TI TS3USB30RSWR

TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
FEATURES
1
APPLICATIONS
•
•
Routes Signals for USB 1.0, 1.1, and 2.0
Mobile Industry Processor Interface (MIPI)
Signal Routing
D1–
D2–
7
6
5
D–
VCC
9
4
GND
S
10
3
D+
1
2
D2+
8
D1+
OE
S
10
VCC
9
OE
8
D2+
RSW PACKAGE
(BOTTOM VIEW)
1
2
7
6
D2–
•
•
RSW PACKAGE
(TOP VIEW)
D1+
•
•
•
•
•
VCC Operation at 3 V and 4.3 V
1.8-V Compatible Control-Pin Inputs
IOFF Supports Partial Power-Down-Mode
Operation
ron = 10 Ω Max
Δron <0.35 Ω Typ
Cio(ON) = 7 pF Typ
Low Power Consumption (1 µA Max)
ESD Performance Tested Per JESD 22
– 6000-V Human-Body Model (HBM)
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)
–3-dB Bandwidth = 955 MHz Typ
Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)
D1–
•
•
•
3
D+
4
GND
5
D–
DESCRIPTION/ORDERING INFORMATION
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
TQFN – RSW
(1) (2)
Tape and reel
ORDERABLE PART NUMBER
TS3USB30RSWR
TOP-SIDE MARKING
L6O
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TS3USB30
SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com
PIN DESCRIPTION
NAME
DESCRIPTION
OE
Bus-switch enable
S
Select input
D+, D–, Dn+, Dn–
Data ports
TRUTH TABLE
S
OE
FUNCTION
X
H
Disconnect
L
L
D = D1
H
L
D = D2
BLOCK DIAGRAM
D1+
D+
D2+
D1–
D–
D2–
S
OE
Control
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
7
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage range (2) (3) (4)
Dn+, Dn–
–0.5 VCC + 0.3
D+, D– when VCC > 0
–0.5 VCC + 0.3
D+, D– when VCC = 0
–0.5
UNIT
V
5.25
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current (5)
±64
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
(4)
(5)
2
Storage temperature range
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
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TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
PACKAGE THERMAL IMPEDANCE (1)
θJA
(1)
Package thermal impedance
RSW package
TYP
UNIT
175
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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TS3USB30
SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
MIN
MAX
3
4.3
VCC = 3 V to 3.6 V
1.3
VCC = 4.3 V
1.7
UNIT
V
V
VCC = 3 V to 3.6 V
0.5
VCC = 4.3 V
0.7
V
0
VCC
V
–40
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
IIN
IOZ
Control inputs
(3)
IOFF
D+ and D–
ICC
TEST CONDITIONS
TYP (2)
MAX
UNIT
–1.2
V
VIN = 0 to 4.3 V
±1
µA
VO = 0 to 3.6 V,
Switch OFF
±2
µA
VCC = 0 V,
VI = 0,
VO = 0 to 4.3 V,
VIN = VCC or GND
±2
µA
1
µA
10
µA
VCC = 3 V,
II = –18 mA
VCC = 4.3 V, 0 V,
VCC = 4.3 V,
VI = 0,
VCC = 4.3 V,
II/O = 0,
ΔICC (4)
Control inputs
VCC = 4.3 V,
VIN = 2.6 V
Cin
Control inputs
MIN
Switch ON or OFF
VCC = 0 V,
VIN = VCC or GND
1
pF
Cio(OFF)
VCC = 3.3 V,
VI/O = 3.3 V or 0,
Switch OFF
2
pF
Cio(ON)
VCC = 3.3 V,
VI/O = 3.3 V or 0,
Switch ON
7
ron (5)
VCC = 3 V,
VI = 0.4,
IO = –8 mA
6
Δron
VCC = 3 V,
VI = 0.4,
IO = –8 mA
0.35
Ω
ron(flat)
VCC = 3 V,
VI = 0 V or 1 V,
IO = –8 mA
2
Ω
(1)
(2)
(3)
(4)
(5)
pF
Ω
10
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
TYP (1)
UNIT
XTALK
Crosstalk
RL = 50 Ω, f = 240 MHz, See Figure 10
–56
OISO
OFF isolation
RL = 50 Ω, f = 240 MHz, See Figure 9
–39
dB
BW
Bandwidth (–3 dB)
RL = 50 Ω, CL = 5 pF, See Figure 11
955
MHz
(1)
4
dB
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
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TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
SWITCHING CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
MIN
RL = 50 Ω, CL = 5 pF,
See Figure 12
(2) (3)
TYP (1)
MAX
tpd
Propagation delay
tON
Line enable time, SEL to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 8
30
ns
tOFF
Line disable time, SEL to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 8
25
ns
tON
Line enable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 8
30
ns
tOFF
Line disable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 8
25
ns
tSK(O)
Output skew between center port to any other port (2)
RL = 50 Ω, CL = 5 pF,
See Figure 13
50
ps
tSK(P)
Skew between opposite transitions of the same output
(tPHL – tPLH) (2)
RL = 50 Ω, CL = 5 pF,
See Figure 13
20
ps
tJ
Total jitter (2)
RL = 50 Ω, CL = 5 pF,
tR = tF = 500 ps at 480 Mbps
(PRBS = 215 – 1)
20
ps
(1)
(2)
(3)
0.25
UNIT
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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TS3USB30
SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
0
–1
–2
Gain (dB)
–3
–4
–5
–6
–7
–8
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
1.0E+9
10.0E+9
Frequency (Hz)
Figure 1. Gain vs Frequency
0
–10
Attenuation (dB)
–20
–30
–40
–50
–60
–70
–80
–90
100.0E+3
1.0E+6
10.0E+6
100.0E+6
Frequency (Hz)
Figure 2. OFF Isolation
6
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TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
0
–10
Attenuation (dB)
–20
–30
–40
–50
–60
–70
–80
–90
–100
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
Frequency (Hz)
Figure 3. Crosstalk
VCC
TS3USB30
1D+
USB2.0
Controller
D+
1D–
Set Top Box
(STB) CPU
or DSP
Processor
USB
Connector
D–
2D+
DVR or
Mass Storage
Controller
2D–
Control
S
OE
Figure 4. Application Diagram
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TS3USB30
SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com
0.5
0.4
Differential Signal (V)
0.3
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Time (X 10–9) (s)
Figure 5. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path)
0.5
0.4
Differential Signal (V)
0.3
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
–9
Time (X 10 ) (s)
Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch NC Path
8
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TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
0.5
0.4
Differential Signal (V)
0.3
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Time (X 10–9) (s)
Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch NO Path
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TS3USB30
SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
1D or 2D VOUT1
VIN
D
1D or 2D VOUT2
(B)
CL
RL
TEST
RL
CL
VIN
tON
50 Ω
5 pF
VCC
tOFF
50 Ω
5 pF
VCC
S
OE
VSEL(A)
1.8 V
Logic
RL
Input
(VSEL or V OE)
CL(B)
GND
50%
50%
0
tON
VOE(A)
Switch
Output
(VOUT1 or V OUT2)
tOFF
90%
90%
VOH
VOL
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 8. Turn-On (tON) and Turn-Off Time (tOFF)
VCC
Network Analyzer
Channel OFF: 1D to D
50 W
VOUT1 1D
VSEL = VCC
D
Source
Signal
50 W
VIN
2D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VSEL S
50 W
+
GND
DC Bias = 350 mV
Figure 9. OFF Isolation (OISO)
10
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www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
Channel ON: 1D to D
50 W
VOUT1 1D
Channel OFF: 2D to D
VIN
Source
Signal
VSEL = VCC
VOUT2 2D
50 W
Network Analyzer Setup
50 W
VSEL S
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 10. Crosstalk (XTALK)
VCC
Network Analyzer
50 W
VOUT1
1D
Channel ON: 1D to D
D
Source
Signal
VIN
VCTRL = GND
2D
Network Analyzer Setup
50 W
VSEL
Source Power = 0 dBm
(632-mV P-P at 50-W load)
S
GND
GND
DC Bias = 350 mV
Figure 11. Bandwidth (BW)
400 mV
Figure 12. Propagation Delay
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PARAMETER MEASUREMENT INFORMATION (continued)
VOH
VOL
Pulse Skew tSK(P)
VOH
VOL
VOH
VOL
Output Skew tSK(P)
Figure 13. Skew Test
12
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PARAMETER MEASUREMENT INFORMATION (continued)
VCC
VOUT1 1D
D
+
VIN
Channel ON
VOUT2 2D
r on +
VSEL
IIN
S
VIN * VOUT2 or VOUT1
W
IIN
VSEL = VIH or VIL
+
GND
Figure 14. ON-State Resistance (ron)
VCC
VOUT1 1D
VIN
D
+
VOUT2 2D
VSEL
+
S
OFF-State Leakage Current
Channel OFF
VSEL = VIH or VIL
+
GND
Figure 15. OFF-State Leakage Current
VCC
VOUT1 1D
Capacitance
Meter
VBIAS
VBIAS = VCC or GND
VOUT2 2D
VSEL = VCC or GND
VIN D
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
VSEL S
GND
Figure 16. Capacitance
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PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TS3USB30RSWR
ACTIVE
QFN
RSW
Pins Package Eco Plan (2)
Qty
10
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3USB30RSWR
Package Package Pins
Type Drawing
QFN
RSW
10
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
3000
179.0
8.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
1.7
2.1
0.7
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3USB30RSWR
QFN
RSW
10
3000
220.0
205.0
50.0
Pack Materials-Page 2
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