BB TLV370X

TLV3011
TLV3012
SBOS300B – FEBRUARY 2004 – REVISED JUNE 2004
Nanopower, 1.8V, SOT23
Comparator with Voltage Reference
FEATURES
DESCRIPTION
● LOW QUIESCENT CURRENT: 5µA (max)
● INTEGRATED VOLTAGE REFERENCE: 1.242V
● INPUT COMMON-MODE RANGE:
200mV Beyond Rails
● VOLTAGE REFERENCE INITIAL ACCURACY: 1%
● OPEN-DRAIN LOGIC COMPATIBLE OUTPUT:
TLV3011
● PUSH-PULL OUTPUT: TLV3012
● LOW-SUPPLY VOLTAGE: 1.8V to 5.5V
● FAST RESPONSE TIME: 6µs Propagation Delay
with 100mV Overdrive (TLV3011: RPULL-UP = 10kΩ)
● MicroSIZE PACKAGES: SOT23-6 and SC70-6
The TLV3011 is a low-power, open-drain output comparator;
the TLV3012 is a push-pull output comparator. Both feature
an uncommitted on-chip voltage reference. Both have 5µA
(max) quiescent current, input common-mode range 200mV
beyond the supply rails, and single-supply operation from
1.8V to 5.5V. The integrated 1.242V series voltage reference
offers low 100ppm/°C (max) drift, is stable with up to 10nF
capacitive load, and can provide up to 0.5mA (typ) of output
current.
APPLICATIONS
TLV3011 and TLV3012 RELATED PRODUCTS
●
●
●
●
●
The TLV3011 and TLV3012 are available in the tiny SOT23-6
package for space-conservative designs. It is also available in
the SC70 package for even greater board area savings. Both
versions are specified for the temperature range of –40°C to
+125°C.
PRODUCT
BATTERY-POWERED LEVEL DETECTION
DATA ACQUISITION
SYSTEM MONITORING
OSCILLATORS
SENSOR SYSTEMS:
Smoke Detectors, Light Sensors, Alarms
TLV349x
TLV370x
TLV340x
OUT
1
6
V+
V−
2
5
REF
IN+
3
4
IN−
FEATURES
1.2µA, 1.8V to 5.5V Push-Pull Comparator
560nA, 2.5V to 16V Push-Pull CMOS Output Comparator
550nA, 2.5V to 16V Open-Drain Comparator
TLV3011
TLV3012
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage .................................................................................... +7V
Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +150°C
Storage Temperature ..................................................... –55°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD Rating (Human Body Model) .................................................. 2000V
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only,
and functional operation of the device at these or any other
conditions beyond those specified is not implied.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
(2) Input terminals are diode-clamped to the power-supply rails. In
put signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
PIN CONFIGURATIONS
Top View
TLV3012AIDBV
TLV3011AIDBV
V−
2
IN+
3
V−
2
IN+
3
REF
V−
2
IN−
IN+
3
5
4
SOT23-6
TLV3011AIDCK
TLV3012AIDCK
6
V+
5
4
OUT
1
REF
V−
2
IN−
IN+
3
SC70-6
ALT
1
1
V+
SOT23-6
AJX
OUT
OUT
6
ALS
1
ALR
OUT
6
V+
5
REF
4
IN−
6
V+
5
REF
4
IN−
SC70-6
NOTE: Pin 1 is determined by orienting package marking as shown.
2
TLV3011, TLV3012
www.ti.com
SBOS300B
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, VOUT = VS, unless otherwise noted; for TLV3011, RPULL-UP = 10kΩ connected to VS.
TLV3011, TLV3012
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
VOS
dVOS/dT
PSRR
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
IB
IOS
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
CMRR
MIN
t(PLH)
Propagation Delay Time, High-to-Low
t(PHL)
Rise Time, TLV3011
Rise Time, TLV3012
Fall Time
OUTPUT
Voltage Output Low from Rail
Voltage Output High From Rail, TLV3012
Short-Circuit Current, TLV3012
VOLTAGE REFERENCE
Initial Accuracy
Temperature Drift
Load Regulation
Sourcing
Sinking
Output Current
Line Regulation
VOL
0.5
12
100
1000
mV
µV/°C
µV/V
VCM = VS/2
VCM = VS/2
±1
±1
±10
±10
pA
pA
(V+) + 0.2V
74
62
V
dB
dB
1013 2
1013 4
Ω pF
Ω pF
12
6
13.5
6.5
See Note 1
100
100
µs
µs
µs
µs
VCM = –0.2V to (V+) – 1.5V
VCM = –0.2V to (V+) + 0.2V
(V–) – 0.2V
60
54
f = 10kHz, VSTEP = 1V
Input Overdrive = 10mV
Input Overdrive = 100mV
Input Overdrive = 10mV
Input Overdrive = 100mV
CL = 10pF
CL = 10pF
VS = 5V
IOUT = –5mA
IOUT = 5mA
ns
ns
160
90
See Typical Characteristics
200
200
mV
mV
1.242
1.254
±1
100
V
%
ppm/°C
1
mV/mA
mV/mA
mA
µV/V
VIN = 5V
VOUT
dVOUT/dT
dVOUT/dILOAD
ILOAD
dVOUT/dVIN
NOISE
Reference Voltage Noise
POWER SUPPLY
Specified Voltage
Operating Voltage Range
Quiescent Current
UNITS
±12
tR
tF
MAX
VCM = 0V, IO = 0V
TA = –40°C to +125°C
VS = 1.8V to 5.5V
INPUT IMPEDANCE
Common-Mode
Differential
SWITCHING CHARACTERISTICS
Propagation Delay Time, Low-to-High
TYP
1.230
–40°C ≤ TA ≤ 125°C
40
0mA < ISOURCE ≤ 0.5mA
0mA < ISINK ≤ 0.5mA
1.8V ≤ VIN ≤ 5.5V
0.36
6.6
0.5
10
f = 0.1Hz to 10Hz
0.2
VS
IQ
1.8
1.8
VS = 5V, VO = High
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance, θJA
SOT23-6
SC70-6
2.8
–40
–55
–55
200
250
100
mVPP
5.5
5.5
5
V
V
µA
+125
+150
+150
°C
°C
°C
°C/W
°C/W
NOTE: (1) tR dependent on RPULL-UP and CLOAD.
TLV3011, TLV3012
SBOS300B
www.ti.com
3
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
QUIESCENT CURRENT
vs OUTPUT SWITCHING FREQUENCY
QUIESCENT CURRENT vs TEMPERATURE
3.8
8
3.6
7
Quiescent Current (µA)
Quiescent Current (µA)
3.4
3.2
3.0
2.8
2.6
2.4
TLV3011
RPULL-UP = 1MΩ
6
VS = 3V
5
4
3
VS = 1.8V
2
1
2.2
2.0
0
–50
–25
0
25
50
75
100
125
1
10
Temperature (°C)
100
INPUT BIAS CURRENT vs TEMPERATURE
TLV3012
VS = 5V
40
Input Bias Current (pA)
12
10
VS = 3V
8
6
4
VS = 1.8V
2
35
30
25
20
15
10
5
0
0
–5
1
10
100
1k
10k
–50
100k
–25
0
25
50
75
100
125
Temperature (°C)
Output Transition Frequency (Hz)
OUTPUT LOW vs OUTPUT CURRENT
OUTPUT HIGH vs OUTPUT CURRENT
0.25
0.25
TLV3012
VDD = 3V
0.20
0.20
VS = 1.8V
VDD = 1.8V
VS = 3V
VS – VOH (V)
VOL (V)
10k
45
14
0.15
VS = 5V
0.10
0.15
0.10
VDD = 5V
0.05
0.05
0
0
0
2
4
6
8
10
0
12
Output Current (mA)
4
1k
Output Transition Frequency (Hz)
QUIESCENT CURRENT
vs OUTPUT SWITCHING FREQUENCY
Quiescent Current (µA)
VS = 5V
2
4
6
8
10
12
Output Current (mA)
TLV3011, TLV3012
www.ti.com
SBOS300B
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD
80
PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD
80
TLV3012
70
70
60
60
50
tPHL (µs)
tPLH (µs)
50
VS = 5V
40
VS = 3V
30
VS = 1.8V
20
VS = 3V
30
20
10
10
0
0.01
0.1
1
10
100
VS = 1.8V
0
0.01
1k
0.1
1
PROPAGATION DELAY (tPLH) vs INPUT OVERDRIVE
20
100
1k
PROPAGATION DELAY (tPHL) vs INPUT OVERDRIVE
20
18
18
16
16
VS = 5V
14
tPHL (µs)
14
tPLH (µs)
10
Capacitive Load (nF)
Capacitive Load (nF)
12
VS = 3V
10
VS = 1.8V
12
VS = 1.8V
10
8
8
6
6
4
4
0
10
20
30
40
50
60
70
80
90
VS = 3V
VS = 5V
0
100
10
20
30
Input Overdrive (mV)
40
50
60
70
80
90
100
Input Overdrive (mV)
PROPAGATION DELAY (tPLH) vs TEMPERATURE
8.0
PROPAGATION DELAY (tPHL) vs TEMPERATURE
8.0
7.5
7.5
7.0
6.5
VS = 1.8V
7.0
VS = 1.8V
VS = 3V
6.5
VS = 3V
tPHL (µs)
tPLH (µs)
VS = 5V
40
6.0
5.5
6.0
5.5
VS = 5V
5.0
5.0
VS = 5V
4.5
4.5
4.0
4.0
–50
–25
0
25
50
75
100
125
–50
Temperature (°C)
0
25
50
75
100
125
Temperature (°C)
TLV3011, TLV3012
SBOS300B
–25
www.ti.com
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
PROPAGATION DELAY (tPLH)
PROPAGATION DELAY (tPHL)
VS = ±2.5V
VIN+
500mV/div
500mV/div
VS = ±2.5V
VIN–
VIN–
VIN+
2V/div
TLV3012
VOUT
2V/div
TLV3011
VOUT
2µs/div
2µs/div
PROPAGATION DELAY (tPLH)
PROPAGATION DELAY (tPHL)
VS = ±0.9V
VIN+
500mV/div
500mV/div
VS = ±0.9V
VIN–
VIN–
2V/div
VOUT
2µs/div
REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT
(Sourcing)
REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT
(Sinking)
1.24205
1.250
1.24200
1.249
1.24195
1.248
1.24190
1.24185
1.24180
1.24175
1.24170
1.24165
1.247
1.246
1.245
1.244
1.243
1.242
1.24160
1.241
0
0.2
0.4
0.6
0.8
1.0
1.2
Output Load Current, Sourcing (mA)
6
VOUT
2µs/div
Reference Voltage (V)
Reference Voltage (V)
2V/div
VIN+
0
0.2
0.4
0.6
0.8
1.0
1.2
Output Load Current, Sinking (mA)
TLV3011, TLV3012
www.ti.com
SBOS300B
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
REFERENCE VOLTAGE vs TEMPERATURE
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
1.250
140
1.245
120
Short-Circuit Current (mA)
Reference Voltage (V)
TLV3012
1.240
1.235
1.230
1.225
1.220
100
Sink
80
60
Source
40
20
1.215
1.210
–100
0
–50
0
50
100
150
1.5
2.0
2.5
3.0
Temperature (°C)
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V)
REFERENCE VOLTAGE DISTRIBUTION
500
450
Reference Voltage (V)
400
350
300
250
200
150
100
50
1.254
1.252
1.250
1.248
1.246
1.244
1.242
1.240
1.238
1.236
1.234
1.232
1.230
0
Volts
TLV3011, TLV3012
SBOS300B
www.ti.com
7
APPLICATIONS INFORMATION
The TLV3011 is a low-power, open-drain comparator with
on-chip 1.242V series reference. The open-drain output
allows multiple devices to be driven by a single pull-up
resistor to accomplish an OR function, making the TLV3011
useful for logic applications.
may be added by connecting a small amount of feedback to
the positive input. Figure 2 shows a typical topology used to
introduce hysteresis, described by the equation:
VHYST =
The TLV3012 comparator with on-chip 1.242V series reference has a push-pull output stage optimal for reduced power
budget applications and features no shoot-through current.
V+
5.0V
A typical supply current of 2.8µA and tiny packaging combine
with 1.8V supply requirements to make the TLV3011 and
TLV3012 optimal for battery and portable designs.
RPULL-UP(1)
VIN
TLV301x
BOARD LAYOUT
REF
Typical connections for the TLV3011 and TLV3012 are
shown in Figure 1. The TLV3011 is an open-drain output
device. A pull-up resistor must be connected between the
comparator output and supply to enable operation.
To minimize supply noise, power supplies should be capacitively decoupled by a 0.01µF ceramic capacitor in parallel
with a 10µF electrolytic capacitor. Comparators are sensitive
to input noise, and precautions such as proper grounding
(use of ground plane), supply bypassing, and guarding of
high-impedance nodes will minimize the effects of noise and
help to ensure specified performance.
0.01µF
4
TLV301x
VIN+
10µF
6
3
5
REF
2
R1
39kΩ
VREF
VOUT
R2
560kΩ
VHYST = 0.38V
NOTE: (1) Use RPULL-UP with the TLV3011 only.
FIGURE 2. Adding Hysteresis.
VHYST will set the value of the transition voltage required to
switch the comparator output by increasing the threshold
region, thereby reducing sensitivity to noise.
APPLICATIONS
V+
VIN–
V + × R1
R1 + R 2
1
BATTERY LEVEL DETECT
RPULL-UP(1)
10kΩ
The low power consumption and 1.8V supply voltage of the
TLV3011 make it an excellent candidate for battery-powered
applications. Figure 3 shows the TLV3011 configured as a
low battery level detector for a 3V battery.
VOUT
V–
NOTE: (1) Use RPULL-UP with the TLV3011 only.
Battery − Okay Trip Voltage = 1.242
R1 + R 2
R2
FIGURE 1. Basic Connections of the TLV3011 and TLV3012.
OPEN-DRAIN OUTPUT (TLV3011)
R1
1MΩ
The open-drain output of the TLV3011 is useful in logic
applications. The value of the pull-up resistor and supply
voltage used will affect current consumption due to additional
current drawn when the output is in a low state. This effect
can be seen in the typical curve Quiescent Current vs Output
Switching Frequency.
RPULL-UP(1)
+
−
TLV301x
R2
2MΩ
Battery
Okay
REF
1.242V
EXTERNAL HYSTERESIS
Comparator inputs have no noise immunity within the range
of specified offset voltage (±12mV). For noisy input signals,
the comparator output may display multiple switching as
input signals move through the switching threshold. The
typical comparator threshold of the TLV3011 and TLV3012 is
±0.5mV. To prevent multiple switching within the comparator
threshold of the TLV3011 or TLV3012, external hysteresis
8
When the battery voltage drops below 1.9V,
the battery-okay output will go low.
NOTE: (1) Use RPULL-UP with the TLV3011 only.
FIGURE 3. TLV3011 Configured as a Low Battery Level Detector.
TLV3011, TLV3012
www.ti.com
SBOS300B
POWER-ON RESET
The reset circuit shown in Figure 4 provides a time delayed
release of reset to the MSP430 microcontroller. Operation of
the circuit is based on a stabilization time constant of the
supply voltage, rather than on a predetermined voltage
value. The negative input is a reference voltage created by
the internal voltage reference. The positive input is an RC
circuit that provides a power-up delay. When power is applied, the output of the comparator is low, holding the
processor in the reset condition. Only after allowing time for
the supply voltage to stabilize does the positive input of the
comparator become higher than the negative input, resulting
in a high output state, releasing the processor for operation.
The stabilization time required for the supply voltage is
adjustable by the selection of the RC component values. Use
of a lower-valued resistor in this portion of the circuit will not
increase current consumption because no current flows
through the RC circuit after the supply has stabilized.
The reset delay needed depends on the power-up characteristics of the system power supply. R1 and C1 are selected to
allow enough time for the power supply to stabilize. D1
provides rapid reset if power is lost. In this example, the
R1 • C1 time constant is 10mS.
RELAXATION OSCILLATOR
The TLV3012 can be configured as a relaxation oscillator as
in Figure 5 to provide a simple and inexpensive clock output.
The capacitor is charged at a rate of T = 0.69RC. It also
discharges at a rate of 0.69RC. Therefore, the period is
T = 1.38RC. R1 may be a different value than R2.
VC
2/3 (V+)
1/3 (V+)
t
V+ T1 T2
V+
V+
C
1000pF
R1
1MΩ
VOUT
DI
R1
1MΩ
RPULL-UP(1)
10kΩ
C1
10nF 1.242V TLV301x
MSP430
TLV3012
R2
1MΩ
R2
1MΩ
RESET
t
F = 724Hz
V+
REF
R2
1MΩ
NOTE: (1) Use RPULL-UP with the TLV3011 only.
FIGURE 4. The TLV3011 or TLV3012 Configured as a
Power Up Reset Circuit for the MSP430.
FIGURE 5. TLV3012 Configured as a Relaxation Oscillator.
TLV3011, TLV3012
SBOS300B
www.ti.com
9
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV3011AIDBVR
ACTIVE
SOT-23
DBV
6
3000
TBD
CU NIPDAU
Level-1-235C-UNLIM
TLV3011AIDBVT
ACTIVE
SOT-23
DBV
6
250
TBD
CU NIPDAU
Level-1-235C-UNLIM
TLV3011AIDCKR
ACTIVE
SC70
DCK
6
3000
TBD
A42 SNPB
Level-1-240C-UNLIM
TLV3011AIDCKT
ACTIVE
SC70
DCK
6
250
TBD
A42 SNPB
Level-1-240C-UNLIM
TLV3012AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV3012AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
TLV3012AIDBVT
ACTIVE
SOT-23
DBV
6
250
TBD
CU NIPDAU
Level-1-235C-UNLIM
TLV3012AIDCKR
ACTIVE
SC70
DCK
6
3000
TBD
A42 SNPB
Level-1-240C-UNLIM
TLV3012AIDCKT
ACTIVE
SC70
DCK
6
250
TBD
A42 SNPB
Level-1-240C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
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Addendum-Page 1
MECHANICAL DATA
MPDS114 – FEBRUARY 2002
DCK (R-PDSO-G6)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
6
0,10 M
4
1,40
1,10
1
0,13 NOM
2,40
1,80
3
Gage Plane
2,15
1,85
0,15
0°–8°
0,46
0,26
Seating Plane
1,10
0,80
0,10
0,00
0,10
4093553-3/D 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-203
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