AUK SG1316

SG1316
Semiconductor
Chip LED Lamp
Features
•
•
•
•
1.6mm(L)×0.8mm small size surface mount type
Thin package of 0.55mm(H) thickness
Transparent clear lens optic
Low power consumption type chip LED
Applications
•
•
•
•
LCD backlighting
Keypad backlighting
Symbol backlighting
Front panel indicator lamp
Outline Dimensions
unit :
KLG-0002-000
mm
1
SG1316
Absolute maximum ratings
Characteristic
Symbol
Ratings
Unit
Power Dissipation
PD
70
mW
Forward Current
IF
25
mA
IFP
50
mA
Reverse Voltage
VR
4
V
Operating Temperature
Topr
-25∼80
℃
Storage Temperature
Tstg
-30∼100
℃
1
* Peak Forward Current
2
240℃ for 5 seconds
* Soldering Temperature
Tsol
*1.Duty ratio = 1/16, Pulse width = 0.1ms
*2.Recommended soldering Temperature Profile
2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds
Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
Symbol
Test Condition
Min
Typ
Max
Forward Voltage
VF
IF= 20mA
-
2.1
2.8
V
Luminous Intensity
IV
IF= 20mA
-
3
-
mcd
λP
Δλ
IR
IF= 20mA
-
557
-
nm
IF= 20mA
-
30
-
nm
VR=4V
-
-
10
uA
-
±65
-
-
±70
-
Peak Wavelength
Spectrum Bandwidth
Reverse Current
Half angle
θ1/2
X
Y
IF= 20mA
KLG-0002-000
Unit
deg
2
SG1316
Characteristic Diagrams
Fig. 2 IV - IF
Forward Current IF [mA]
Luminous Intensity Iv [mcd]
Fig. 1 IF - VF
Forward Voltage VF [V]
Forward
Fig.4 Spectrum Distribution
Fig. 3 IF – Ta
Forward
Relative Intensity [%]
Current IF [mA]
Current IF [mA]
Ambient Temperature Ta [℃]
Fig. 5-1 Radiation Diagram(X)
Wavelength λ [nm]
Fig. 5-2 Radiation Diagram(Y)
Relative Luminous Intensity Iv [%]
Relative Luminous Intensity Iv [%]
KLG-0002-000
3