SCBS698G − JULY 1997 − REVISED MAY 2004
D Members of the Texas Instruments
D
D
D
D
D
D
D
D
D
D
SN54LVTH16646 . . . WD PACKAGE
SN74LVTH16646 . . . DGG OR DL PACKAGE
(TOP VIEW)
Widebus Family
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
Support Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V VCC)
Support Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flowthrough Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
1DIR
1CLKAB
1SAB
GND
1A1
1A2
VCC
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
VCC
2A7
2A8
GND
2SAB
2CLKAB
2DIR
description/ordering information
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OE
1CLKBA
1SBA
GND
1B1
1B2
VCC
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
VCC
2B7
2B8
GND
2SBA
2CLKBA
2OE
The ’LVTH16646 devices are 16-bit bus
transceivers and registers designed for
low-voltage (3.3-V) VCC operation, but with the
capability to provide a TTL interface to a 5-V
system environment.
ORDERING INFORMATION
TA
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
SSOP − DL
TSSOP − DGG
Tube
SN74LVTH16646DL
Tape and reel
SN74LVTH16646DLR
Tape and reel
SN74LVTH16646DGGR
TOP-SIDE
MARKING
LVTH16646
LVTH16646
−55°C to 125°C
CFP − WD
Tube
SNJ54LVTH16646WD
SNJ54LVTH16646WD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2004, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(& *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &.( '*$%&' ('!(*! /(**('0
*"!$#"' +*"#&'1 !"& '" '&#&(*-0 '#-$!& &'1 ") (-+(*(%&&*
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1
SCBS698G − JULY 1997 − REVISED MAY 2004
description/ordering information (continued)
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is clocked
into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1
illustrates the four fundamental bus-management functions that can be performed with the ’LVTH16646
devices.
Output-enable (OE) and direction-control (DIR) inputs are provided to control the transceiver functions. In the
transceiver mode, data present at the high-impedance port may be stored in either register or in both. The
select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. The circuitry
used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition
between stored and real-time data. DIR determines which bus receives data when OE is low. In the isolation
mode (OE high), A data can be stored in one register and/or B data can be stored in the other register.
When an output function is disabled, the input function still is enabled and can be used to store and transmit
data. Only one of the two buses, A or B, can be driven at a time.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE
INPUTS
DATA I/O
OE
DIR
CLKAB
CLKBA
SAB
SBA
A1−A8
B1−B8
X
X
↑
X
X
X
Input
Unspecified†
OPERATION OR FUNCTION
X
X
X
↑
X
X
Unspecified†
Input
Store A, B unspecified†
Store B, A unspecified†
H
X
↑
↑
X
X
Input
Input
Store A and B data
H
X
H or L
H or L
X
X
Input disabled
Input disabled
Isolation, hold storage
L
L
X
X
X
L
Output
Input
Real-time B data to A bus
L
L
X
H or L
X
H
Output
Input
Stored B data to A bus
L
H
X
X
L
X
Input
Output
Real-time A data to B Bus
L
H
H or L
X
H
X
Input
Output
Stored A data to bus
† The data-output functions can be enabled or disabled by various signals at OE or DIR. Data-input functions always are enabled, i.e., data at the
bus terminals is stored on every low-to-high transition of the clock inputs.
2
POST OFFICE BOX 655303
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OE
L
DIR
L
CLKAB CLKBA
X
X
SAB
X
BUS B
BUS A
BUS A
BUS B
SCBS698G − JULY 1997 − REVISED MAY 2004
SBA
L
OE
L
DIR
H
DIR
X
X
X
CLKAB CLKBA
↑
X
↑
X
↑
↑
SAB
L
SBA
X
BUS B
BUS A
BUS A
OE
X
X
H
CLKBA
X
REAL-TIME TRANSFER
BUS A TO BUS B
BUS B
REAL-TIME TRANSFER
BUS B TO BUS A
CLKAB
X
SAB
SBA
X
X
X
X
X
X
STORAGE FROM
A, B, OR A AND B
OE
L
L
DIR
L
H
CLKAB
X
H or L
CLKBA
H or L
X
SAB
X
H
SBA
H
X
TRANSFER STORED DATA
TO A AND/OR B
Figure 1. Bus-Management Functions
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3
SCBS698G − JULY 1997 − REVISED MAY 2004
logic diagram (positive logic)
1OE
1DIR
1CLKBA
1SBA
1CLKAB
1SAB
56
1
55
54
2
3
One of Eight Channels
1D
C1
1A1
5
52
1B1
1D
C1
2OE
2DIR
2CLKBA
2SBA
2CLKAB
2SAB
To Seven Other Channels
29
28
30
31
27
26
One of Eight Channels
1D
C1
2A1
15
42
1D
C1
To Seven Other Channels
4
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2B1
SCBS698G − JULY 1997 − REVISED MAY 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO: SN54LVTH16646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74LVTH16646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2): SN54LVTH16646 . . . . . . . . . . . . . . . . . . . . . 48 mA
SN74LVTH16646 . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51−7.
recommended operating conditions (see Note 4)
SN54LVTH16646
SN74LVTH16646
MIN
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
5.5
5.5
V
IOH
IOL
High-level output current
−24
−32
mA
Low-level output current
48
64
mA
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−55
High-level input voltage
2
2
0.8
Outputs enabled
V
0.8
10
10
−40
V
ns/V
µs/V
200
125
V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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!&1' +(& ") !&2&-"+%&' (*(#&*# !(( ('! "&*
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5
SCBS698G − JULY 1997 − REVISED MAY 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
II = −18 mA
IOH = −100 µA
VCC = 2.7 V,
IOH = −8 mA
IOH = −24 mA
VCC = 3 V
VOL
VCC = 3 V
Ioff
II(hold)
A or B ports
SN74LVTH16646
TYP†
MAX
MIN
−1.2
VCC−0.2
2.4
−1.2
2
0.2
0.2
IOL = 24 mA
IOL = 16 mA
0.5
0.5
0.4
0.4
IOL = 32 mA
IOL = 48 mA
0.5
0.5
0.55
±1
±1
10
20
20
VCC = 3.6 V
VI = VCC
VI = 0
1
1
VCC = 0,
VI or VO = 0 to 4.5 V
VI = 0.8 V
−5
VI = 2 V
VI = 0 to 3.6 V
VCC = 3.6 V§,
V
0.55
10
VCC = 3 V
V
V
2
VI = 5.5 V
VI = 5.5 V
VCC = 3.6 V,
VCC = 0 or 3.6 V,
UNIT
VCC−0.2
2.4
IOL = 64 mA
VI = VCC or GND
II
A or B ports‡
MIN
IOH = −32 mA
IOL = 100 µA
VCC = 2.7 V
Control inputs
SN54LVTH16646
TYP†
MAX
TEST CONDITIONS
µA
−5
±100
75
75
−75
−75
µA
µA
±500
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don’t care
±100*
± 100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don’t care
±100*
±100
µA
0.19
0.19
ICC
VCC = 3.6 V, IO = 0,
VI = VCC or GND
5
5
0.19
0.19
0.2
0.2
Outputs high
Outputs low
Outputs disabled
∆ICC¶
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
4
4
mA
mA
pF
Cio
10
10
pF
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ Unused pins at VCC or GND
§ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
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+&#)#("' (*& !&1' 1"(- &.( '*$%&' *&&*2& & *1 "
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6
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SCBS698G − JULY 1997 − REVISED MAY 2004
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 2)
SN54LVTH16646
VCC = 3.3 V
± 0.3 V
MIN
fclock
tw
Clock frequency
MAX
SN74LVTH16646
VCC = 2.7 V
MIN
MAX
150
Pulse duration, CLK high or low
tsu
Setup time,
A or B before CLKAB↑ or CLKBA↑
th
Hold time,
A or B after CLKAB↑ or CLKBA↑
Data high
Data low
VCC = 3.3 V
± 0.3 V
MIN
150
MAX
VCC = 2.7 V
MIN
150
MAX
150
3.3
3.3
3.3
3.3
1.2
1.5
1.2
1.5
2
2.8
2
2.8
Data high
0.5
0
0.5
0
Data low
0.5
0.5
0.5
0.5
UNIT
MHz
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 2)
SN54LVTH16646
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
MIN
fmax
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPZH
tPZL
tPHZ
tPLZ
MAX
150
CLKBA or
CLKAB
A or B
A or B
B or A
SBA or SAB‡
A or B
OE
A or B
OE
A or B
DIR
A or B
DIR
A or B
SN74LVTH16646
VCC = 2.7 V
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
TYP†
VCC = 2.7 V
MAX
150
MIN
UNIT
MAX
150
MHz
1.3
4.5
5
1.3
2.8
4.2
4.7
1.3
4.5
5
1.3
2.8
4.2
4.7
1
3.6
4.1
1
2.4
3.4
3.9
1
3.6
4.1
1
2.1
3.4
3.9
1
4.7
5.6
1
2.8
4.5
5.4
1
4.7
5.6
1
3
4.5
5.4
1
4.5
5.4
1
2.5
4.3
5.2
1
4.5
5.4
1
2.6
4.3
5.2
2
5.8
6.3
2
4
5.6
6.1
2
5.6
6.3
2
3.6
5.4
6.1
1
4.6
5.5
1
3
4.4
5.3
1
4.6
5.5
1
3
4.4
5.3
1.5
6
7.1
1.5
3.9
5.7
6.8
1.5
5.5
6
1.5
3.6
5.2
5.7
ns
ns
ns
ns
ns
ns
ns
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ These parameters are measured with the internal output state of the storage register opposite that of the bus input.
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7
SCBS698G − JULY 1997 − REVISED MAY 2004
PARAMETER MEASUREMENT INFORMATION
6V
S1
500 Ω
From Output
Under Test
GND
CL = 50 pF
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
Open
500 Ω
2.7 V
Timing Input
LOAD CIRCUIT
1.5 V
0V
tw
tsu
2.7 V
Input
1.5 V
1.5 V
th
2.7 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
Output
1.5 V
VOL
tPHL
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPLZ
3V
1.5 V
tPZH
VOH
Output
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLH
1.5 V
2.7 V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
8
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PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVTH16646DGGRE4
ACTIVE
TSSOP
DGG
56
2000
74LVTH16646DLRG4
ACTIVE
SSOP
DL
56
SN74LVTH16646DGGR
ACTIVE
TSSOP
DGG
SN74LVTH16646DL
ACTIVE
SSOP
SN74LVTH16646DLG4
ACTIVE
SN74LVTH16646DLR
ACTIVE
Pb-Free
(RoHS)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-250C-UNLIM
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LVTH16646DGGR
TSSOP
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
SN74LVTH16646DLR
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVTH16646DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74LVTH16646DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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