CEL UPC8236T6N-A

BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8236T6N
SiGe:C LOW NOISE AMPLIFIER FOR GPS
DESCRIPTION
The PC8236T6N is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise
amplifier for GPS. This device exhibits low noise figure and high power gain characteristics, so this IC can improve the
sensitivity of GPS receiver. In addition, the PC8236T6N which is included output matching circuit contributes to
reduce external components and system size.
The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mount.
This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
• Supply voltage
: VCC = 1.6 to 3.3 V (2.7 V TYP.)
• Low noise
: NF = 0.8 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
: NF = 0.8 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• High gain
: GP = 19.5 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz
: GP = 19.1 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz
• Low current consumption
: ICC = 6.5 mA TYP. @ VCC = 2.7 V
• Built-in power-saving function
: VPSon = 1.0 V to VCC, VPSoff = 0 to 0.4 V
• High-density surface mounting
: 6-pin plastic TSON (T6N) package (1.5  1.5  0.37 mm)
• Included output matching circuit
• Included very robust bandgap regulator (Small VCC and TA dependence)
• Included protection circuits for ESD
APPLICATION
• Low noise amplifier for GPS
ORDERING INFORMATION
Part Number
Order Number
PC8236T6N-E2
PC8236T6N-E2-A
Package
6-pin plastic TSON
(T6N) (Pb-Free)
Marking
6S
Supplying Form
 8 mm wide embossed taping
 Pin 1, 6 face the perforation side of the tape
 Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PC8236T6N-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10713EJ01V0DS (1st edition)
Date Published March 2008 NS
PC8236T6N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
VCC
2
GND
3
INPUT
4
Power Save
5
OUTPUT
6
VCC
Remark Exposed pad : GND
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
4.0
V
Power-Saving Voltage
VPS
TA = +25C
4.0
V
Total Power Dissipation
Ptot
150
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
+10
dBm
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
1.6
2.7
3.3
V
Operating Ambient Temperature
TA
40
+25
+85
C
Power Save Turn-on Voltage
VPSon
1.0

VCC
V
Power Save Turn-off Voltage
VPSoff
0

0.4
V
ELECTRICAL CHARACTERISTICS
(T A = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
MIN.
TYP.
MAX.
Unit
5.0
6.5
8.0
mA
At Power-Saving Mode (VPS = 0 V)


1
A
Pin = 35 dBm
17
19.5
22
dB
No Signal (VPS = 2.7 V)
Power Gain
GP
Noise Figure
NF

0.8
1.1
dB
Input Return Loss
RLin
7.5
11

dB
Output Return Loss
RLout
11
14

dB
2
Data Sheet PU10713EJ01V0DS
PC8236T6N
STANDARD CHARACTERISTICS FOR REFERENCE 1
(T A = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Symbol
Test Conditions
Unit
3
dBm
Input 3rd Order Intercept Point
IIP3
Isolation
ISL
39
dB
Pin (1 dB)
18
dBm
Reference
Unit
Gain 1 dB Compression Input Power
fin1 = 1 575 MHz, f in2 = 1 574 MHz
Reference
STANDARD CHARACTERISTICS FOR REFERENCE 2
(T A = +25C, VCC = VPS = 1.8 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Symbol
Test Conditions
Circuit Current
ICC
No Signal (VPS = 1.8 V)
6.2
mA
Power Gain
GP
Pin = 35 dBm
19.1
dB
Noise Figure
NF
0.8
dB
Input 3rd Order Intercept Point
IIP3
5
dBm
Input Return Loss
RLin
11
dB
Output Return Loss
RLout
14
dB
ISL
39
dB
Pin (1 dB)
19
dBm
Isolation
Gain 1 dB Compression Input Power
fin1 = 1 575 MHz, f in2 = 1 574 MHz
TEST CIRCUIT
Data Sheet PU10713EJ01V0DS
3
PC8236T6N
TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
4
Data Sheet PU10713EJ01V0DS
PC8236T6N
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
5
PC8236T6N
Remark The graphs indicate nominal characteristics.
6
Data Sheet PU10713EJ01V0DS
PC8236T6N
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
7
PC8236T6N
S-PARAMETERS (T A = +25C, VCC = VPS = 2.7 V, monitored at connector on board)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10713EJ01V0DS
PC8236T6N
S-PARAMETERS (T A = +25C, VCC = VPS = 1.8 V, monitored at connector on board)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
9
PC8236T6N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6N) (UNIT: mm)
10
Data Sheet PU10713EJ01V0DS
PC8236T6N
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10713EJ01V0DS
11