TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 FEATURES • • • • • • • • • • • DGG OR DGV PACKAGE (TOP VIEW) Wide Bandwidth (BW = 900 MHz Typ, 1.8 Gbps) Low Crosstalk (XTALK = –41 dB Typ) Low Bit-to-Bit Skew (tsk(o) = 0.2 ns Max) Low and Flat ON-State Resistance (ron = 4 Ω Typ, ron(flat) = 0.7 Ω Typ) Low Input/Output Capacitance (CON = 10 pF Typ) Rail-to-Rail Switching on Data I/O Ports (0 to 5 V) VDD Operating Range From 3 V to 3.6 V Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Applications – Digital Video Signal Switching – Differential DVI, HDMI Signal Muxing for Audio/Video Receivers and High Definition Television (HDTV) VDD A0 GND A1 GND VDD GND A2 GND A3 GND VDD GND NC A4 GND A5 GND VDD GND A6 GND A7 SEL 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 0B1 1B1 GND 0B2 1B2 GND 2B1 3B1 GND 2B2 3B2 GND VDD 4B1 5B1 GND 4B2 5B2 GND 6B1 7B1 GND 6B2 7B2 NC − No internal connection DESCRIPTION/ORDERING INFORMATION The TS3DV416 is a 16-bit to 8-bit multiplexer/demultiplexer digital video switch with a single select (SEL) input. SEL controls the data path of the multiplexer/demultiplexer. The device provides a low and flat on-state resistance (ron) and an excellent on-resistance match. Low input/output capacitance, high-bandwidth, low skew, and low crosstalk among channels make this device suitable for various digital video applications, such as DVI and HDMI. TYPICAL APPLICATION DVD Player Digital TV TS3DV416 STB DVI Receiver Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) ORDERABLE PART NUMBER TSSOP – DGG Tape and reel TS3DV416DGGR TBD TVSOP – DGV Tape and reel TS3DV416DGVR TBD Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUT SEL INPUT/ OUTPUT An FUNCTION L nB1 An = nB1 nB2 high-impedance mode H nB2 An = nB2 nB1 high-impedance mode PIN DESCRIPTION 2 TOP-SIDE MARKING NAME DESCRIPTION An Data I/O nBm Data I/O SEL Select input TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 2 48 4 47 0B1 A0 1B1 A1 45 0B2 44 1B2 8 42 2B1 A2 10 41 3B1 A3 39 2B2 38 3B2 15 35 17 34 4B1 A4 5B1 A5 32 4B2 31 5B2 21 29 23 28 6B1 A6 7B1 A7 26 6B2 25 7B2 SEL 24 3 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±128 mA ±100 mA II/O ON-state switch –0.5 current (5) Continuous current through VCC or GND θJA Package thermal impedance (6) Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 7 DGG package 70 DGV package 58 –65 UNIT V °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN MAX UNIT VCC Supply voltage 3 3.6 V VIH High-level control input voltage (SEL) 2 5.5 V VIL Low-level control input voltage (SEL) 0 0.8 V VI/o Input/output voltage 0 5.5 V TA Operating free-air temperature –40 85 °C (1) 4 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 Electrical Characteristics (1) for high frequency switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX –0.7 –1.2 V UNIT VIK SEL VDD = 3.6 V, IIN = –18 mA IIH SEL VDD = 3.6 V, VIN = VDD ±1 µA IIL SEL VDD = 3.6 V, VIN = GND ±1 µA Ioff VDD = 0 VO = 0 to 3.6 V, VI = 0 ICC VDD = 3.6 V, II/O = 0, Switch ON or OFF CIN SEL f = 1 MHz, VIN = 0 COFF B port 1 µA 250 600 mA 2.5 3 pF VI = 0, f = 1 MHz, Outputs open, Switch OFF 3.5 4 pF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 10 10.9 pF ron VDD = 3 V, 1.5 V ≤ VI ≤ VDD, IO = –40 mA 4 8 Ω VDD = 3 V, VI = 1.5 V and VDD, IO = –40 mA 0.7 VCC = 3 V, 1.5 V ≤ VI ≤ VCC, IO = –40 mA 0.2 1.2 TYP (1) MAX ron(flat) (3) ∆ron (4) (1) (2) (3) (4) Ω Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. ∆ron is the difference of ron from center (A4, A5) ports to any other port. Switching Characteristics over recommended operating free-air temperature range VDD = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figure 4 and Figure 5) FROM (INPUT) TO (OUTPUT) A or B B or A SEL A or B 1.5 tPHZ, tPLZ SEL A or B 1 tsk(o) (3) A or B B or A PARAMETER tpd (2) tPZH, tPZL MIN 0.04 tsk(p) (4) (1) (2) (3) (4) UNIT ns 11.5 ns 8.5 ns 0.1 0.2 ns 0.1 0.2 ns All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port (A4 to A5) to any other port Skew between opposite transitions of the same output in a given device |tPHL– tPLH| Dynamic Characteristics over recommended operating free-air temperature range VDD = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER (1) TEST CONDITIONS TYP (1) UNIT XTALK RL = 100 Ω, f = 250 MHz, See Figure 7 –41 OIRR RL = 100 Ω, f = 250 MHz, See Figure 8 –39 dB BW See Figure 6 900 MHz dB All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. 5 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 OPERATING CHARACTERISTICS 0 −1 −2 Gain − dB −3 −4 −5 −6 −7 −8 −9 1 10 100 1,000 10,000 Frequency − MHz Gain at 900 MHz, −3 dB Figure 1. Gain vs Frequency 0 −20 Off-Isolation − dB −40 −60 −80 −100 −120 1 10 100 1,000 Frequency − MHz OFF Isolation at 250 MHz, −39 dB Figure 2. OFF Isolation vs Frequency 6 10,000 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 OPERATING CHARACTERISTICS 0 −20 Crosstalk − dB −40 −60 −80 −100 −120 1 10 100 1,000 10,000 Frequency − MHz Crosstalk at 250 MHz, −41 dB Figure 3. Crosstalk vs Frequency 7 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 APPLICATION INFORMATION 1 − TMDS Data 2 2 TMDS Data 2+ 9 10 17 TMDS Data 1 − 18 TMDS Data 1+ 23 24 TMDS Data 2 − TMDS Data 2 − Data 2+ TMDSTMDS Data 2+ TMDS Data 1 − TMDS Data 1 − TMDS Data 1+ TMDS Data 1+ TMDS Data 0 − TMDS Data 0 − TMDS Data 0+ TMDS Data 0+ TMDS Clock+ TMDS Clock+ TMDS Clock − TMDS Clock − TMDS Data 0 − DVI Connector 1 (Single Link) TMDS Data 0+ TMDS Clock+ TMDS Clock − 1 To DVI Receiver 2 9 10 TMDS Data 2 − 1 TMDS Data 2+ 2 TMDS Data 1 − 9 TMDS Data 1+ 10 TS3DV416 Pin Typical DVI Connector 1 9 4 5 6 7 8 10 2 11 3 12 13 14 15 16 17 18 19 20 21 22 23 24 C1 C2 C5 C3 C4 The TS3DV416 can be used to switch between two digital video ports. 8 Name DVI Connector Pin Assignments Function 1 2 3 4 5 6 7 8 9 TMDS Data 2− Digital red − (Link 1) TMDS Data 2+ Digital red + (Link 1) TMDS Data 1− Digital green − (Link 1) 10 TMDS Data 1+ Digital green + (Link 1) 11 TMDS Data 1/3 shield 12 TMDS Data 3− Digital blue − (Link 2) 13 TMDS Data 3+ Digital blue + (Link 2) 14 +5V Power for monitor when in standby 15 Ground Return for pin 14 and analog sync 16 Hot Plug Detect 17 TMDS data 0− Digital blue − (Link 1) and digital sync 18 TMDS data 0+ Digital blue + (Link 1) and digital sync 19 TMDS data 0/5 shield 20 TMDS data 5− Digital red − (Link 2) 21 TMDS data 5+ Digital red + (Link 2) 22 TMDS clock shield 23 TMDS clock+ Digital clock + (Links 1 and 2) 24 TMDS clock− Digital clock − (Links 1 and 2) C1 C2 C3 C4 C5 Analog Red TMDS Data 2/4 shield TMDS Data 4− Digital green − (Link 2) TMDS Data 4+ Digital green + (Link 2) DDC clock DDC data Analog Vertical Sync Analog Green Analog Blue Analog Horizontal Sync Analog Ground Return for R, G and B signals 17 TMDS Data 0 18 TMDS Data 0+ 23 TMDS Clock+ 23 24 TMDS Clock − 24 − DVI Connector 2 (Single Link) 17 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) VDD Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator RL VO VI S1 Open GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VDD S1 RL VI CL V∆ tPLZ/tPZL 3.3 V ± 0.3 V 2 × VDD 200 Ω GND 10 pF 0.3 V tPHZ/tPZH 3.3 V ± 0.3 V GND 200 Ω VDD 10 pF 0.3 V Output Control (VIN) 2.5 V 1.25 V Output Waveform 1 S1 at 2 VDD tPZL (see Note B) 0V tPLZ VOH VDD/2 tPZH Output Waveform 2 S1 at GND (see Note B) 1.25 V VOL +0.3 V VOL tPHZ VDD/2 VOH −0.3 V VOH VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. Figure 4. Test Circuit and Voltage Waveforms 9 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION (Skew) VDD Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator RL VO VI S1 Open GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VDD S1 RL VI CL tsk(o) 3.3 V ± 0.3 V Open 200 Ω VDD or GND 10 pF tsk(p) 3.3 V ± 0.3 V Open 200 Ω VDD or GND 10 pF V∆ 3.5 V 2.5 V 1.5 V Data In at Ax or Ay tPLHx tPHLx VOH 0.5 V (VOH − VOL) VOL Data Out at XB1 or XB2 tsk(o) 2.5 V 1.5 V tsk(o) tPLH VOH 0.5 V (VOH − VOL) VOL Data Out at YB1 or YB2 tPLHy 3.5 V Input tPHLy tPHL VOH 0.5 V (VOH − VOL) VOL Output tsk(p) = tPHL − tPLH tsk(o) = tPLHy − tPLHx or tPHLy − TPHLx VOLTAGE WAVEFORMS OUTPUT SKEW (tsk(o)) VOLTAGE WAVEFORMS PULSE SKEW (tsk(p)) NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 5. Test Circuit and Voltage Waveforms 10 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 SEL 0B1 DUT CL = 10 pF (see Note A) VSEL NOTE A: CL includes probe and jig capacitance. Figure 6. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 11 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B1 RL = 100 Ω A1 1B1 0B2 DUT A2 1B2 2B1 RL = 100 Ω A3 3B1 2B2 3B2 SEL VSEL NOTES: A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 7. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0and A1 is the input, the output is measured at A3. All unused analog input (A) ports are connected to GND, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 TS3DV416 4-CHANNEL DIFFERENTIAL 8:16 MUX SWITCH FOR DVI/HDMI APPLICATIONS www.ti.com SCDS198 – OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B1 RL = 100 Ω A1 1B1 DUT 0B2 1B2 SEL VSEL NOTES: A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 8. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VSEL = GND and A1 is the input, the output is measured at 1B2. All unused analog input (A) ports are connected to ground, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 13 PACKAGE OPTION ADDENDUM www.ti.com 11-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3DV416DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3DV416DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3DV416DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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