CALMIRCO CM3002-18

CM3002
Micropower 1.0A Low Dropout CMOS Regulators
Features
Product Description
•
The CM3002 family of regulators are very low dropout
regulators that deliver up to 1.0A of load current at a
fixed voltage output. Input and output voltage options
for the CM3002 family devices are presented in
Table 1.
•
•
•
•
•
•
•
•
•
•
Regulated output options: 1.5, 1.8, 2.5 and
3.3 volts
1.0A output current
Operates from 3.3V supply (5.0V for CM3002-33)
Very low dropout voltage on CM3002-33
products ([email protected])
Enable Output Control for power-up sequencing
Low quiescent operating current (< 600µA typical)
Current limit protection
Thermal overload protection
Reverse voltage protection
Available in thermally-enhanced SOIC-8 and
MSOP-8 (CM3002-33MA/MF) packages
Lead-free versions available
Applications
•
•
•
Low Voltage "Core" Processors
Peripheral Adapter Cards
Portable/Battery-Powered Devices
Table 1: CM3002 Regulator Family
PRODUCT
INPUT
VOLTAGE
OUTPUT VOLTAGE
CM3002-15SA/SF
3.3V
1.5V
CM3002-18SA/SF
3.3V
1.8V
CM3002-25SA/SF
3.3V
2.5V
CM3002-33SA/SF
5.0V or 3.3V
3.3V
CM3002-33MA/MF
5.0V or 3.3V
3.3V
Operating from a single input supply, these devices are
ideally suited for powering low voltage “core” processors, especially where a 3.3V source is already available.
These regulators feature a dedicated control input (EN,
Active High) for power-up sequencing flexibility. When
this input is taken low, the regulator output is disabled.
In this state, the supply current will drop to a low level
to ensure all the internal control circuitry still remains
active. This provides excellent start-up response whenever the device comes out of shutdown.
The CM3002 family of regulators is fully protected,
offering both overload current limiting and high temperature thermal shutdown. Housed in space saving thermally-enhanced SOIC-8 and MSOP-8 (CM3002-33MA/
MF) packages, these devices ensure maximum junction-to-ambient power dissipation.
The CM3002 is available with optional lead-free finishing.
Simplified Electrical Schematic
Typical Application Circuit
VCC
VCC
Supply
Voltage +
-
VOUT
VOUT
EN
EN
+
Thermal Sensor
&
Current Limit
GND
+
1µF
100nF
Reference
Voltage
10µF
+
EN
VOUT
GND
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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▲ Fax: 408.263.7846
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1
CM3002
PACKAGE / PINOUT DIAGRAMS
Top View
Top View
EN
1
8
GND
EN
1
8
GND
VCC
2
7
GND
VCC
2
7
GND
VOUT
3
6
GND
VOUT
3
6
GND
N.C.
4
5
GND
N.C.
4
5
GND
8-pin SOIC
(CM3002-xxSA/SF)
8-pin MSOP
(CM3002-33MA/MF only)
Note: These drawings are not to scale.
PIN DESCRIPTIONS
PIN(S)
NAME
1
EN
DESCRIPTION
A logic input control to enable the regulator output. When EN is asserted (logic high), it allows output regulation to commence. When EN is deasserted (logic low), the regulator pass transistor (Nchannel MOSFET) is forced into a high impedance mode.
All other internal circuitry is unaffected by the state of the EN input and will always remain powered
whenever VCC is present.
An internal pull-up current (2µA) from VCC must be overdriven in order to apply a Logic Low to the
EN control input.
The EN control input is intended to be used for power-up sequencing.
2
VCC
The input power supply for the regulator. If this input is within a few inches of the main supply filter,
a capacitor may not be necessary. Otherwise an input filter capacitor of approximately 1uF to 10uF
will ensure adequate filtering.
3
VOUT
The regulator voltage output used to power the load. A nominal output capacitor of 10uF is sufficient to minimize any transient disturbances under normal operating conditions. Additional output
capacitance can be used to further improve transient load response.
4
N.C.
These pins have no connection to the internal device. To provide additional thermal performance,
these pins can be connected directly to the PC board GND plane.
5,6,7,8
GND
The negative reference for all voltages.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
Regulator
Pins
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
CM3002-15
8
Power SOIC
CM3002-15SA
CM3002-15SA
CM3002-15SF
CM3002-15SF
CM3002-18
8
Power SOIC
CM3002-18SA
CM3002-18SA
CM3002-18SF
CM3002-18SF
CM3002-25
8
Power SOIC
CM3002-25SA
CM3002-25SA
CM3002-25SF
CM3002-25SF
CM3002-33
8
Power SOIC
CM3002-33SA
CM3002-33SA
CM3002-33SF
CM3002-33SF
CM3002-33
8
Power MSOP
CM3002-33MA
233
CM3002-33MF
233R
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
© 2004 California Micro Devices Corp. All rights reserved.
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CM3002
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
+2000
V
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
V
V
V
-40 to +150
°C
0 to +70
0 to +150
°C
°C
Internally Limited
W
ESD Protection (HBM)
Pin Voltages
VCC
EN
VOUT
Storage Temperature Range
Operating Temperature Range
Ambient
Junction
Power Dissipation (Note 1)
Note 1: The SOIC and MSOP packages are thermally enhanced through the use of a fused integral leadframe. The power rating is
based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND
pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for
additional dedicated copper area. Please consult with factory for thermal evaluation assistance.
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
VCC (CM3002-15SA, CM3002-18SA, CM3002-25SA)
3.0 to 3.6
V
VCC (CM3002-33SA, CM3002-33MA)
3.0 to 5.5
V
Ambient Operating Temperature Range
0 to +70
°C
0 to +1000
mA
10 +20%
µF
Load Current
CEXT
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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3
CM3002
Specifications (cont’d)
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
VOUT
ILIM
VR LOAD
VR LINE
IQ
IQ
IGND
IGND
IRCC
VIH
VIL
IEN
TDISABLE
THYST
PARAMETER
Regulator Output Voltage
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
Overload Current Limit
Load Regulation
CM3002-15SA/SF, -18SA/SF,
-25SA/SF
CM3002-33SA/SF, -33MA/MF
Line Regulation xx
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
Quiescent Current
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
Quiescent Current
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
Ground Current
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
Ground Current
CM3002-15SA/SF
CM3002-18SA/SF
CM3002-25SA/SF
CM3002-33SA/SF, -33MA/MF
VCC Pin Reverse Leakage
Enable Input Logic High Threshold
Enable Input Logic Low Threshold
Enable Input Current
Shutdown Temperature
Thermal Hysteresis
CONDITIONS
MIN
TYP
MAX
UNITS
0mA < ILOAD < 1000mA
0mA < ILOAD < 1000mA
0mA < ILOAD < 1000mA
0mA < ILOAD < 1000mA; VCC=5.0
1.42
1.72
2.40
3.10
1.50
1.80
2.50
3.30
1.58
1.88
2.60
3.50
V
V
V
V
1500
mA
10mA < ILOAD < 1000mA; VCC=3.3V
20
mV
10mA < ILOAD < 1000mA; VCC=5.0V
20
mV
ILOAD = 5mA; 3.0V < VCC < to 5.5V
ILOAD = 5mA; 3.0V < VCC < to 5.5V
ILOAD = 5mA; 3.0V < VCC < to 5.5V
ILOAD = 5mA; 4.5V < VCC < to 5.5V
20
20
30
20
mV
mV
mV
mV
EN tied to VCC; ILOAD= 0mA
EN tied to VCC; ILOAD= 0mA
EN tied to VCC; ILOAD= 0mA
EN tied to VCC; ILOAD= 0mA
500
500
500
600
900
900
900
900
µA
µA
µA
µA
EN tied to GND; ILOAD= 0mA
EN tied to GND; ILOAD= 0mA
EN tied to GND; ILOAD= 0mA
EN tied to GND; ILOAD= 0mA
150
150
150
200
300
300
300
300
µA
µA
µA
µA
ILOAD = 0mA
ILOAD = 0mA
ILOAD = 0mA
ILOAD = 0mA
500
500
500
600
900
900
900
900
µA
µA
µA
µA
ILOAD = 1000mA
ILOAD = 1000mA
ILOAD = 1000mA
ILOAD = 1000mA
VOUT = 3.3V; VCC = 0V
500
500
500
600
1
900
900
900
900
100
µA
µA
µA
µA
µA
V
V
µA
°C
°C
1.5
Internal current source from VCC
2
160
25
0.3
10
Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified.
© 2004 California Micro Devices Corp. All rights reserved.
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08/16/04
CM3002
Performance Information
CM3002-15SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=GND)
700
700
600
600
Supply Current [uA]
Supply Current [uA]
Supply Current vs. Voltage (EN=VCC)
500
400
300
200
100
500
400
300
200
100
0
0
0
1
2
3
VCC [V]
4
0
5
Line Regulation with 1A Load
2
3
VCC [V]
4
5
Ground Current vs. Output Load
700
1.56
600
Ground Current [uA]
1.58
1.54
VOUT[V]
1.52
1.50
1.48
1.46
1.44
500
400
300
200
100
1.42
0
3.0
3.1
3.2
3.3 3.4
VCC [V]
3.5
0
3.6
200
400 600 800 1000 1200
Load Current [mA]
Current Limiting Protection
Load Regulation
1.58
1.6
1.56
1.4
1.54
1.2
1.52
1.0
VOUT[V]
VOUT[V]
1
1.50
0.8
1.48
0.6
1.46
0.4
1.44
0.2
1.42
0
200
400
600
800 1000 1200
0.0
0
Load Current [mA]
500
1000
1500
Load Current [mA]
2000
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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▲
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CM3002
Performance Information (cont’d)
CM3002-18SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=GND)
700
700
600
600
Supply Current [uA]
Supply Current [uA]
Supply Current vs. Voltage (EN=VCC)
500
400
300
200
100
500
400
300
200
100
0
0
1
2
3
VCC [V]
4
0
5
0
Line Regulation with 1A Load
1
2
3
VCC [V]
4
5
6
Ground Current vs. Output Load
1.88
700
Ground Current [uA]
1.86
1.84
VOUT [V]
1.82
1.80
1.78
1.76
1.74
1.72
3.0
3.1
3.2
3.3
3.4
3.5
600
500
400
300
200
100
0
3.6
0
VCC [V]
Load Regulation
1.86
1.84
VOUT [V]
VOUT [V]
1.80
1.78
1.76
1.74
1.72
0
200 400 600
1000
Current Limiting Protection
1.88
1.82
200
400
600
800
Load Current [mA]
800 1000 1200 1400
Load Current [mA]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
500
1000
1500
Load Current [mA]
2000
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08/16/04
CM3002
Performance Information (cont’d)
CM3002-25SA/SF Typical DC Characteristics (nominal conditions unless specified otherwise)
Supply Current vs. Voltage (EN=GND)
600
600
500
500
Supply Current [uA]
Supply Current [uA]
Supply Current vs. Voltage (EN=VCC)
400
300
200
100
400
300
200
100
0
0
0
1
2
3
VCC [V]
4
0
5
Line Regulation (rated 1.0 Amp Load)
2.60
2.58
2.56
2
3
VCC [V]
4
5
Ground Current vs. Output Load
Ground Current [uA]
600
VOUT [V]
2.54
2.52
2.50
2.48
2.46
2.44
2.42
2.40
500
400
300
200
100
0
3.0
3.1
3.2
3.3
3.4
3.5
0
3.6
VCC [V]
200
400
600
800
1000
Load Current [mA]
Load Regulation
Current Limiting Protection
3.0
2.52
2.5
VOUT [V]
2.51
VOUT [V]
1
2.50
2.0
1.5
1.0
2.49
0.5
2.48
0.0
0
250
500
750
1000
Load Current [mA]
1250
0
500
1000
1500
Load Current [mA]
2000
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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CM3002
Performance Information (cont’d)
CM3002-33SA/SF & CM3002-33MA/MF Typical DC Characteristics
(nominal conditions unless specified otherwise, data representative of SOIC packaged -33SA/SF devices)
Supply Current vs. Voltage (EN=GND)
700
700
600
600
Supply Current [uA]
Supply Current [uA]
Supply Current vs. Voltage (EN=VCC)
500
400
300
200
100
500
400
300
200
100
0
0
0
1
2
3
4
VCC [V]
5
6
0
Ground Current [uA]
VOUT [V]
4
5
6
700
5mA Load
3.2
1A Load
3.1
600
500
400
300
200
100
3.0
0
3.0
3.5
4.0
4.5
5.0
VCC [V]
5.5
6.0
0
Dropout Voltage vs. Load (Vout=3.2V)
200
400 600 800 1000 1200
Load Current [mA]
Current Limiting Protection
0.6
3.5
0.5
3.0
2.5
0.4
VOUT[V]
Dropout [V]
3
Ground Current vs. Output Load
4
3.3
2
VCC [V]
Line Regulation with 5mA & 1A Load
3.
1
2.0
0.3
1.5
0.2
1.0
0.1
0.5
0.0
0.0
0
200
400
600
800
Load Current [mA]
1000 1200
0
500
1000
1500
2000
Load Current [mA]
2500
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CM3002
Performance Information (cont’d)
CM3002-33SA & CM3002-33MA/MF Typical DC Characteristics (continued)
Load Regulation (VCC = 5V)
Load Regulation (VCC = 3.3V)
3.34
3.4
3.3
3.2
VOUT [V]
VOUT [V]
3.32
3.30
3.1
3.0
2.9
2.8
3.28
2.7
2.6
2.5
3.26
0
200 400 600 800 1000 1200
Load Current [mA]
0
200
400
600
Load Current [mA]
800
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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▲
Fax: 408.263.7846
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CM3002
Performance Information (cont’d)
CM3002-15SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load
Full Power Down with Rated Load
Power-Up Sequencing using Enable Input
Line Transient Step Response (0.6Vp-p)
Load Transient Response (50mA to 450mA)
Load Transient Response (100mA to 900mA)
© 2004 California Micro Devices Corp. All rights reserved.
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▲
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08/16/04
CM3002
Performance Information (cont’d)
CM3002-18SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load
Full Power Down with Rated Load
Power-Up Sequencing using Enable Input
Load Transient Response (50mA to 500mA)
Line Transient Step Response (1Vp-p)
Load Transient Response (100mA to 900mA)
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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CM3002
Performance Information (cont’d)
CM3002-25SA/SF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start Power-up with Rated Load
Power-Up Sequencing using Enable Input
Load Transient Response (50mA to 450mA)
Full Power Down with Rated Load
Line Transient Step Response (1Vp-p)
Load Transient Response (100mA to 900mA)
© 2004 California Micro Devices Corp. All rights reserved.
12 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
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▲
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08/16/04
CM3002
Performance Information (cont’d)
CM3002-33SA/SF & CM3002-33MA/MF Typical Transient Characteristics (nominal conditions unless specified otherwise)
Cold Start (1A Load)
Full Power Down (1A Load)
Line Transient Response (4.0V to 5.0V Line Step)
Power-Up Sequencing using Enable Input (1A Load)
Load Transient Response (VCC=5V)
Load Transient Response (VCC=3.3V)
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
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13
CM3002
Performance Information (cont’d)
Typical Thermal Characteristics
The overall junction to ambient thermal resistance
(θ JA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction
to the case (θ JC) which is defined by the package style,
and the second path is case to ambient (θ CA) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of conditions can be estimated by the following thermal equation:
TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA)
= TAMB + PD ∗ (θ JA)
The CM3002 family uses thermally enhanced SOIC
and MSOP packages where all the GND pins (5
through 8) are integral to the leadframe. When this
package is mounted on a double sided printed circuit
board with two square inches of copper allocated for
“heat spreading”, the resulting θJA is about 50° C/W for
the SOIC package and 70° C/W for the MSOP package.
Based on a maximum power dissipation of 0.8W (Load
x Vin-Vout = 1.0A x [3.3V-2.5V]) with an ambient of
70° C, the resulting junction temperature for a SOICpackaged device will be:
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
Measurements showing performance up to a junction
temperature of 125° C are presented in Figure 1,
Figure 2, Figure 3 and Figure 4. They were performed
under light load conditions (5mA); this allows the ambient temperature to be representative of the internal
junction temperature.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide a CM3002 device
packaged in a SOIC package with an overall θ JA of
50° C/W, which allows up to 0.8W to be dissipated
safely.
Please consult CAMD Technical Support for assistance
with thermal analysis of the CM3002 family of regulators with respect to a specific application.
TJUNC = TAMB + PD ∗ (θJA)
= 70° C + 0.8W ∗ (50° C/W)
= 70° C + 40° C = 110° C
Output Voltage with Temperature (5mA Load)
Ground Current with Temperature (No Load)
700
Ground Current [uA]
1.54
VOUT [V]
1.52
1.50
1.48
1.46
600
500
400
300
200
100
0
0
25
50
75
100
Junction Temperature [°C]
125
0
25
50
75
100
125
Junction Temperature [°C]
Figure 1. CM3002-15SA/SF Performance vs. Temperature
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CM3002
Performance Information (cont’d)
Output Voltage with Temperature (5mA Load)
700
1.83
600
Ground Current [uA]
1.84
1.82
VOUT [V]
Ground Current with Temperature (No Load)
1.81
1.80
1.79
1.78
1.77
500
400
300
200
100
0
1.76
25
50
75
100
125
25
150
50
Junction Temperature [°C]
75
100
125
150
Junction Temperature [°C]
Figure 2. CM3002-18SA/SF Performance vs. Temperature
Output Voltage with Temperature (5mA Load)
Ground Current with Temperature (No Load)
2.58
500
Ground Current [uA]
2.56
VOUT [V]
2.54
2.52
2.50
2.48
2.46
2.44
2.42
400
300
200
100
0
25
50
75
100
125
Junction Temperature [°C]
150
25
50
75
100
125
Junction Temperature [°C]
150
Figure 3. CM3002-25SA/SF Performance vs. Temperature
Ground Current with Temperature (No Load)
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
700
Ground Current [uA]
VOUT [V]
Output Voltage with Temperature (5mA Load)
600
500
400
300
200
100
0
0
25
50
75
100
Junction Temperature [°C]
125
0
25
50
75
100
125
Junction Temperature [°C]
Figure 4. CM3002-33SA/SF & CM3002-33MA/MF Performance vs. Temperature
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
15
CM3002
Mechanical Details
CM3002 devices are packaged in 8-pin Narrow SOIC
(CM3002-xxSA/SF) and 8-pin MSOP (CM3002-33MA/
MF only) packages.
Mechanical Package Diagrams
TOP VIEW
D
SOIC-8 Mechanical Specifications:
8
Dimensions for CM3002-xxSA/SF devices packaged in
8-pin Narrow SOIC packages are presented below.
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Information document.
H
PACKAGE DIMENSIONS
Package
SOIC
Pins
8
Dimensions
Millimeters
Min
Max
Min
Max
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.19
0.150
0.165
e
1.27 BSC
0.050 BSC
H
5.80
6.20
0.228
0.244
L
0.40
1.27
0.016
0.050
# per tube
100 pcs*
# per tape
and reel
2500 pcs
Controlling dimension: inches
5
2
3
E
4
SIDE VIEW
Inches
1.35
6
Pin 1
Marking
1
A
7
A
A1
SEATING
PLANE
B
e
END VIEW
C
L
Package Dimensions for SOIC-8
* This is an approximate number which may vary.
© 2004 California Micro Devices Corp. All rights reserved.
16 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
08/16/04
CM3002
Mechanical Details (cont’d)
MSOP-8 Mechanical Specifications:
Mechanical Package Diagrams
CM3002-33MA/MF devices are packaged in 8-pin
MSOP packages. Dimensions are presented below.
TOP VIEW
D
For complete information on the MSOP-8 package, see
the California Micro Devices MSOP Package Information document.
8
PACKAGE DIMENSIONS
Package
MSOP
Pins
8
Dimensions
6
5
E
H
Pin 1
Marking
Millimeters
Inches
Min
Max
Min
Max
A
0.87
1.17
0.034
0.046
A1
0.05
0.25
0.002
0.010
B
0.30 (typ)
0.012 (typ)
C
0.18
0.007
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
0.65 BSC
1
2
3
4
SIDE VIEW
A
D
e
7
SEATING
PLANE
A1
B
e
0.025 BSC
H
4.78
4.98
0.188
0.196
L
0.52
0.54
0.017
0.025
# per tube
80 pcs*
# per tape
and reel
4000 pcs
END VIEW
C
L
Controlling dimension: inches
* This is an approximate number which may vary.
Package Dimensions for MSOP-8
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
17