CM1204 4-Channel ESD Array in CSP Features Product Description • The CM1204 is a quad ESD transient voltage supression diode array. Each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes are designed and characterized to safely dissipate ESD strikes of +15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +30kV. • • • • • • • Functionally and pin compatible with CMD’s CSPESD304 Optiguard™ coated for improved reliability Four channels of ESD protection +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5-bump, 0.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • • ESD protection for sensitive electronic equipment I/O port and keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs The CM1204 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1204 features Optiguard™ coating which results in improved reliability at assembly. It is available in a space-saving, low-profile chip scale package with optional lead-free finishing. Electrical Schematic ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3 GND B2 © 2004 California Micro Devices Corp. All rights reserved. 05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CM1204 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 ESD_3 A C1 C3 GND S B ESD_4 B2 Orientation Marking C ESD_1 ESD_2 A1 A3 A1 CM1204 Notes: CSP Package with OptiGuard™ 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 ESD1 ESD Channel1 A3 ESD2 ESD Channel 2 B2 GND Device Ground C1 ESD3 ESD Channel 3 C3 ESD4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Ordering Part Pins Package Number1 5 CSP CM1204-03CS Ordering Part Part Marking Number1 Part Marking S CM1204-03CP S Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 05/10/04 CM1204 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C 200 mW RATING UNITS -40 to +85 °C DC Package Power Rating STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN Diode Reverse Breakdown Voltage IDIODE = 10µA 5.5 ILEAK Diode Leakage Current VIN=3.3V, TA=25°C VSIG Signal Voltage Positive Clamp Negative Clamp IDIODE = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2, 3 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2, 3 and 4 Diode Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC VDIODE VESD VCL C DIODE Note 1: Note 2: Note 3: Note 4: 5.6 -0.4 TYP MAX UNITS V 6.8 -0.8 100 nA 9.0 -1.5 V V ±30 kV ±15 kV +15 -8 22 27 V V 32 pF TA=-40 to +85°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization. © 2004 California Micro Devices Corp. All rights reserved. 05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CM1204 Performance Information Capacitance (Normalized) Diode Characteristics (nominal conditions unless specified otherwise) DC Voltage Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 05/10/04 CM1204 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 2. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 3. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2004 California Micro Devices Corp. All rights reserved. 05/10/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CM1204 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1204 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. OptiGuard™ Coated CSP BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS B4 B3 B2 B1 Custom CSP C Bumps 5 B Dim Millimeters Inches Nom A Nom Max Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 1 2 3 C2 Min # per tape and reel Min A2 Package 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1204 Chip Scale Packages 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1204 1.33 X 0.96 X 0.670 1.42 X 1.07 X 0.740 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 5. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 05/10/04