TI ULQ2003AD

ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS
Check for Samples: ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A
FEATURES
1
•
•
•
•
•
500-mA-Rated Collector Current (Single
Output)
High-Voltage Outputs: 50 V
Output Clamp Diodes
Inputs Compatible With Various Types of
Logic
Relay-Driver Applications
ULN2002A . . . N PACKAGE
ULN2003A . . . D, N, NS, OR PW PACKAGE
ULN2004A . . . D, N, OR NS PACKAGE
ULQ2003A, ULQ2004A . . . D OR N PACKAGE
(TOP VIEW)
1B
2B
3B
4B
5B
6B
7B
E
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1C
2C
3C
4C
5C
6C
7C
COM
DESCRIPTION
The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current
Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with
common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington
pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay
drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers.
For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and
SN75469, respectively.
The ULN2001A is a general-purpose array and can be used with TTL and CMOS technologies. The ULN2002A
is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a Zener diode
and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have a 2.7-kΩ
series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The
ULN2004A and ULQ2004A have a 10.5-kΩ series base resistor to allow operation directly from CMOS devices
that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the
ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1976–2010, Texas Instruments Incorporated
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
PDIP – N
–20°C to 70°C
SOIC – D
SOP – NS
TSSOP – PW
PDIP – N
–40°C to 85°C
SOIC – D
PDIP – N
–40°C to 105°C
SOIC – D
TSSOP – PW
(1)
(2)
ORDERABLE PART NUMBER
Tube of 25
ULN2002AN
ULN2003AN
ULN2003AN
ULN2004AN
ULN2004AN
Tube of 40
ULN2003AD
Reel of 2500
ULN2003ADR
Reel of 2500
ULN2003ADRG3
Tube of 40
ULN2004AD
Reel of 2500
ULN2004ADR
Reel of 2000
ULN2003A
ULN2004A
ULN2003ANSR
ULN2003A
ULN2004ANSR
ULN2004A
Tube of 90
ULN2003APW
Reel of 2000
ULN2003APWR
Tube of 25
TOP-SIDE MARKING
ULN2002AN
UN2003A
ULQ2003AN
ULQ2003A
ULQ2004AN
ULQ2004AN
Tube of 40
ULQ2003AD
Reel of 2500
ULQ2003ADR
Tube of 40
ULQ2004AD
Reel of 2500
ULQ2004ADR
Tube of 425
ULN2003AIN
Tube of 40
ULN2003AID
Reel of 2500
ULN2003AIDR
Reel of 2500
ULN2003AIPWR
ULQ2003A
ULQ2004A
ULN2003AIN
ULN2003AI
UN2003AI
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
LOGIC DIAGRAM
9
COM
1
16
1C
1B
2
15
2C
2B
3
14
3C
3B
4
13
4C
4B
5
12
5C
5B
6
11
6C
6B
7
7B
2
Submit Documentation Feedback
10
7C
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
SCHEMATICS (EACH DARLINGTON PAIR)
10.5 kW
7.2 kW
3 kW
ULN2002A
RB
ULN/ULQ2003A: RB = 2.7 kW
ULN2003AI: RB = 2.7 kW
7.2 kW
3 kW
ULN/ULQ2004A: RB = 10.5 kW
ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A
All resistor values shown are nominal.
The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go
below ground an external Schottky diode should be added to clamp negative undershoots.
Copyright © 1976–2010, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
3
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
at 25°C free-air temperature (unless otherwise noted)
MIN
VCC
VI
V
Clamp diode reverse voltage (2)
50
V
Input voltage (2)
30
V
500
mA
500
mA
–2.5
A
See Figure 14 and
Figure 15
Output clamp current
Total emitter-terminal current
TA
Operating free-air temperature range
Package thermal impedance (3)
qJA
UNIT
50
Peak collector current
IOK
MAX
Collector-emitter voltage
(4)
ULN200xA
–20
70
ULN200xAI
–40
105
ULQ200xA
–40
85
ULQ200xAT
–40
105
D package
73
N package
67
NS package
64
PW package
108
D package
°C/W
36
qJC
Package thermal impedance (5)
TJ
Operating virtual junction temperature
150
°C
Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds
260
°C
150
°C
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
(6)
°C
N package
Storage temperature range
54
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.
Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Maximum power dissipation is a function of TJ(max), qJC, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/qJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with MIL-STD-883.
ELECTRICAL CHARACTERISTICS
TA = 25°C
PARAMETER
VI(on)
VCE(sat)
On-state input voltage
Collector-emitter saturation voltage
VF
Clamp forward voltage
ICEX
Collector cutoff current
TEST
FIGURE
Figure 6
Figure 4
TEST CONDITIONS
MAX
0.9
1.1
IC = 300 mA
II = 250 mA,
IC = 100 mA
II = 350 mA,
IC = 200 mA
1
1.3
II = 500 mA,
IC = 350 mA
1.2
1.6
13
1.7
2
Figure 7
IF = 350 mA
Figure 1
VCE = 50 V,
II = 0
50
Figure 2
VCE = 50 V,
TA = 70°C
II = 0
100
VI = 6 V
500
IC = 500 mA
Off-state input current
Figure 2
VCE = 50 V,
II
Input current
Figure 3
VI = 17 V
IR
Clamp reverse current
Figure 6
VR = 50 V
Ci
Input capacitance
Submit Documentation Feedback
TYP
VCE = 2 V,
II(off)
4
ULN2002A
MIN
VI = 0,
50
65
0.82
TA = 70°C
V
V
V
mA
mA
1.25
100
50
f = 1 MHz
UNIT
25
mA
mA
pF
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
ELECTRICAL CHARACTERISTICS
TA = 25°C
PARAMETER
TEST
FIGURE
TEST CONDITIONS
ULN2003A
MIN
TYP
ULN2004A
MAX
MIN
TYP
IC = 125 mA
VI(on)
On-state input voltage
Figure 6
VCE = 2 V
2.4
IC = 250 mA
2.7
6
IC = 275 mA
7
ICEX
VF
Collector cutoff current
Clamp forward voltage
Figure 5
8
II = 250 mA,
IC = 100 mA
0.9
1.1
0.9
1.1
II = 350 mA,
IC = 200 mA
1
1.3
1
1.3
1.2
1.6
1.2
1.6
II = 500 mA,
IC = 350 mA
Figure 1
VCE = 50 V,
II = 0
50
50
Figure 2
VCE = 50 V,
TA = 70°C
II = 0
100
100
Figure 8
IF = 350 mA
VCE = 50 V,
TA = 70°C,
II(off)
Off-state input current
Figure 3
II
Input current
Figure 4
VI = 6 V
50
VI = 17 V
IR
Clamp reverse current
Ci
Input capacitance
Figure 7
VR = 50 V
VI = 0,
V
mA
500
1.7
IC = 500 mA
V
3
IC = 350 mA
Collector-emitter
saturation voltage
UNIT
5
IC = 200 mA
IC = 300 mA
VCE(sat)
MAX
2
65
50
0.93
2
65
V
mA
1.35
TA = 70°C
f = 1 MHz
1.7
15
0.35
0.5
1
1.45
50
50
100
100
25
15
25
mA
mA
pF
ELECTRICAL CHARACTERISTICS
TA = 25°C
PARAMETER
VI(on)
On-state input voltage
TEST FIGURE
Figure 6
VCE = 2 V
MIN
TYP
MAX
IC = 200 mA
2.4
IC = 250 mA
2.7
IC = 300 mA
3
II = 250 mA,
IC = 100 mA
0.9
1.1
II = 350 mA,
IC = 200 mA
1
1.3
II = 500 mA,
IC = 350 mA
1.2
1.6
VCE = 50 V,
II = 0
VCE(sat)
Collector-emitter saturation voltage
Figure 5
ICEX
Collector cutoff current
Figure 1
VF
Clamp forward voltage
Figure 8
IF = 350 mA
II(off)
Off-state input current
Figure 3
VCE = 50 V,
II
Input current
Figure 4
VI = 3.85 V
IR
Clamp reverse current
Figure 7
VR = 50 V
Ci
Input capacitance
Copyright © 1976–2010, Texas Instruments Incorporated
ULN2003AI
TEST
CONDITIONS
VI = 0,
1.7
IC = 500 mA
50
f = 1 MHz
15
V
mA
2
V
mA
1.35
mA
50
mA
25
pF
Submit Documentation Feedback
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
V
50
65
0.93
UNIT
5
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = –40°C to 105°C
PARAMETER
VI(on)
TEST FIGURE
On-state input voltage
Figure 6
ULN2003AI
TEST CONDITIONS
VCE = 2 V
MIN
TYP
MAX
IC = 200 mA
2.7
IC = 250 mA
2.9
IC = 300 mA
IC = 100 mA
0.9
1.2
II = 350 mA,
IC = 200 mA
1
1.4
1.2
Collector-emitter saturation voltage
Figure 5
II = 500 mA,
IC = 350 mA
ICEX
Collector cutoff current
Figure 1
VCE = 50 V,
II = 0
VF
Clamp forward voltage
Figure 8
IF = 350 mA
II(off)
Off-state input current
Figure 3
VCE = 50 V,
II
Input current
Figure 4
VI = 3.85 V
IR
Clamp reverse current
Figure 7
VR = 50 V
Ci
Input capacitance
1.7
IC = 500 mA
30
f = 1 MHz
15
V
1.7
100
mA
2.2
V
1.35
mA
100
mA
25
pF
65
0.93
VI = 0,
V
3
II = 250 mA,
VCE(sat)
UNIT
mA
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST
FIGURE
TEST CONDITIONS
ULQ2003A
MIN
TYP
ULQ2004A
MAX
MIN
TYP
IC = 125 mA
VI(on)
On-state input voltage
Figure 6
VCE = 2 V
2.7
IC = 250 mA
2.9
6
IC = 275 mA
7
ICEX
Collector cutoff current
IC = 100 mA
II = 350 mA,
II = 500 mA,
Figure 1
VCE = 50 V,
II = 0
Figure 2
VCE = 50 V,
TA = 70°C
II = 0
100
VI = 6 V
500
VF
Clamp forward voltage
Figure 8
IF = 350 mA
II(off)
Off-state input current
Figure 3
VCE = 50 V,
TA = 70°C,
II
Input current
Figure 4
0.9
1.2
IC = 200 mA
1
IC = 350 mA
1.2
IC = 500 mA
Clamp reverse current
Ci
Input capacitance
6
Figure 7
Submit Documentation Feedback
VR = 50 V
VI = 0,
1.1
1.4
1
1.3
1.7
1.2
1.6
TA = 25°C
15
V
50
2.3
65
0.93
f = 1 MHz
0.9
100
1.7
VI = 17 V
IR
8
II = 250 mA,
Figure 5
V
3
IC = 350 mA
Collector-emitter
saturation voltage
UNIT
5
IC = 200 mA
IC = 300 mA
VCE(sat)
MAX
1.7
50
2
65
mA
V
mA
1.35
0.35
0.5
1
1.45
100
50
100
100
25
15
25
mA
mA
pF
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
SWITCHING CHARACTERISTICS
TA = 25°C
PARAMETER
ULN2002A, ULN2003A,
ULN2004A
TEST CONDITIONS
MIN
tPLH
Propagation delay time, low- to high-level output
See Figure 9
tPHL
Propagation delay time, high- to low-level output
See Figure 9
VOH
High-level output voltage after switching
VS = 50 V, IO = 300 mA, See Figure 10
TYP
MAX
0.25
1
0.25
1
VS – 20
UNIT
ms
ms
mV
SWITCHING CHARACTERISTICS
TA = 25°C
PARAMETER
ULN2003AI
TEST CONDITIONS
MIN
TYP
MAX
tPLH
Propagation delay time, low- to high-level output
See Figure 9
0.25
1
tPHL
Propagation delay time, high- to low-level output
See Figure 9
0.25
1
VOH
High-level output voltage after switching
VS = 50 V, IO ≈ 300 mA, See Figure 10
VS – 20
UNIT
ms
ms
mV
SWITCHING CHARACTERISTICS
TA = –40°C to 105°C
PARAMETER
ULN2003AI
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tPLH
Propagation delay time, low- to high-level output
See Figure 9
1
10
ms
tPHL
Propagation delay time, high- to low-level output
See Figure 9
1
10
ms
VOH
High-level output voltage after switching
VS = 50 V, IO ≈ 300 mA, See Figure 10
VS – 50
mV
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
ULQ2003A, ULQ2004A
TEST CONDITIONS
MIN
tPLH
Propagation delay time, low- to high-level output
See Figure 9
tPHL
Propagation delay time, high- to low-level output
See Figure 9
VOH
High-level output voltage after switching
VS = 50 V, IO = 300 mA, See Figure 10
Copyright © 1976–2010, Texas Instruments Incorporated
TYP
MAX
1
10
1
10
VS – 20
Submit Documentation Feedback
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
UNIT
ms
ms
mV
7
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Open
Open
VCE
ICEX
VCE
ICEX
Open
VI
Figure 1. ICEX Test Circuit
Open
Figure 2. ICEX Test Circuit
Open
VCE
II(off)
II(on)
IC
Open
VI
Figure 3. II(off) Test Circuit
A.
Figure 4. II Test Circuit
II is fixed for measuring VCE(sat), variable for measuring hFE.
Open
hFE =
IC
II
VCE
II
Open
Figure 5. hFE, VCE(sat) Test Circuit
VI(on)
IC
VCE
IC
Figure 6. VI(on) Test Circuit
VR
IR
VF
IF
Open
Open
Figure 7. IR Test Circuit
Figure 8. VF Test Circuit
Figure 9. Propagation Delay-Time Waveforms
8
Submit Documentation Feedback
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
200 W
≤10 ns
≤5 ns
90%
1.5 V
Input
VIH
(see Note C)
90%
1.5 V
10%
10%
0V
40 µs
VOH
Output
VOL
VOLTAGE WAVEFORMS
A.
The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 Ω.
B.
CL includes probe and jig capacitance.
C.
For testing the ULN2003A, ULN2003AI, and ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V; for the ULN2004A
and the ULQ2004A, VIH = 8 V.
Figure 10. Latch-Up Test Circuit and Voltage Waveforms
Copyright © 1976–2010, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
9
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
TYPICAL CHARACTERISTICS
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN
PARALLEL)
VCE(sat)
VCE(sat) - Collector-Emitter Saturation Voltage - V
2.5
TA = 25°C
2
II = 250 µA
II = 350 µA
II = 500 µA
1.5
1
0.5
0
0
100
200
300
400
500
600
700
800
VCE(sat)
VCE(sat) - Collector-Emitter Saturation Voltage - V
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT (ONE DARLINGTON)
2.5
TA = 25°C
II = 350 µA
1.5
II = 500 µA
1
0.5
0
0
100
300
400
500
600
700
Figure 11.
Figure 12.
COLLECTOR CURRENT
vs
INPUT CURRENT
D PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
800
600
500
IIC
C - Maximum Collector Current - mA
RL = 10 Ω
TA = 25°C
450
IC
IC - Collector Current - mA
200
IC(tot) - Total Collector Current - mA
IC - Collector Current - mA
400
VS = 10 V
350
VS = 8 V
300
250
200
150
100
50
0
500
N=1
400
N=4
N=3
300
N=2
N=6
200 N = 7
N=5
100
TA = 70°C
N = Number of Outputs
Conducting Simultaneously
0
0
25
50
75
100
125
II - Input Current - µA
Figure 13.
10
II = 250 µA
2
Submit Documentation Feedback
150
175
200
0
10
20
30
40
50
60
70
80
90 100
Duty Cycle - %
Figure 14.
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
TYPICAL CHARACTERISTICS (continued)
N PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
MAXIMUM AND TYPICAL INPUT CURRENT
vs
INPUT VOLTAGE
600
2000
TJ = -40°C to 105°C
500
1600
N=1
N=3
N=2
400
N=4
300
N=5
N=6
N=7
Input Current – µA
IIC
C - Maximum Collector Current - mA
1800
200
1400
1200
1000
Maximum
800
600
400
100
0
Typical
TA = 85°C
N = Number of Outputs
Conducting Simultaneously
0
10
20
30
40
50
60
70
200
0
80
2
90 100
2.5
3
3.5
4
Input Voltage – V
4.5
5
Duty Cycle - %
Figure 15.
Figure 16.
MAXIMUM AND TYPICAL SATURATED VCE
vs
OUTPUT CURRENT
MINIMUM OUTPUT CURRENT
vs
INPUT CURRENT
500
2.1
V CE = 2 V
TJ = -40°C to 105°C
TJ = -40°C to 105°C
450
400
Output Current – mA
Maximum VCE(sat) Voltage – V
1.9
1.7
1.5
Maximum
1.3
350
300
250
Minimum
200
1.1
150
Typical
0.9
100
200
300
400
500
100
250
350
450
Output Current – mA
Input Current – µA
Figure 17.
Figure 18.
Copyright © 1976–2010, Texas Instruments Incorporated
550
650
Submit Documentation Feedback
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
11
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027J – DECEMBER 1976 – REVISED JUNE 2010
www.ti.com
APPLICATION INFORMATION
ULN2002A
VSS
V
1
P-MOS
Output
ULQ2003A
VCC
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
V
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
Lam
Test
TTL
Output
Figure 19. P-MOS to Load
ULN2004A
ULQ2004A
VDD
Figure 20. TTL to Load
VCC
V
V
ULQ2003A
1
16
1
16
2
15
2
15
3
14
3
14
4
13
4
13
5
12
5
12
6
11
6
11
7
10
7
10
8
9
8
9
RP
CMOS
Output
TTL
Output
Figure 21. Buffer for Higher Current Loads
12
Submit Documentation Feedback
Figure 22. Use of Pullup Resistors to Increase
Drive Current
Copyright © 1976–2010, Texas Instruments Incorporated
Product Folder Link(s): ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ULN2001AD
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
Samples Not Available
ULN2001ADR
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
Samples Not Available
ULN2001AN
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
Samples Not Available
ULN2002AD
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
Samples Not Available
ULN2002AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Purchase Samples
ULN2002ANE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Purchase Samples
ULN2003AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003ADRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003ADRG3
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
ULN2003ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003AID
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003AIDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003AIDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2003AIDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULN2003AIDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULN2003AIDRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Addendum-Page 1
CU SN
Level-1-260C-UNLIM
Request Free Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Jun-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ULN2003AIN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
ULN2003AINE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
ULN2003AIPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003AIPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003AIPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003AIPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULN2003AIPWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULN2003AIPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULN2003AJ
OBSOLETE
CDIP
J
16
ULN2003AN
ACTIVE
PDIP
N
16
25
ULN2003ANE3
PREVIEW
PDIP
N
16
25
TBD
ULN2003ANE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
ULN2003ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003ANSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003ANSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
TBD
Pb-Free (RoHS)
Addendum-Page 2
Call TI
Call TI
CU NIPDAU N / A for Pkg Type
Call TI
Call TI
CU NIPDAU N / A for Pkg Type
Samples Not Available
Contact TI Distributor
or Sales Office
Samples Not Available
Contact TI Distributor
or Sales Office
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Jun-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ULN2003APWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2003APWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2004AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2004ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2004ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2004ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2004ADRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2004ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ULN2004AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
ULN2004ANE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
ULN2004ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULN2004ANSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2003AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2003ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
ULQ2003ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2003ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2003AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
ULQ2004AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
Addendum-Page 3
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Jun-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ULQ2004ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2004ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2004ADRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
ULQ2004AN
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ULQ2003A, ULQ2004A :
• Automotive: ULQ2003A-Q1, ULQ2004A-Q1
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2010
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
26-May-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ULN2003ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
ULN2003ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
ULN2003AIDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
ULN2003AIPWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
ULN2003ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
ULN2003APWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
ULN2004ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
ULN2004ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
ULN2004ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-May-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ULN2003ADR
SOIC
D
16
2500
346.0
346.0
33.0
ULN2003ADR
SOIC
D
16
2500
333.2
345.9
28.6
ULN2003AIDR
SOIC
D
16
2500
333.2
345.9
28.6
ULN2003AIPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
ULN2003ANSR
SO
NS
16
2000
346.0
346.0
33.0
ULN2003APWR
TSSOP
PW
16
2000
346.0
346.0
29.0
ULN2004ADR
SOIC
D
16
2500
333.2
345.9
28.6
ULN2004ADR
SOIC
D
16
2500
346.0
346.0
33.0
ULN2004ANSR
SO
NS
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated