CEL NESG250134-AZ

NEC's NPN SiGe RF TRANSISTOR
FOR MEDIUM OUTPUT POWER NESG250134
AMPLIFICATION (800 mW)
3-PIN POWER MINIMOLD (34 PACKAGE)
FEATURES
•
THIS PRODUCT IS SUITABLE FOR
MEDIUM OUTPUT POWER (800 mW) AMPLIFICATION
PO = 29 dBm TYP. @ VCE = 3.6 V, Pin = 15 dBm, f = 460 MHz
PO = 29 dBm TYP. @ VCE = 3.6 V, Pin = 20 dBm, f = 900 MHz
•
MAXIMUM STABLE GAIN:
MSG = 23 dB TYP @ VCE = 3.6 V, IC = 100 mA, f = 460 MHz
•
SiGe TECHNOLOGY:
UHS2-HV process
•
ABSOLUTE MAXIMUM RATINGS:
VCBO = 20 V
•
3-PIN POWER MINIMOLD (34 PACKAGE)
ORDERING INFORMATION
PART NUMBER
ORDER NUMBER
NESG250134-AZ
NESG250134-AZ
NESG250134-T1-AZ
NESG250134-T1-AZ
PACKAGE
QUANTITY
3-pin power minimold
(Pb-Free) Note1
25 pcs (Non reel)
• 12 mm wide embossed taping
SUPPLYING FORM
1 kpcs/reel
• Pin 2 (Emitter) face the perforation side of the tape
Note 1. Contains lead in the part except the electrode terminals.
Remark To order evaluation samples, contact your nearby sales office.
Unit sample quantity is 25 pcs.
ABSOLUTE MAXIMUM RATINGS (TA =+25ºC)
PARAMETER
SYMBOL
RATINGS
UNIT
Collector to Base Voltage
VCBO
20
V
Collector to Emitter Voltage
VCEO
9.2
V
Emitter to Base Voltage
VEBO
2.8
V
IC
500
mA
Ptot Note
1.5
W
Collector Current
Total Power Dissipation
Junction Temperature
Tj
150
°C
Storage Temperature
Tstg
−65 to +150
°C
Note Mounted on 34.2 cm2 × 0.8 mm (t) glass epoxy PWB
Caution
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
NESG250134
THERMAL RESISTANCE (TA = 25°C)
PARAMETER
Thermal Resistance from Junction to Ambient
Note
SYMBOL
RATINGS
UNIT
Rthj-a
80
°C/W
Note Mounted on 34.2 cm2 × 0.8 mm (t) glass epoxy PWB
RECOMMENDED OPERATING RANGE (TA = 25°C)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
VCE
−
3.6
4.5
V
Collector Current
IC
−
400
500
mA
Input Power
Pin
−
12
17
dBm
Collector to Emitter Voltage
Note
Note Input power under conditions of VCE ≤ 4.5 V, f = 460 MHz
NESG250134
ELECTRICAL CHARACHTERISTICS (TA = 25°C)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC Characteristics
Collector Cut-off Current
ICBO
VCB = 5 V, IE = 0 mA
−
−
1
μA
Emitter Cut-off Current
IEBO
VEB = 0.5 V, IC = 0 mA
−
−
1
hFE Note 1
VCE = 3 V, IC = 100 mA
80
120
180
μA
−
DC Current Gain
RF Characteristics
Gain Bandwidth Product
fT
VCE = 3.6 V, IC = 100 mA, f = 460 MHz
−
10
−
GHz
2
VCE = 3.6 V, IC = 100 mA, f = 460 MHz
−
19
−
dB
Note 2
VCE = 3.6 V, IC = 100 mA, f = 460 MHz
−
23
−
dB
16
19
−
dB
|S21e|
Insertion Power Gain
Maximum Stable Gain
MSG
Linear gain (1)
GL
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 460 MHz, Pin = 0 dBm
Linear gain (2)
GL
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 900 MHz, Pin = 0 dBm
−
16
−
dB
Output Power (1)
Po
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 460 MHz, Pin = 15 dBm
27
29
−
dBm
Output Power (2)
Po
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 900 MHz, Pin = 20 dBm
−
29
−
dBm
Collector Efficiency (1)
ηc
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 460 MHz, Pin = 15 dBm
−
60
−
%
Collector Efficiency (2)
ηc
VCE = 3.6 V, IC (set) = 30 mA (RF OFF),
f = 900 MHz, Pin = 20 dBm
−
60
−
%
Notes 1. Pulse measurement: PW ≤ 350 μs, Duty Cycle ≤ 2%
2. MSG =
S21
S12
hFE CLASSIFICATION
RANK
FB
Marking
SN
hFE Value
80 to 180
NESG250134
TYPICAL CHARACHTERISTICS (TA = +25°C, unless otherwise specified )
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Mounted on Glass epoxy PWB
(34.2 cm2 × 0.8 mm (t) )
1.6
1.5
1.2
0.8
Nature Neglect
0.4
25
0
1,000
50
75
100
125
150
1.0
0.8
0.6
0.4
0.2
2
4
6
8
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
1,000
10
1
0.1
0.01
0.001
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
500
10 mA
9 mA
8 mA
7 mA
6 mA
5 mA
4 mA
400
300
3 mA
200
2 mA
100
IB = 1 mA
1
2
3
4
5
Collector to Emitter Voltage VCE (V)
Remark The graphs indicate nominal characteristics.
10
VCE = 4 V
100
10
1
0.1
0.01
0.001
0.0001
0.4
0.5
0.6
0.7
0.8
0.9
Base to Emitter Voltage VBE (V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
Collector Current IC (mA)
1.2
Collector to Base Voltage VCB (V)
100
0
f = 1 MHz
1.4
Ambient Temperature TA (ºC)
VCE = 3 V
0.0001
0.4
1.6
0
Collector Current IC (mA)
Collector Current IC (mA)
Reverse Transfer Capacitance Cre (pF)
Total Power Dissipation Ptot (mW)
2.0
1.0
NESG250134
DC CURRENT GAIN vs.
COLLECTOR CURRENT
100
10
10
Gain Bandwidth Product fT (GHz)
20
16
1,000
DC Current Gain hFE
VCE = 3 V
100
VCE = 4 V
100
10
10
1,000
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
20
VCE = 3 V
f = 460 MHz
8
4
0
10
100
16
VCE = 3.6 V
f = 460 MHz
12
8
4
0
10
1,000
Collector Current IC (mA)
8
4
1,000
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Gain Bandwidth Product fT (GHz)
12
100
1,000
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
VCE = 4 V
f = 460 MHz
0
10
100
Collector Current IC (mA)
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
16
1,000
Collector Current IC (mA)
12
20
100
Collector Current IC (mA)
Gain Bandwidth Product fT (GHz)
DC Current Gain hFE
1,000
DC CURRENT GAIN vs.
COLLECTOR CURRENT
40
VCE = 3 V
IC = 100 mA
35
30
MSG
MAG
25
20
15
10
5
|S21e|2
0
0.1
1
Frequency f (GHz)
10
NESG250134
VCE = 3.6 V
IC = 100 mA
35
30
MSG
MAG
25
20
15
10
5
0
0.1
|S21e|2
1
10
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
40
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
40
VCE = 4 V
IC = 100 mA
35
30
MSG
MAG
25
20
15
10
5
|S21e|2
0
0.1
1
10
Frequency f (GHz)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 3 V
f = 460 MHz
MSG
MAG
20
|S21e|2
15
10
5
0
10
100
1,000
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Frequency f (GHz)
25
20 MSG
15
VCE = 3 V
f = 900 MHz
MAG
10
|S21e|2
5
0
-5
10
100
1,000
Collector Current IC (mA)
Collector Current IC (mA)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
30
25
VCE = 3.6 V
f = 460 MHz
MSG
MAG
20
15
|S21e|2
10
5
0
10
100
1,000
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN,
MAG, MSG vs. FREQUENCY
25
20 MSG
15
10
VCE = 3.6 V
f = 900 MHz
MAG
|S21e|2
5
0
-5
10
100
Collector Current IC (mA)
1,000
NESG250134
25
MSG
VCE = 4 V
f = 460 MHz
MAG
20
|S21e|2
15
10
5
0
10
100
1,000
25
20 MSG
VCE = 4 V
f = 900 MHz
MAG
15
|S21e|2
10
5
0
-5
10
100
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
30
25
600
VCE = 3.6 V, f = 460 MHz
IC (set) = 30 mA
500
GP
20
400
15
300
Pout
10
200
IC
5
100
ηC
0
-10
-5
0
5
10
0
20
15
Input Power Pin (dBm)
NOISE FIGURE, ASSOCIATED GAIN
vs. COLLECTOR CURRENT
25
Ga
4
20
3
15
2
10
NF
1
0
10
VCE = 3.6 V
f = 460 MHz
100
5
0
1,000
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
Associated Gain Ga (dB)
Noise Figure NF (dB)
5
Output Power Pout (dBm), Power Gain GP (dB)
Collector Current IC (mA)
Collector Current IC (mA), Collector Efficiency η C (%)
Output Power Pout (dBm), Power Gain GP (dB)
Collector Current IC (mA)
1,000
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
30
25
600
VCE = 3.6 V, f = 900 MHz
IC (set) = 30 mA
20
15
500
Pout
400
GP
300
10
200
IC
5
0
-10
100
ηC
-5
0
5
10
Input Power Pin (dBm)
15
0
20
Collector Current IC (mA), Collector Efficiency η C (%)
30
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
Maximum Stable Power Gain MSG (dB)
INSERTION POWER GAIN, MAG, MSG
vs. COLLECTOR CURRENT
NESG250134
PA EVALUATION BOARD (f = 460 MHz)
GND Vb
VC GND
R1 C10
C9
C8
C1
SN
SN
RF IN
RF OUT
C2
C7
C3
C4
L1
C6
C5
L2
Notes
1. 38 × 90 mm, t = 0.8 mm double sided copper clad glass epoxy PWB.
2. Back side: GND pattern
3. Solder gold plated on pattern
4.
: Through holes
PA EVALUATION CIRCUIT (f = 460 MHz)
VCE
VBE
R1
C10
C9
L2
C8
L1
RF OUT
C1
RF IN
C2
C3
C4
C5
C6
C7
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
NESG250134
COMPONENT LIST
VALUE
MAKER
C1
30 pF
Murata
C2
6 pF
Murata
C3, C4
7 pF
Murata
C5
3 pF
Murata
C6
0.5 pF
Murata
C7
5 pF
Murata
C8
10 pF
Murata
C9, C10
100 nF
Murata
L1
100 nH
Toko
L2
3 nH
Toko
R1
30 Ω
SSM
OUTPUT POWER, POWER GAIN,
COLLECTOR CURRENT, COLLECTOR
EFFICIENCY vs. INPUT POWER
30
25
600
VCE = 3.6 V, f = 460 MHz
IC (set) = 40 mA
20
500
GP
400
15
300
Pout
10
200
IC
5
0
-10
100
ηC
-5
0
5
10
Input Power Pin (dBm)
15
0
20
Collector Current IC (mA), Collector Efficiency ηC (%)
Output Power Pout (dBm), Power Gain GP (dB)
PA EVALUATION CIRCUIT TYPICAL CHARACTERISTICS
Remark The graphs indicate nominal characteristics.
NESG250134
DISTORTION EVALUATION BOARD (f = 460 MHz)
GND Vb
VC GND
R1 C12 C11
C10
C9
C1
SN
SN
RF IN
RF OUT
C8
C3
C2
L1
C4
C5
C6 C7
L2
Notes
1. 38 × 90 mm, t = 0.8 mm, double sided copper clad glass epoxy
PWB.
2. Back side: GND pattern
3. Solder gold plated on pattern
4.
: Through holes
DISTORTION EVALUATION CIRCUIT (f = 460 MHz)
VCE
R1
VBE
C12
C11
C10
L2
C9
L1
RF OUT
C1
RF IN
C2
C3
C4
C5
C6
C7
C8
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
NESG250134
COMPONENT LIST
VALUE
MAKER
C1
47 pF
Murata
C2
12 pF
Murata
C3, C4
7 pF
Murata
C5
3 pF
Murata
C6
6 pF
Murata
C7
0.5 pF
Murata
C8
5 pF
Murata
C9
51 pF
Murata
C10, C12
100 nF
Murata
1 μF
Murata
L1
100 nH
Toko
L2
15 nH
Toko
R1
30 Ω
SSM
C11
3rd Order Intermodulation Distortion IM3 (dBc)
DISTORTION EVALUATION CIRCUIT TYPICAL CHARACTERISTICS
3RD ORDER
INTERMODULATION DISTORTION
vs. 1 TONE OUTPUT POWER
80
VCE = 3.6 V, f = 460 MHz,
IC (set) = 30 mA, offset = 1 MHz
70
60
50
40
30
20
10
0
-5
0
5
10
15
20
25
1 tone Output Power Pout (dBm)
Remark The graphs indicate nominal characteristics.
NESG250134
3-PIN POWER MINIMOLD (34 PACKAGE) (UNIT:mm)
4.5±0.1
1.5±0.1
0.8 MIN.
0.42±0.06
3
4.0±0.25
2
1
2.5±0.1
1.6±0.2
0.42±0.06
0.41+0.03
-0.06
0.47±0.06
1.5
3.0
PIN CONNECTIONS
1. Collector
2. Emitter
3. Base
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
03/07/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
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suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.