TI SN74ALS374ANSR

SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
D
D
D
SN54ALS374A, SN54AS374 . . . J PACKAGE
SN74ALS374A, SN74AS374 . . . DW OR N PACKAGE
(TOP VIEW)
D-Type Flip-Flops in a Single Package With
3-State Bus Driving True Outputs
Full Parallel Access for Loading
Buffered Control Inputs
Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK), and Standard Plastic (N)
and Ceramic (J) DIPs
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description
These octal D-type edge-triggered flip-flops
feature 3-state outputs designed specifically for
driving
highly
capacitive
or
relatively
low-impedance loads. They are particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
1D
1Q
SN54ALS374A, SN54AS374 . . . FK PACKAGE
(TOP VIEW)
On the positive transition of the clock (CLK) input,
the Q outputs are set to the logic levels set up at
the data (D) inputs.
2D
2Q
3Q
3D
4D
4
2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
A buffered output-enable (OE) input places the
eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In
the high-impedance state, the outputs neither
load nor drive the bus lines significantly. The
high-impedance state and the increased drive
provide the capability to drive bus lines without
interface or pullup components.
3
OE
VCC
8Q
D
OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
The SN54ALS374A and SN54AS374 are characterized for operation over the full military temperature range
of –55°C to 125°C. The SN74ALS374A and SN74AS374 are characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
logic symbol†
OE
CLK
1
logic diagram (positive logic)
OE
EN
11
CLK
C1
1
11
C1
1D
2D
3D
4D
5D
6D
7D
8D
3
2
1D
4
5
7
6
8
9
13
12
14
15
17
16
18
19
1Q
1D
3
2
1Q
1D
2Q
3Q
4Q
To Seven Other Channels
5Q
6Q
7Q
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage applied to a disabled 3-state output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Package thermal impedance, θJA (see Note 1): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions
SN54ALS374A
2
SN74ALS374A
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.7
0.8
V
High-level output current
–1
–2.6
mA
IOL
TA
Low-level output current
24
mA
70
°C
High-level input voltage
2
2
12
Operating free-air temperature
–55
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
125
0
V
V
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = –18 mA
IOH = –0.4 mA
5V
VCC = 4
4.5
IOH = –1 mA
IOH = –2.6 mA
VOL
VCC = 4
4.5
5V
IOL = 12 mA
IOL = 24 mA
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.4 V
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
IIL
IO‡
VCC = 5.5 V,
VCC = 5.5 V,
VI = 0.4 V
VO = 2.25 V
VOH
ICC
SN54ALS374A
TYP†
MAX
TEST CONDITIONS
VCC = 5.5 V
MIN
SN74ALS374A
TYP†
MAX
MIN
–1.5
VCC–2
2.4
UNIT
–1.5
V
VCC–2
V
3.3
2.4
0.25
–20
0.4
3.2
0.25
0.4
0.35
0.5
V
20
20
µA
–20
–20
µA
0.1
0.1
mA
20
20
µA
–0.2
–0.2
mA
–112
mA
–112
–30
Outputs high
11
20
11
19
Outputs low
19
28
19
28
mA
Outputs disabled
20
31
20
31
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
SN54ALS374A
MIN
fclock
tw
Clock frequency
Pulse duration
CLK high or low
tsu
th
Setup time
Data before CLK↑
Hold time
Data after CLK↑
MAX
SN74ALS374A
MIN
30
MAX
35
UNIT
MHz
16.5
14
ns
10
10
ns
4
0
ns
switching characteristics over recommended operating conditions (unless otherwise noted
(see Figure 3)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
SN54ALS374A
MIN
MAX
30
CLK
Q
OE
Q
OE
Q
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74ALS374A
MIN
MAX
35
UNIT
MHz
3
14
3
12
5
17
5
16
3
18
3
17
5
21
5
18
1
11
1
10
2
19
2
18
ns
ns
ns
3
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
recommended operating conditions
SN54AS374
SN74AS374
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.7
0.8
V
High-level output current
–12
–15
mA
IOL
TA
Low-level output current
32
48
mA
70
°C
High-level input voltage
2
Operating free-air temperature
2
–55
125
V
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V to 5.5 V,
II = –18 mA
IOH = –2 mA
VCC = 4
4.5
5V
IOH = –12 mA
IOH = –15 mA
VOL
VCC = 4
4.5
5V
IOL = 32 mA
IOL = 48 mA
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.4 V
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 7 V
VI = 2.7 V
VOH
IIL
OE, CLK
Data
IO‡
ICC
VCC = 5
5.5
5V
V,
VI = 0
0.4
4V
VCC = 5.5 V,
VO = 2.25 V
Outputs high
VCC = 5.5 V
SN54AS374
TYP†
MAX
MIN
SN74AS374
TYP†
MAX
MIN
–1.2
VCC–2
2.4
–1.2
UNIT
V
VCC–2
V
3.2
2.4
0.29
3.3
0.5
0.34
–30
0.5
V
µA
50
50
–50
–50
µA
0.1
0.1
mA
µA
20
20
–0.5
–0.5
–3
–2
–112
–30
–112
77
120
77
120
Outputs low
84
128
84
128
Outputs disabled
84
128
84
128
mA
mA
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
SN54AS374
MIN
fclock
Clock frequency
tw
Pulse duration
tsu
th
SN74AS374
MIN
100*
CLK high
MAX
125
UNIT
MHz
5.5*
4
CLK low
3*
3
Setup time
Data before CLK↑
3*
2
ns
Hold time
Data after CLK↑
3*
2
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
4
MAX
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
ns
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
switching characteristics over recommended operating conditions (unless otherwise noted)
(see Figure 3)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
FROM
(INPUT)
TO
(OUTPUT)
SN54AS374
MIN
MAX
100*
CLK
Q
OE
Q
OE
Q
tPLZ
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74AS374
MIN
MAX
125
UNIT
MHz
3
11
3
8
4
11.5
4
9
2
7
2
6
3
11
3
10
2
10
2
6
2
7
2
6
ns
ns
ns
5
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
APPLICATION INFORMATION
Four SN54ALS374A,
SN74ALS374A,
or ’AS374
EN
C
8
8
’ALS139
A
Output-Enable
Select
B
G
X/Y
1
2
0
EN
1
C
2
EN
8
8
3
A
Input Clock
Select
B
EN
G
C
8
Clock
8
EN
C
8
8
Input
Figure 1. Expandable 4-Word by 8-Bit General File Register
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
8
8
Output
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
APPLICATION INFORMATION
SN54ALS374A,
SN74ALS374A,
or ’AS374
Output Enable 1
EN
Clock 1
C1
1D
Bidirectional
Data Bus 1
Bidirectional
Data Bus 2
SN54ALS374A,
SN74ALS374A,
or ’AS374
EN
Output Enable 2
Clock 2
C1
1D
Clock 1
H
Bus-Exchange
Clock
Clock 2
H
Clock Circuit for Bus Exchange
Figure 2. Bidirectional Bus Driver
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SN54ALS374A, SN54AS374, SN74ALS374A, SN74AS374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SDAS167C – APRIL 1982 – REVISED NOVEMBER 1999
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
7V
VCC
S1
500 Ω
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
CL = 50 pF
(see Note A)
500 Ω
3.5 V
Timing
Input
500 Ω
3.5 V
High-Level
Pulse
1.3 V
Test
Point
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT FOR
BI-STATE TOTEM-POLE OUTPUTS
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Test
Point
1.3 V
1.3 V
0.3 V
0.3 V
tw
th
tsu
3.5 V
Data
Input
1.3 V
3.5 V
Low-Level
Pulse
1.3 V
0.3 V
1.3 V
1.3 V
0.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3.5 V
Output
Control
1.3 V
1.3 V
3.5 V
0.3 V
tPZL
1.3 V
Input
tPLZ
1.3 V
0.3 V
≈3.5 V
Waveform 1
S1 Closed
(see Note B)
1.3 V
tPZH
Waveform 2
S1 Open
(see Note B)
tPLH
VOL + 0.3 V
VOL
In-Phase
Output
tPHZ
1.3 V
VOH
VOH – 0.3 V
≈0 V
1.3 V
tPHL
Out-of-Phase
Output
(see Note C)
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
tPHL
VOH
1.3 V
VOL
tPLH
VOH
1.3 V
1.3 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 3. Load Circuits and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9756201Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9756201QRA
ACTIVE
CDIP
J
20
1
TBD
5962-9756201QSA
ACTIVE
CFP
W
20
1
TBD
83020022A
ACTIVE
LCCC
FK
20
1
TBD
8302002RA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
8302002SA
ACTIVE
CFP
W
20
1
TBD
JM38510/37204B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/37204BRA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54ALS374AJ
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54AS374J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN74ALS374ADBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
SN74ALS374ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374AN
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ALS374AN3
OBSOLETE
PDIP
N
20
TBD
Call TI
SN74ALS374ANE4
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ALS374ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALS374ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS374DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS374DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS374DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS374DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
20
20
Addendum-Page 1
POST-PLATE N / A for Pkg Type
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AS374DWRG4
ACTIVE
SOIC
DW
20
SN74AS374N
ACTIVE
PDIP
N
20
SN74AS374N3
OBSOLETE
PDIP
N
20
SN74AS374NE4
ACTIVE
PDIP
N
20
SN74AS374NSR
ACTIVE
SO
NS
20
SN74AS374NSRE4
ACTIVE
SO
NS
SN74AS374NSRG4
ACTIVE
SO
SNJ54ALS374AFK
ACTIVE
SNJ54ALS374AJ
ACTIVE
SNJ54ALS374AW
ACTIVE
SNJ54AS374FK
ACTIVE
SNJ54AS374J
ACTIVE
SNJ54AS374W
ACTIVE
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TBD
Call TI
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LCCC
FK
20
1
TBD
CDIP
J
20
1
TBD
CFP
W
20
1
TBD
LCCC
FK
20
1
TBD
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CFP
W
20
1
TBD
A42
N / A for Pkg Type
20
20
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ALS374ADBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN74ALS374ADWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74ALS374ANSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74AS374DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74AS374NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74ALS374ADBR
DB
20
MLA
342.9
336.6
28.58
SN74ALS374ADWR
DW
20
MLA
333.2
333.2
31.75
SN74ALS374ANSR
NS
20
MLA
333.2
333.2
31.75
SN74AS374DWR
DW
20
MLA
333.2
333.2
31.75
SN74AS374NSR
NS
20
MLA
333.2
333.2
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated