TI SN65LVCP404RGZR

SN65LVCP404
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SLLS700 – MARCH 2007
Gigabit 4x4 CROSSPOINT SWITCH
The SN65LVCP404 is a 4x4 non-blocking crosspoint
switch in a flow-through pin-out allowing for ease in
PCB layout. VML signaling is used to achieve a
high-speed data throughput while using low power.
Each of the output drivers includes a 4:1 multiplexer
to allow any input to be routed to any output. Internal
signal paths are fully differential to achieve the high
signaling speeds while maintaining low signal skews.
The SN65LVCP404 incorporates 100-Ω termination
resistors for those applications where board space is
a premium. Built-in transmit pre-emphasis and
receive equalization for superior signal integrity
performance.
VCC
2DE
3DE
37
40
38
1Z
41
39
GND
1Y
42
P12
P11
45
44
1DE
46
43
S10
VCC
7
30
3Z
VCC
8
29
VCC
3A
9
28
4Y
3B
10
27
4Z
EQ
11
26
GND
VBB
12
25
4DE
GND
24
3Y
2B
P32
2A
23
GND
31
22
32
6
P31
5
P42
GND
21
2Z
P41
1B
S41
2Y
33
19
34
4
20
3
S40
1A
17
P21
4B
S21
VCC 18
P22
35
16
36
2
15
1
4A
S20
14
Clock Buffering/Clock MUXing
Wireless Base Stations
High-Speed Network Routing
Telecom/Datacom
XAUI 802.3ae Protocol Backplane
Redundancy
S31
•
•
•
•
•
47
APPLICATIONS
S11
The SN65LVCP404 is characterized for operation
from -40°C to 85°C.
48
•
•
•
•
DESCRIPTION
13
•
•
•
•
•
•
Up to 4.25 Gbps Operation
Non-blocking Architecture Allows Each
Output to be Connected to Any Input
30 ps of Deterministic Jitter
Selectable Transmit Pre-Emphasis Per Lane
Selectable Receive Equalization
Available Packaging 48 Pin QFN
Propagation Delay Times: 500 ps Typical
Inputs Electrically Compatible With
CML Signal Levels
Operates From a Single 3.3-V Supply
Ability to 3-STATE ouputs
Low Power: 560 mW
Integrated Termination Resistors
S30
FEATURES
•
•
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
SN65LVCP404
www.ti.com
SLLS700 – MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
LOGIC DIAGRAM
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
Differential Inputs (with 50-Ω
termination to Vbb)
xA=P; xB=N
Line Side Differential Inputs CML compatible
High Speed I/O
xA
xB
3, 6, 9, 16
4, 7, 10, 17
xY
xZ
41, 34, 31, 28
40, 33, 30, 27
Differential Output xY=P; xZ=N
Switch Side Differential Outputs. VML
45, 38, 37, 25
Input
Data Enable; Active Low; LVTTL; When not enabled the ouput
is in 3-STATE mode for power savings
Control Signals
xDE
S10 - S41
1, 2, 13, 14, 19,
20, 47, 48
Input; S1x = Channel 1 bit one
Switching Selection; LVTTL
P11-P42
43, 44, 35, 36, 23,
24, 21, 22
Input; P1x- Channel 1 bit one
Output Preemphasis Control; LVTTL
Input; Selection for receive
equalization setting
EQ = 1 (default) is for the 5 dB setting, EQ = 0 is for the 12 dB
setting
Power
Power Supply 3.3v ±5%
EQ
11
Power
Supply
VCC
8, 18, 29, 39, 46
GND
5, 15, 26, 32, 42
The ground center pad of the package must be connected to
GND plane.
Power Pad
VBB
2
12
Input
Receiver input biasing voltage
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EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
IN+
RT(SE)
= 50 W
Gain
Stage
+ EQ
VCC
RBBDC
RT(SE)
= 50 W
IN−
VBB
ESD
LineEndTermination
Self−Biasing Network
Figure 1. Equivalent Input Circuit Design
OUT+
49.9 W
OUT−
49.9 W
VOCM
1 pF
Figure 2. Common-Mode Output Voltage Test Circuit
Table 1. CROSSPOINT LOGIC TABLES
OUTPUT CHANNEL 1
CONTROL
PINS
INPUT
SELECTED
OUTPUT CHANNEL 2
CONTROL
PINS
INPUT
SELECTED
OUTPUT CHANNEL 3
CONTROL
PINS
INPUT
SELECTED
OUTPUT CHANNEL 4
CONTROL
PINS
INPUT
SELECTED
S10
S11
1Y/1Z
S20
S21
2Y/2Z
S30
S31
3Y/3Z
S40
S41
4Y/4Z
0
0
1A/1B
0
0
1A/1B
0
0
1A/1B
0
0
1A/1B
0
1
2A/2B
0
1
2A/2B
0
1
2A/2B
0
1
2A/2B
1
0
3A/3B
1
0
3A/3B
1
0
3A/3B
1
0
3A/3B
1
1
4A/4B
1
1
4A/4B
1
1
4A/4B
1
1
4A/4B
AVAILABLE OPTIONS
(1)
TA
DESCRIPTION
-40°C to 85°C
Serial multiplexer
PACKAGED DEVICE (1)
RGZ (48 pin)
SN65LVCP404
The package is available taped and reeled. Add an R suffix to device types (e.g., SN65LVCP404RGZR).
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PACKAGE THERMAL CHARACTERISTICS
PACKAGE THERMAL CHARACTERISTICS (1)
NOM
UNIT
θJA (junction-to-ambient)
33
°C/W
θJB (junction-to-board)
20
°C/W
23.6
°C/W
θJC (junction-to-case)
PSI-jt (junction-to-top pseudo)
PSI-jb (junction-to-board pseudo)
4-layer JEDEC Board (JESD51-7) using eight GND-vias θ-0.2 on the
center pad as shown in the section: Recommended PCB footprint
with boundary and environment conditions of JEDEC Board
(JESD51-2)
0.6
°C/W
19.4
°C/W
5.4
°C/W
θJP (junction-to-pad)
(1)
See application note SPRA953 for a detailed explanation of thermal parameters (http://www-s.ti.com/sc/psheets/spra953/spra953.pdf).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VCC
Supply voltage
range (2)
–0.5 V to 6 V
Control inputs, all outputs
Voltage range
ESD
TJ
Receiver inputs
Human Body
Model (3)
Charged-Device Model (4)
3 kV
All pins
500 V
See Package Thermal Characteristics
Table
Maximum junction temperature
2
Reflow temperature package soldering, 4 seconds
(2)
(3)
(4)
4
–0.5 V to 4 V
All pins
Moisture sensitivity level
(1)
–0.5 V to (VCC + 0.5 V)
260°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-A.
Tested in accordance with JEDEC Standard 22, Test Method C101.
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RECOMMENDED OPERATING CONDITIONS
dR
Operating data rate
VCC
Supply voltage
VCC(N)
Supply voltage noise amplitude
TJ
Junction temperature
TA
Operating free-air temperature (1)
MIN
NOM
MAX
UNIT
4.25
Gbps
3.135
3.3
3.465
10 Hz to 2.125 GHz
V
20
mV
125
°C
-40
85
°C
dR(in) ≤ 4.25 Gbps
100
1750
mVPP
1.25 Gbps < dR(in) ≤ 4.25 Gbps
100
1560
mVPP
dR(in) > 4.25 Gbps
100
1000
mVPP
Note: for best jitter performance ac
coupling is recommended.
1.5
DIFFERENTIAL INPUTS
Receiver peak-to-peak differential input
voltage (2)
VID
VICM
Receiver common-mode
input voltage
|V
1.6
VCC *
|
ID
2
V
CONTROL INPUTS
VIH
High-level input voltage
2
VCC + 0.3
V
VIL
Low-level input voltage
–0.3
0.8
V
120
Ω
DIFFERENTIAL OUTPUTS
RL
(1)
(2)
Differential load resistance
80
100
Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.
Differential input voltage VID is defined as | IN+ – IN– |.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
DIFFERENTIAL INPUTS
VIT+
Positive going differential
input high threshold
VIT–
Negative going differential
input low threshold
A(EQ)
Equalizer gain
RT(D)
Termination resistance,
differential
VBB
Open-circuit Input voltage
(input self-bias voltage)
R(BBDC)
Biasing network dc
impedance
R(BBAC)
Biasing network ac
impedance
50
mV
–50
at 1.875 GHz (EQ=0)
mV
12
80
AC-coupled inputs
100
dB
Ω
120
1.6
V
30
kΩ
375 MHz
42
2.125 GHz
8.4
Ω
DIFFERENTIAL OUTPUTS
VODH
High-level output voltage
VODL
Low-level output voltage
VODB(PP)
Output differential voltage
without preemphasis (2)
VOCM
Output common mode voltage
∆VOC(SS)
Change in steady-state
See Figure 2
common-mode output voltage
between logic states
(1)
(2)
RL = 100 Ω±1%,
Px_2 = Px_1=0;
4 Gbps alternating 1010-pattern;
Figure 3
1000
650
mVPP
–650
mVPP
1300
1500
mVPP
1.65
1
V
mV
All typical values are at TA = 25°C and VCC = 3.3 V supply unless otherwise noted. They are for reference purposes and are not
production tested.
Differential output voltage V(ODB) is defined as | OUT+ – OUT– |.
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ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Output preemphasis voltage
ratio,
V(PE)
V
ODB(PP)
TEST CONDITIONS
RL = 100 Ω± 1%;
x = L or S;
See Figure 3
VODPE(PP)
MIN
TYP (1)
Px_2:Px_1 = 00
0
Px_2:Px_1 = 01
3
Px_2:Px_1 = 10
6
Px_2:Px_1 = 11
9
MAX
UNIT
dB
t(PRE)
Preemphasis duration
measurement
Output preemphasis is set to 9 dB during test
Px_x = 1;
Measured with a 100-MHz clock signal;
RL = 100 Ω± 1%, See Figure 4
175
ps
ro
Output resistance
Differential on-chip termination between OUT+ and
OUT–
100
Ω
CONTROL INPUTS
IIH
High-level Input current
VIN = VCC
IIL
Low-level Input current
VIN = GND
R(PU)
Pullup resistance
5
-125
µA
-90
µA
35
kΩ
POWER CONSUMPTION
PD
Device power dissipation
All outputs terminated 100 Ω
PZ
Device power dissipation in
3-State
All outputs in 3-state
ICC
Device current consumption
All outputs
terminated 100 Ω
PRBS
Gbps
27-1
560
750
mW
600
mW
220
mA
TYP (1)
MAX
UNIT
3
6
ns
0.5
0.7
ns
0.5
0.7
ns
pattern at 4.25
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MULTIPLEXER
t(SM)
Multiplexer switch time
Multiplexer to valid output
DIFFERENTIAL OUTPUTS
tPLH
Low-to-high propagation
delay
tPHL
High-to-low propagation
delay
tr
Rise time
tf
Fall time
tsk(p)
Pulse skew, | tPHL– tPLH | (2)
tsk(o)
Output skew (3)
20% to 80% of VO(DB); Test Pattern: 100-MHz clock signal;
See Figure 5 and Figure 8
All outputs terminated with 100 Ω
80
ps
80
25
skew (4)
ps
20
ps
100
ps
tsk(pp)
Part-to-part
300
ps
tzd
3-State switch time to
Disable
Assumes 50 Ohm to Vcm and 150 pF load on each output
20
ns
tze
3-State switch time to
Enable
Assumes 50 Ohm to Vcm and 150 pF load on each output
10
ns
RJ
Device random jitter, rms
2
ps-rms
(1)
(2)
(3)
(4)
6
Propagation delay input to output
See Figure 6
See Figure 8 for test circuit.
BERT setting 10–15
Alternating 10-pattern.
0.8
All typical values are at 25°C and with 3.3 V supply unless otherwise noted.
tsk(p) is the magnitude of the time difference between the tPLH and tPHL of any output of a single device.
tsk(o) is the magnitude of the time difference between the tPLH and tPHL of any two outputs of a single device.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
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SWITCHING CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Intrinsic deterministic
device jitter (5) (6),
peak-to-peak
DJ
(5)
(6)
(7)
0 dB preemphasis
(PREx_x = 0);
See Figure 8 for the test
circuit.
0 dB preemphasis
Absolute deterministic
(PREx_x = 0);
output jitter (7), peak-to-peak See Figure 8 for the test
circuit.
PRBS 27-1
pattern
MIN
TYP (1)
4.25 Gbps
UNIT
30
1.25Gbps;
EQ=1
Over 25-inch
FR4 trace
PRBS 27-1
pattern
MAX
ps
7
4.25 Gbps;
EQ=0
Over FR4
trace 2-inch
to 43 inches
long
ps
20
Intrinsic deterministic device jitter is a measurement of the deterministic jitter contribution from the device. It is derived by the equation
(DJ(OUT)– DJ(IN) ), where DJ(OUT) is the total peak-to-peak deterministic jitter measured at the output of the device in PSPP. DJ(IN) is the
peak-to-peak deterministic jitter of the pattern generator driving the device.
The SN65LVCP404 built-in passive input equalizer compensates for ISI. For a 25-inch FR4 transmission line with 8-mil trace width, the
LVCP404 typically reduces jitter by 60 ps from the device input to the device output.
Absolute deterministic output jitter reflects the deterministic jitter measured at the SN65LVCP404 output. The value is a real measured
value with a Bit error tester as described in Figure 8. The absolute DJ reflects the sum of all deterministic jitter components accumulated
over the link: DJ(absolute) = DJ(Signal generator) + DJ(transmission line) + DJ(intrinsic(LVCP404)).
Table 2. Preemphasis Controls PL_2, PL_1, PS_2, and PS_1
(1)
Px_2 (1)
Px_1 (1)
OUTPUT
PREEMPHASIS
LEVEL IN dB
OUTPUT LEVEL IN mVpp
DE-EMPHASIZED
PRE-EMPHASIZED
TYPICAL FR4
TRACE LENGTH
0
0
0 dB
1200
1200
10 inches of FR4 trace
0
1
3 dB
850
1200
20 inches of FR4 trace
1
0
6 dB
600
1200
30 inches of FR4 trace
1
1
9 dB
425
1200
40 inches of FR4 trace
x = L or S
Table 3. Receive Equalization Settings
EQ
EQUALIZATION
TYPICAL TRACE
1
5 dB
25 inches of FR4
0
12 dB
43 inches of FR4
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PARAMETER MEASUREMENT INFORMATION
1−bit
1 to N bit
3−dB Preemphasis
VODPE3(pp)
9−dB Preemphasis
VOCM
VODB(PP)
VODPE2(pp)
6−dB Preemphasis
VODPE1(pp)
0−dB Preemphasis
VOH
VOL
Figure 3. Preemphasis and Output Voltage Waveforms and Definitions
1−bit
VODPE3(pp)
9−dB Preemphasis
1 to N bit
VODB(PP)
80%
20%
tPRE
Figure 4. t(PRE) Preemphasis Duration Measurement
80%
80%
VODB
20%
20%
tr
tf
Figure 5. Driver Output Transition Time
8
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PARAMETER MEASUREMENT INFORMATION (continued)
VID = 0 V
IN
t PHLD
t PLHD
VOD = 0 V
OUT
Figure 6. Propagation Delay Input to Output
VA
0V
VB
Clock Input
0V
Ideal Output
VY − VZ
1/fo
1/fo
Period Jitter
Cycle-to-Cycle Jitter
Actual Output
Actual Output
0V
0V
VY − VZ
VY − VZ
tc(n)
tc(n)
tc(n +1)
tjit(cc) = | tc(n) − tc(n + 1) |
tjit(pp) = | tc(n) − 1/fo |
Peak-to-Peak Jitter
VA
PRBS Input
VY
0V
VB
0V
VZ
PRBS Output
tjit(pp)
A.
All input pulses are supplied by an Agilent 81250 Stimulus System.
B.
The measurement is made with the AgilentParBert measurement software.
Figure 7. Driver Jitter Measurement Waveforms
<3-inch 50 W TL
(7,62 cm)
25-inch FR4
(63,5 cm)
<3-inch 50 W TL
(7,62 cm)
Figure 8. AC Test Circuit — Jitter and Output Rise Time Test Circuit
The SN65LVCP404 input equalizer provides 5-dB frequency gain to compensate for frequency loss of a shorter
backplane transmission line. For characterization purposes, a 25-inch (63,5 cm) FR-4 coupled transmission line
is used in place of the backplane trace. The 25-inch trace provides roughly 5 dB of attenuation between 375
MHz and 2.125 GHz, representing closely the characteristics of a short backplane trace. The loss tangent of the
FR4 in the test board is 0.018 with an effective ε(r) of 4.1.
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TYPICAL DEVICE BEHAVIOR
Eye After 51 inch FR-4 Trace, Input 800 mVPP
Eye After 51 inch FR-4 Trace, Input 800 mVPP,
Through the 404 With Pre-emphasis at 3 dB
100 ps/div
Pre-emphasis Levels
50 ps/div
Figure 10. Preemphasis Signal Shape
NOTE: 51 Inches (129.54 cm) Input Trace, dR =
4.25 Gbps; 27- 1 PRBS
Figure 9. Data Input and Output Pattern
4.25 Gbps
Signal
Generator
7-1
PRBS 2
800 mVPP Input
35-inches,
88.9 cm FR4
51-inches,
129.54 cm FR4
35-inches,
88.9 cm FR4
Figure 11. Data Output Pattern
10
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TYPICAL CHARACTERISTICS
DETERMINISTIC OUTPUT JITTER
vs
DIFFERENTIAL INPUT AMPLITUDE
1.4
25
50
4.25 Gbps
27-1 PRBS pattern,
The DJ is Measured on the Output of the
LVCP404
45
40
20
3.75 Gbps
35
3.125 Gbps
15
30
2.5 Gbps
25
10
20
15
5
10
1.25 Gbps
5
0
0
2
3
4
5
6
7
1.2
1
0.8
0.6
0.4
0.2
0
0
8
500
Figure 12.
1000
1500
0
2000
1
2
3
4
5
6
DR - Data Rate - Gbps
Figure 13.
SUPPLY NOISE vs DETERMINISTIC
JITTER
vs
DATA RATE
7
8
Figure 14.
DETERMINISTIC OUTPUT JITTER
vs
COMMON-MODE INPUT VOLTAGE
25
35
Noise = 200 mV
Noise = 650 mV
Noise = 300 mV
30
25
20
Noise = 50 mV
15
Noise = 100 mV
Noise = 400 mV
10
5
Deterministic Output Jitter - ps
1
Deterministic Output Jitter - ps
0
DIFFERENTIAL OUTPUT VOLTAGE
vs
DATA RATE
VOD - Differential Output Voltage - VPP
DETERMINISTIC OUTPUT JITTER
vs
DATA RATE
20
4.25 Gbps
15
10
5
0
0
0
4000
3000
1000
2000
DR - Data Rate - Gbps
5000
0
1
2.5
3
0.5
2
1.5
VIC - Common Mode Input Voltage - V
Figure 15.
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APPLICATION INFORMATION
CONFIGURATION EXAMPLES
S10
0
S30
1
S11
0
S31
0
S20
0
S40
1
S21
1
S41
1
S10
0
S30
0
S20
0
S40
0
S21
0
S41
0
1A
1Y
1A
1Y
1B
1Z
1B
1Z
2A
2Y
2Y
2B
2Z
2Z
3A
3Y
3Y
3B
3Z
3Z
4A
4Y
4Y
4B
4Z
4Z
S10
0
S30
1
S11
0
S31
0
S20
0
S40
1
S21
0
S41
0
S10
1
S30
0
S11
1
S31
0
S20
1
S40
0
S21
1
S41
0
1A
1Y
1A
1Y
1B
1Z
1B
1Z
2Y
2Y
2Z
2Z
12
S11
0
S31
0
3A
3Y
3Y
3B
3Z
3Z
4Y
4A
4Y
4Z
4B
4Z
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APPLICATION INFORMATION (continued)
BANDWIDTH REQUIREMENTS
Error free transmission of data over a transmission line has specific bandwidth demands. It is helpful to analyze
the frequency spectrum of the transmit data first. For an 8B10B coded data stream at 3.75 Gbps of random
data, the highest bit transition density occurs with a 1010 pattern (1.875 GHz). The least transition density in
8B10B allows for five consecutive ones or zeros. Hence, the lowest frequency of interest is 1.875 GHz/5 = 375
MHz. Real data signals consist of higher frequency components than sine waves due to the fast rise time. The
faster the rise time, the more bandwidth becomes required. For 80-ps rise time, the highest important frequency
component is at least 0.6/(π × 80 ps) = 2.4 GHz. Figure 17shows the Fourier transformation of the 375-MHz and
1.875-GHz trapezoidal signal.
Signal Amplitude − dB
0
20 dB/dec
1875 MHz With
80 ps Rise Time
−5
20 dB/dec
375 MHz With
80 ps Rise Time
−10
40 dB/dec
−15
80%
20%
tr
−20
−25
40 dB/dec
tPeriod = 1/f
100
1000
f − Frequency − MHz
1/(pi x 100/60 tr) = 2.4 GHz
10000
Figure 17. Approximate Frequency Spectrum of the Transmit Output Signal With 80 ps Rise Time
The spectrum analysis of the data signal suggests building a backplane with little frequency attenuation up to
2 GHz. Practically, this is achievable only with expensive, specialized PCB material. To support material like
FR4, a compensation technique is necessary to compensate for backplane imperfections.
EXPLANATION OF EQUALIZATION
Backplane designs differ widely in size, layer stack-up, and connector placement. In addition, the performance is
impacted by trace architecture (trace width, coupling method) and isolation from adjacent signals. Common to
most commercial backplanes is the use of FR4 as board material and its related high-frequency signal
attenuation. Within a backplane, the shortest to longest trace lengths differ substantially – often ranging from
8 inches up to 40 inches. Increased loss is associated with longer signal traces. In addition, the backplane
connector often contributes a good amount of signal attenuation. As a result, the frequency signal attenuation for
a 300-MHz signal might range from 1 dB to 4 dB while the corresponding attenuation for a 2-GHz signal might
span 6 dB to 24 dB. This frequency dependent loss causes distortion jitter on the transmitted signal. Each
LVCP404 receiver input incorporates an equalizer and compensates for such frequency loss. The
SN65LVCP404 equalizer provides 5 dB of frequency gain between 375 MHz and 1.875 GHz, compensating
roughly for 20 inches of FR4 material with 8-mil trace width. Distortion jitter improvement is substantial, often
providing more than 30-ps jitter reduction. The 5-dB compensation is sufficient for most short backplane traces.
For longer trace lengths, it is recommended to enable transmit preemphasis in addition.
Submit Documentation Feedback
13
SN65LVCP404
www.ti.com
SLLS700 – MARCH 2007
APPLICATION INFORMATION (continued)
SETTING THE PREEMPHASIS LEVEL
The receive equalization compensates for ISI. This reduces jitter and opens the data eye. In order to find the
best preemphasis setting for each link, calibration of every link is recommended. Assuming each link consists of
a transmitter (with adjustable pre-emphasis such as LVCP404) and the LVCP404 receiver, the following steps
are necessary:
1. Set the transmitter and receiver to 0-dB preemphasis; record the data eye on the LVCP404 receiver
output.
2. Increase the transmitter preemphasis until the data eye on the LVCP404 receiver output looks the
cleanest.
14
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVCP404RGZR
ACTIVE
QFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
SN65LVCP404RGZRG4
ACTIVE
QFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
SN65LVCP404RGZR
17-May-2007
Package Pins
RGZ
48
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
MLA
330
16
7.3
7.3
1.5
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN65LVCP404RGZR
RGZ
48
MLA
346.0
346.0
33.0
Pack Materials-Page 2
W
Pin1
(mm) Quadrant
16
PKGORN
T2TR-MS
P
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