TI TS3USB221ARSER

TS3USB221A
www.ti.com .......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008
ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)
1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
VCC Operation at 2.5 V to 3.3 V
VI/O Accepts Signals Up to 5.5 V
1.8-V Compatible Control-Pin Inputs
Low-Power Mode When OE Is Disabled (1 µA)
rON = 6 Ω Maximum
ΔrON = 0.2 Ω Typical
Cio(on) = 6 pF Typical
Low Power Consumption (30 µA Maximum)
High Bandwidth (900 MHz Typical)
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Performance Tested Per JESD 22
– 7000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
ESD Performance I/O to GND
– 12-kV Human-Body Model
APPLICATIONS
•
RSE PACKAGE
(TOP VIEW)
VCC
1D+
1
1D–
10
9
S
2
8
D+
2D+
3
7
D–
2D–
4
6
OE
1
1D+
5
GND
RSE PACKAGE
(BOTTOM VIEW)
VCC
10
S
9
D+
8
2
1D–
D–
7
3
2D+
OE
6
4
2D–
Routes Signals for USB 1.0, 1.1, and 2.0
DESCRIPTION
The TS3USB221A is a high-bandwidth switch
specially designed for the switching of high-speed
USB 2.0 signals in handset and consumer
applications, such as cell phones, digital cameras,
and notebooks with hubs or controllers with limited
USB I/Os. The wide bandwidth (900 MHz) of this
switch allows signals to pass with minimum edge and
phase distortion. The device multiplexes differential
outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and
offers little or no attenuation of the high-speed signals
at the outputs. It is designed for low bit-to-bit skew
and high channel-to-channel noise isolation, and is
compatible with various standards, such as
high-speed USB 2.0 (480 Mbps).
5
GND
The TS3USB221A integrates ESD protection cells on
all pins, is available in a tiny µQFN package (2.0 mm
× 1.5 mm) and is charaterized over the free air
temperature range from –40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TS3USB221A
SCDS277 – NOVEMBER 2008 .......................................................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
QFN – RSE
(1) (2)
ORDERABLE PART NUMBER
Reel of 3000
TS3USB221ARSER
TOP-SIDE MARKING
LHR
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NAME
DESCRIPTION
OE
Bus-switch enable
S
Select input
D
Bus A
nD
Bus B
TRUTH TABLE
S
OE
FUNCTION
X
H
Disconnect
L
L
D = 1D
H
L
D = 2D
BLOCK DIAGRAM
D+
1D+
D−
1D−
2D+
2D−
S
OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN (see Note A)
A.
2
EN is the internal enable signal applied to the switch.
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
(2) (3) (4)
VI/O
Switch I/O voltage range
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±120
mA
±100
mA
150
°C
II/O
ON-state switch current
–0.5
(5)
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
(4)
(5)
Storage temperature range
–65
7
UNIT
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
PACKAGE THERMAL IMPEDANCE
over operating free-air temperature range (unless otherwise noted)
UNIT
θJA
(1)
Package thermal impedance (1)
RSE package
243
°C/W
MIN
MAX
UNIT
2.3
3.6
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
VCC = 2.3 V to 2.7 V
0.46 × VCC
VCC = 2.7 V to 3.6 V
0.46 × VCC
V
VCC = 2.3 V to 2.7 V
0.25 × VCC
VCC = 2.7 V to 3.6 V
0.25 × VCC
Product Folder Link(s): TS3USB221A
V
0
5.5
V
–40
85
°C
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V
3
TS3USB221A
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ELECTRICAL CHARACTERISTICS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
UNIT
–1.8
V
VIN = 0 V to 3.6 V
±1
µA
VIN = VCC or GND,
Switch OFF
±1
µA
VI/O = 0 V to 5.25 V
±2
VI/O = 0 V to 3.6 V
±2
VI/O = 0 V to 2.7 V
±1
30
µA
1
µA
II = –18 mA
VCC = 3.6 V, 2.7 V, 0 V,
IOZ (3)
VCC = 3.6 V, 2.7 V,
VO = 0 V to 5.25 V, VI = 0 V,
I(OFF)
VCC = 0 V
Control
inputs
IIN
TYP (2)
MAX
VCC = 3.6 V, 2.7 V,
MIN
ICC
VCC = 3.6 V, 2.7 V,
VIN = VCC or GND,
II/O = 0 V,
Switch ON or OFF
ICC
(low power
mode)
VCC = 3.6 V, 2.7 V,
VIN = VCC or GND,
Switch disabled,
OE in high state
ΔICC (4)
Control
inputs
One input at 1.8 V,
Other inputs at VCC or GND
VCC = 3.6 V
20
VCC = 2.7 V
0.5
Cin
Control
inputs
VCC = 3.3 V, 2.5 V,
VIN = VCC or 0 V
Cio(OFF)
VCC = 3.3 V, 2.5 V,
VI/O = VCC or 0 V,
Switch OFF
Cio(ON)
VCC = 3.3 V, 2.5 V,
VI/O = VCC or 0 V,
Switch ON
rON (5)
VCC = 3 V, 2.3 V
VI = 0 V,
IO = 30 mA
VI = 2.4 V,
IO = –15 mA
ΔrON
VCC = 3 V, 2.3 V
VI = 0 V,
IO = 30 mA
0.2
VI = 1.7,
IO = –15 mA
0.2
rON(flat)
VCC = 3 V, 2.3 V
VI = 0 V,
IO = 30 mA
1
VI = 1.7,
IO = –15 mA
1
(1)
(2)
(3)
(4)
(5)
1.5
µA
µA
2.5
pF
3.5
5
pF
6
7.5
pF
3
6
3.4
6
Ω
Ω
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ±10%, GND = 0 V
PARAMETER
TEST CONDITIONS
TYP
UNIT
dB
XTALK
Crosstalk
RL = 50 , f = 250 MHz
–40
OIRR
OFF isolation
RL = 50 , f = 250 MHz
–41
dB
BW
Bandwidth (–3 dB)
RL = 50
0.9
GHz
4
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DYNAMIC ELECTRICAL CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 2.5 V ±10%, GND = 0 V
TYP
UNIT
XTALK
Crosstalk
PARAMETER
RL = 50 , f = 250 MHz
TEST CONDITIONS
-39
dB
OIRR
OFF isolation
RL = 50 , f = 250 MHz
-40
dB
BW
Bandwidth (3 dB)
RL = 50
0.9
GHz
SWITCHING CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ±10%, GND = 0 V
PARAMETER
tpd
Propagation delay
MIN
(2) (3)
Line enable time
tOFF
Line disable time
tSK(O)
Output skew between center port to any other port (2)
(1)
(2)
(3)
MAX
0.25
tON
tSK(P)
TYP (1)
ns
S to D, nD
30
OE to D, nD
17
S to D, nD
12
OE to D, nD
10
Skew between opposite transitions of the same output (tPHL– tPLH)
(2)
UNIT
ns
ns
0.1
0.2
ns
0.1
0.2
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
SWITCHING CHARACTERISTICS
over operating range, TA = –40°C to 85°C, VCC = 2.5 V ±10%, GND = 0 V
PARAMETER
tpd
Propagation delay
MIN
(2) (3)
50
OE to D, nD
32
S to D, nD
23
OE to D, nD
12
tOFF
Line disable time
tSK(O)
Output skew between center port to any other port (2)
Skew between opposite transitions of the same output (tPHL– tPLH)
(2)
UNIT
ns
S to D, nD
Line enable time
(1)
(2)
(3)
MAX
0.25
tON
tSK(P)
TYP (1)
ns
ns
0.1
0.2
ns
0.1
0.2
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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TS3USB221A
SCDS277 – NOVEMBER 2008 .......................................................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
0
0
–1
–20
Attenuation (dB)
Gain (dB)
–2
–3
–4
–40
–60
–80
–5
–100
–6
–120
–7
100.0E+3
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
10.0E+9
Frequency (Hz)
Frequency (Hz)
Figure 1. Gain vs Frequency
Figure 2. OFF Isolation vs Frequency
3.5
0
3.4
–20
VCC = 3 V
ron (Ω)
Attenuation (dB)
3.3
–40
–60
3.2
VCC = 2.3 V
3.1
–80
3.0
–100
2.9
–120
2.8
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
0.0
0.5
1.0
1.5
Frequency (Hz)
2.0
2.5
3.0
3.5
VIN (V)
Figure 3. Crosstalk vs Frequency
Figure 4. ron vs VIN (IOUT = –15 mA)
3.5
3.4
3.3
ron (Ω)
VCC = 3 V
3.2
VCC = 2.3 V
3.1
3.0
2.9
2.8
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VIN (V)
Figure 5. rON vs VIN (IOUT = 30 mA)
6
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0.5
0.5
0.4
0.4
0.3
0.3
Differential Signal (V)
Differential Signal (V)
www.ti.com .......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008
0.2
0.1
0.0
–0.1
–0.2
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.3
–0.4
–0.4
–0.5
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0
0.2
0.4
0.5
–9
0.8
1.0
1.2
1.4
1.6
1.8
2.0
–9
Time (X 10 ) (s)
Time (X 10 ) (s)
Figure 6. Eye Pattern: 480-Mbps USB Signal With No
Switch (Through Path)
Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch
NC Path
0.5
0.4
Differential Signal (V)
0.3
0.2
0.1
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
0.0
0.2
0.4
0.5
0.8
1.0
1.2
1.4
1.6
1.8
2.0
–9
Time (X 10 ) (s)
Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch
NO Path
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TS3USB221A
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PARAMETER MEASUREMENT INFORMATION
VCC
1D or 2D VOUT1 or VOUT2
VIN
RL
CL
VCOM
tON
500 Ω
50 pF
V+
tOFF
500 Ω
50 pF
V+
D
CL(2)
1D or 2D
VCTRL
TEST
RL
S
CL(2)
Logic
Input(1)
RL
GND
1.8 V
Logic
Input
(VI)
50%
50%
0
tON
Switch
Output
(VOUT1 or VOUT2)
(1)
(2)
tOFF
90%
90%
VOH
VOL
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 9. Turn-On (tON) and Turn-Off Time (tOFF)
VCC
Network Analyzer
Channel OFF: 1D to D
50 W
VOUT1 1D
VCTRL = VCC or GND
D
Source
Signal
50 W
VIN
2D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VCTRL S
50 W
+
GND
DC Bias = 350 mV
Figure 10. OFF Isolation (OISO)
8
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PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
Channel ON: 1D to D
50 W
VOUT1 1D
Channel OFF: 2D to D
VIN
Source
Signal
VCTRL = VCC or GND
VOUT2 2D
50 W
Network Analyzer Setup
50 W
VCTRL S
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 11. Crosstalk (XTALK)
VCC
Network Analyzer
50 W
VOUT1
1D
Channel ON: 1D to D
D
Source
Signal
VIN
VCTRL = VCC or GND
2D
Network Analyzer Setup
50 W
VCTRL
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
S
GND
DC Bias = 350 mV
Figure 12. Bandwidth (BW)
400 mV
Figure 13. Propagation Delay
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PARAMETER MEASUREMENT INFORMATION (continued)
800 mV
50%
50%
Input
400 mV
tPLH
tPHL
VOH
50%
Output
VOL
tSK(P) = | tPHL – tPLH |
PULSE SKEW tSK(P)
800 mV
50%
50%
Input
400 mV
tPLH1
tPHL1
VOH
50%
50%
Output 1
VOL
tSK(O)
tSK(O)
VOH
50%
50%
Output 2
tPLH2
VOL
tPHL2
tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 |
OUTPUT SKEW tSK(P)
Figure 14. Skew Test
VCC
VOUT1 1D
+
D
VIN
Channel ON
VOUT2 2D
r on +
VCTRL
IIN
S
VIN * VOUT2 or VOUT1
W
IIN
VCTRL = VIH or VIL
+
GND
Figure 15. ON-State Resistance (ron)
10
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PARAMETER MEASUREMENT INFORMATION (continued)
VCC
VOUT1 1D
VIN
D
+
VOUT2 2D
VCTRL
+
S
OFF-State Leakage Current
Channel OFF
VCTRL = VIH or VIL
+
GND
Figure 16. OFF-State Leakage Current
VCC
VOUT1 1D
Capacitance
Meter
VBIAS
VBIAS = VCC or GND
VOUT2 2D
VCTRL = VCC or GND
VIN D
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
VCTRL S
GND
Figure 17. Capacitance
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11
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS3USB221ARSER
ACTIVE
QFN
RSE
10
3000 Green (RoHS &
no Sb/Br)
Cu NIPDAU
Level-1-260C-UNLIM
TS3USB221ARSERG4
ACTIVE
QFN
RSE
10
3000 Green (RoHS &
no Sb/Br)
Cu NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3USB221ARSER
Package Package Pins
Type Drawing
QFN
RSE
10
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
3000
180.0
8.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
1.68
2.13
0.76
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3USB221ARSER
QFN
RSE
10
3000
202.0
201.0
28.0
Pack Materials-Page 2
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Amplifiers
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amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
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