Instruments
D
D
D
D
D
D Very Low Static and Dynamic Power
NanoStar and NanoFree Packages
Single-Supply Voltage Translator
− 1.8 V to 3.3 V (at VCC = 3.3 V)
− 2.5 V to 3.3 V (at VCC = 3.3 V)
− 1.8 V to 2.5 V (at VCC = 2.5 V)
− 3.3 V to 2.5 V (at VCC = 2.5 V)
Nine Configurable Gate Logic Functions
Schmitt-Trigger Inputs Reject Input Noise
and Provide Better Output Signal Integrity
Ioff Supports Partial-Power-Down Mode
With Low Leakage Current (0.5 mA)
200-ns/V Input Rise/Fall Time Allows Slow
Transition of Input Signal
DBV OR DCK PACKAGE
(TOP VIEW)
B
GND
A
1
6
2
5
3
4
C
VCC
Y
D
D
D
D
Consumption
Pb-Free Packages Available: SOT-23 (DBV),
SC-70 (DCK), WCSP (NanoFree)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
Related Devices: AUP1T98/57/58
YEP OR YZP PACKAGE
(BOTTOM VIEW)
A
GND
B
3 4
2 5
1 6
Y
VCC
C
description /ordering information
AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery
backed-up equipment. The SN74AUP1T97 is designed for logic level translation applications with input
switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC
supply.
The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and
ensures normal operation between this range.
Schmitt-trigger inputs ( nVT = 210 mV between positive and negative input transitions) offer improved noise
immunity during switching transitions, which is especially useful on analog-mixed mode designs. Schmitt-trigger
inputs reject input noise, ensure integrity of output signals, and also allow for slow input signal transition.
The AUP1T97 can be easily configured to perform a required gate function by connecting A, B, and C inputs
to VCC or ground (see Function Selection Table). Up to nine commonly used logic gate functions can be
performed.
Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile
applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs
of the device. No damage will occur to the device under these conditions.
AUP1T97 is designed with optimized current drive capability of 4 mA to reduce line reflections, overshoot, and
undershoot caused by high drive outputs.
Nanostar and Nanofree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
Copyright  2004, Texas Instruments Incorporated
!" # $%&" !# '%()$!" *!"&+
*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0 !)) '!!&"&#+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74AUP1T97YEPR
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Tape and reel
SN74AUP1T97YZPR
SOT (SOT-23) − DBV
Tape and reel
SN74AUP1T97DBVR
HT4_
SOT (SC-70) − DCK
Tape and reel
SN74AUP1T97DCKR
TH_
_ _ _TH_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
FUNCTION SELECTION TABLE
LOGIC FUNCTION
2
FIGURE NO.
2-to-1 data selector
5
2-input AND gate
6
2-input OR gate with one inverted input
7
2-input NAND gate with one inverted input
7
2-input AND gate with one inverted input
8
2-input NOR gate with one inverted input
8
2-input OR gate
9
Inverter
10
Noninverted buffer
11
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
Dynamic-Power Consumption
(pF)
100%
100%
80%
80%
60%
60%
3.3-V
Logic†
40%
40%
3
2.5
3.3-V
LVC
Logic†
AUP
0%
0%
2
Input
Output
1.5
1
0.5
0
20%
20%
Switching Characteristics
at 25 MHz†
3.5
Voltage − V
Static-Power Consumption
(µA)
−0.5
AUP
† Single, dual, and triple gates
0
5
10
15
20 25 30
Time − ns
35
40
45
† AUP1G08 data at CL = 15 pF
Figure 1. AUP - The Lowest-Power Family
Figure 2. Excellent Signal Integrity
3.3 V
3.3 V
VIH = 1.19 V
VIL = 0.5 V
VIH = 1.19 V
VIL = 0.5 V
1.8-V
System
2.5-V
System
3.3-V
System
3.3-V
System
AUP1T97
AUP1T97
2.5 V
2.5 V
VIH = 1.10 V
VIL = 0.35 V
VIH = 1.10 V
VIL = 0.35 V
1.8-V
System
3.3-V
System
2.5-V
System
AUP1T97
2.5-V
System
AUP1T97
Figure 3. Possible Voltage Translation Combinations
3.3 V
1.8-V
System
3.3-V
System
AUP1T97
VOH min
VT+(max) = VIH(min) = 1.19 V
VT−(min) = VIL(max) = 0.5 V
VOL max
Input Switching Waveform
Output Switching Waveform
Figure 4. Switching Thresholds for 1.8-V to 3.3-V Translation
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
FUNCTION TABLE
INPUTS
A
OUTPUT
Y
L
L
L
L
H
L
C
B
L
L
L
H
L
H
L
H
H
H
H
L
L
L
H
L
H
H
H
H
L
L
H
H
H
H
logic diagram (positive logic)
A
3
4
B
C
4
1
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Y
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
logic configurations
VCC
VCC
C
B
B
Y
A
A
1
6
2
5
3
4
C
C
Y
A
A
Y
GND
1
6
2
5
3
4
C
Y
GND
Figure 5. 157: 2-to-1 Data Selector/MUX
When C is L, Y = B
When C is H, Y = A
Figure 6. 08: 2-Input AND Gate
VCC
C
VCC
C
Y
C
Y
B
A
Y
A
A
1
6
2
5
3
4
C
B
C
Y
Y
B
1
6
2
5
3
4
C
Y
GND
GND
Figure 7. 14+32/14+00: 2-Input OR/NAND Gate
With One Inverted Input
Figure 8. 14+08/14+02: 2-Input AND/NOR
Gate With One Inverted Input
VCC
VCC
C
Y
B
B
1
6
2
5
3
4
C
C
Y
Y
1
6
2
5
3
4
C
Y
GND
GND
Figure 9. 32: 2-Input OR Gate
Figure 10. 04/14: Inverter
VCC
B
B
Y
1
6
2
5
3
4
Y
GND
Figure 11. 17/34: Noninverted Buffer
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Output voltage range in the high or low state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259°C/W
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 123°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
VCC
VI
Supply voltage
VO
Output voltage
Input voltage
IOH
High-level output current
VCC = 2.3 V
VCC = 3 V
IOL
Low-level output current
VCC = 2.3 V
VCC = 3 V
∆t/∆v
MAX
UNIT
2.3
3.6
V
0
3.6
V
0
VCC
−3.1
V
−4
mA
3.1
4
mA
Input transition rise or fall rate
VCC = 2.3 V to 3.6 V
200
ns/V
TA
Operating free-air temperature
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = −40°C
TO 85°C
TA = 25°C
VCC
MIN
TYP
UNIT
MAX
MIN
MAX
VT+
Positive-going
input threshold
voltage
2.3 V to 2.7 V
0.6
1.1
0.6
1.1
3 V to 3.6 V
0.75
1.16
0.75
1.19
VT−
Negative-going
input threshold
voltage
2.3 V to 2.7 V
0.35
0.6
0.35
0.6
3 V to 3.6 V
0.5
0.85
0.5
0.85
∆VT
Hysteresis
(VT+ − VT−)
2.3 V to 2.7 V
0.23
0.6
0.17
0.6
3 V to 3.6 V
0.25
0.56
0.21
0.56
2.3 V to 3.6 V
VCC − 0.1
2.05
V
V
V
IOH = −20 µA
IOH = −2.3 mA
2.3 V
IOH = −3.1 mA
IOH = −2.7 mA
VOH
3V
IOH = −4 mA
IOL = 20 µA
All inputs
∆Ioff
ICC
∆ICC
1.85
2.67
2.6
2.55
2.3 V
IOL = 2.7 mA
IOL = 4 mA
II
Ioff
1.9
2.72
2.3 V to 3.6 V
IOL = 2.3 mA
IOL = 3.1 mA
VOL
VCC − 0.1
1.97
3V
V
0.1
0.1
0.31
0.33
0.44
0.45
0.31
0.33
0.44
0.45
V
VI = 3.6 V or GND
VI or VO = 0 V to 3.6 V
0 V to 3.6 V
0.1
0.5
µA
0V
0.1
0.5
µA
VI or VO = 5.5 V
VI = 3.6 V or GND, IO = 0
0 V to 0.2 V
0.2
0.5
µA
2.3 V to 3.6 V
0.5
0.9
µA
One input at 0.3 V or 1.1 V,
Other inputs at 0 or VCC, IO = 0
2.3 V to 2.7 V
4
One input at 0.45 V or 1.2 V,
Other inputs at 0 or VCC, IO = 0
3 V to 3.6 V
12
µA
Ci
VI = VCC or GND
3.3 V
1.5
pF
Co
VO = VCC or GND
3.3 V
3
pF
switching characteristics over recommended operating free-air temperature
VCC = 2.5 V + 0.2 V, VI = 1.8 V + 0.15 V (unless otherwise noted) (see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
POST OFFICE BOX 655303
TA = −40°C
TO 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
MAX
5 pF
1.8
2.3
2.9
0.5
6.8
10 pF
2.3
2.8
3.4
1
7.9
15 pF
2.6
3.1
3.8
1
8.7
30 pF
3.8
4.4
5.1
1.5
10.8
• DALLAS, TEXAS 75265
range,
UNIT
ns
7
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
switching characteristics over recommended operating free-air temperature
VCC = 2.5 V + 0.2 V, VI = 2.5 V + 0.2 V (unless otherwise noted) (see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = −40°C
TO 85°C
TA = 25°C
CL
range,
UNIT
MIN
TYP
MAX
MIN
MAX
5 pF
1.8
2.3
3.1
0.5
6
10 pF
2.2
2.8
3.5
1
7.1
15 pF
2.6
3.2
5.2
1
7.9
30 pF
3.7
4.4
5.2
1.5
10
switching characteristics over recommended operating free-air temperature
VCC = 2.5 V + 0.2 V, VI = 3.3 V + 0.3 V (unless otherwise noted) (see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
range,
TA = −40°C
TO 85°C
TA = 25°C
CL
UNIT
MIN
TYP
MAX
MIN
MAX
5 pF
2
2.7
3.5
0.5
5.5
10 pF
2.4
3.1
3.9
1
6.5
15 pF
2.8
3.5
4.3
1
7.4
30 pF
4
4.7
5.5
1.5
9.5
switching characteristics over recommended operating free-air temperature
VCC = 3.3 V + 0.3 V, VI = 1.8 V + 0.15 V (unless otherwise noted) (see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
MIN
TYP
MAX
MIN
UNIT
MAX
5 pF
1.6
2
2.5
0.5
8
10 pF
2
2.4
2.9
1
8.5
15 pF
2.3
2.8
3.3
1
9.1
30 pF
3.4
3.9
4.4
1.5
9.8
switching characteristics over recommended operating free-air temperature
VCC = 3.3 V + 0.3 V, VI = 2.5 V + 0.2 V (unless otherwise noted) (see Figure 12)
PARAMETER
tpd
8
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
POST OFFICE BOX 655303
TA = −40°C
TO 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
MAX
5 pF
1.6
1.9
2.4
0.5
5.3
10 pF
2
2.3
2.7
1
6.1
15 pF
2.3
2.7
3.1
1
6.8
30 pF
3.4
3.8
4.2
1.5
8.5
• DALLAS, TEXAS 75265
ns
range,
TA = −40°C
TO 85°C
TA = 25°C
CL
ns
ns
range,
UNIT
ns
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
switching characteristics over recommended operating free-air temperature
VCC = 3.3 V + 0.3 V, VI = 3.3 V + 0.3 V (unless otherwise noted) (see Figure 12)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
TYP
MAX
MIN
MAX
1.6
2.1
2.7
0.5
4.7
10 pF
2
2.4
3
1
5.7
15 pF
2.3
2.7
3.3
1
6.2
30 pF
3.4
3.8
4.4
1.5
7.8
5 pF
tpd
A, B, or C
Y
TA = −40°C
TO 85°C
TA = 25°C
CL
range,
UNIT
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 2.5 V
TYP
4
VCC = 3.3 V
TYP
5
UNIT
pF
9
SCES613A – OCTOBER 2004 − REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL
(see Note A)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VI/2
VCC/2
5, 10, 15, 30 pF
VI/2
VCC/2
1 MΩ
CL
VMI
VMO
LOAD CIRCUIT
VI
VMI
Input
VMI
0V
tPHL
tPLH
VOH
VMO
Output
VMo
VOL
tPHL
tPLH
VOH
Output
VMo
VMo
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A.
B.
C.
D.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
Figure 12. Load Circuit and Voltage Waveforms
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS114 – FEBRUARY 2002
DCK (R-PDSO-G6)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
6
0,10 M
4
1,40
1,10
1
0,13 NOM
2,40
1,80
3
Gage Plane
2,15
1,85
0,15
0°–8°
0,46
0,26
Seating Plane
1,10
0,80
0,10
0,00
0,10
4093553-3/D 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-203
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated