ALPHA DME3946

Chip On Board Mixer Quads
Features
■ High Volume Automatic Assembly
■ For Microwave MIC Assembly and
Automated High Volume Manufacturing
■ Mechanically Rugged Design
■ 100% DC Tested
■ Three Barrier Heights for Customized
Mixer Performance
Description
Alpha’s ceramic Chip on Board (COB) mixer quads are
designed for high performance RF and microwave receiver
applications. These devices utilize Alpha’s advanced
silicon beamless Schottky technology, combined with
precision ceramic COB assembly techniques, to achieve
a high degree of device reliability in commercial
applications. Performance to 10 GHz is available with the
ring quads in the 106 package, which employs via hole
technology resulting in metalized contacts on the bottom
side and eliminating the need for wire bonds to topside
contacts.
Absolute Maximum Ratings
Characteristic
Maximum Current (IMAX)
Value
50 mA
Power Dissipation (PD) CW
75 mW/Junction
Storage Temperature (TST)
-65°C to +175°C
Operating Temperature (TOP)
-65°C to +150°C
ESD Human Body Model
Class 1B
Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 6/99A
1
Chip On Board Mixer Quads
Electrical Specifications at 25°C
Part Number
∆) VF @ 1 mA1
(∆
(mV)
VF @ 1 mA
(mV)
Barrier
CJ @ 0 V
(pF)
∆) CT @ 0 V2
(∆
(pF)
RT @ 10 mA
Ω)
(Ω
Min.
Max.
Max.
Min.
Max.
Max.
Max.
200
260
15
0.3
0.5
0.07
8
Outline
Drawing
Ring Quad (to 6 GHz)
DMF3926-101
Low
101
DME3927-101
Medium
300
400
15
0.3
0.5
0.07
8
101
DMJ3928-101
High
525
625
15
0.3
0.5
0.07
8
101
DMF3948-106
Low
250
310
15
0.05
0.15
0.07
15
106
DME3949-106
Medium
350
450
15
0.05
0.15
0.07
15
106
DMJ3950-106
High
575
675
15
0.05
0.15
0.07
15
106
200
260
15
0.3
0.5
0.07
8
100
Ring Quad (to 10 GHz)
Crossover Ring Quad (to 6 GHz)
DMF3926-100
Low
DME3927-100
Medium
300
400
15
0.3
0.5
0.07
8
100
DMJ3928-100
High
525
625
15
0.3
0.5
0.07
8
100
260
15
0.3
0.5
0.07
8
103
Back-to-Back Crossover Quad (to 6 GHz)
DMF3945-103
Low
200
DME3946-103
Medium
300
400
15
0.3
0.5
0.07
8
103
DMJ3947-103
High
525
625
15
0.3
0.5
0.07
8
103
Part Number
Barrier
VF @ 1 mA
(mV)
∆) VF @
(∆
1 mA1 (mV)
CJ @ 0 V
(pF)
∆) CT @ 0 V2
(∆
(pF)
RT @ 10 mA
Ω)
(Ω
VB @ 10 µA
(V)
Min.
Max.
Max.
Min.
Max.
Max.
Max.
Min.
Outline
Drawing
Bridge Quad (to 6 GHz)
DMF3929-102
Low
200
260
15
0.3
0.5
0.07
8
2
102
DME3930-102
Medium
300
400
15
0.3
0.5
0.07
8
3
102
DMJ3931-102
High
525
625
15
1. Forward voltage difference between package electrodes.
2. Capacitance difference between package electrodes.
0.3
0.5
0.07
8
4
102
SPICE Model Parameters (Per Junction)
Parameter
Unit
DMF3926
DMF3929
DMF3945
DME3927
DME3930
DME3946
DMJ3928
DMJ3931
DMJ3947
DMF3948
DME3949
DMJ3950
IS
A
2.5E–07
1.3E–09
9.0E–13
4.4E–08
9.3E–10
3.3E–13
RS
Ω
N
4
4
9
9
9
1.04
1.04
1.04
1.04
1.04
TT
s
1E–11
1E–11
1E–11
1E–11
1E–11
1E–11
CJ0
pF
0.42
0.39
0.39
0.11
0.10
0.10
0.32
0.37
0.42
0.32
0.37
0.42
0.69
0.69
0.69
0.69
0.69
0.69
M
EG
2
4
1.04
eV
XTI
2
2
2
2
2
2
FC
0.5
0.5
0.5
0.5
0.5
0.5
BV
V
2
3
4
3
4
5
IBV
A
1.0E–05
1.0E–05
1.0E–05
1.0E–05
1.0E–05
1.0E–05
VJ
V
0.495
0.595
0.800
0.495
0.595
0.800
Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 6/99A
Chip On Board Mixer Quads
100, 101, 102
103
INK DOT 0.010 (0.25 mm) DIA. MIN.
COLOR PER INTERNAL SPECIFICATION
0.005 (0.13 mm)
0.001 (0.02 mm) TYP.
ORIENTATION
DOT
SCHEMATIC
2
DOT
0.140 (3.56 mm)
± 0.003 (0.08 mm)
1
0.026
(0.66 mm) MIN.
0.100 (2.54 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
0.020
(0.51 mm)
±0.003
(0.08 mm)
()
3
6
4
5
0.130 (3.30 mm)
±0.003 (0.08 mm)
GLASS DAM
0.030 (0.76 mm)
±0.003 (0.08 mm)
SQ.
0.120 (3.05 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
EPOXY ENCAPSULATION
(BLACK)
0.020 (0.51 mm)
X 0.010 (0.25 mm)
ORIENTATION MARK
0.040
(1.02 mm)
MAX.
0.020 (0.51 mm)
± 0.002 (0.05 mm)
GLASS NOT
SHOWN FOR CLARITY
106
0.025 (0.64 mm)
±0.003 (0.08 mm)
0.050
(1.27 mm)
MAX.
0.020 (0.51 mm)
±0.002 (0.05 mm)
CERAMIC SUBSTRATE
Notes:
1. Bottom side is free of metalization.
2. The minimum specified area of the contact pads (0.017 x 0.022) shall
be free of epoxy.
0.085 (2.159 mm) SQ.
EPOXY
ENCAPSULATION
0.003
(0.08 mm) TYP.
45˚ REF.
EPOXY
ENCAPSULATION
0.003
(0.08 mm)
TYP
0.015
(0.38 mm)
0.020 (0.51 mm) MAX.
GLASS
0.017
(0.43 mm)
0.026
(0.66 mm)
GOLD METALIZATION
0.024
(0.61 mm)
Pd/Pt /Ag METALIZATION
Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 6/99A
3