PRELIMINARY DATA SHEET NEC's 4-PIN ULTRA SMALL FLAT-LEAD PS7801C-1A SUPER LOW OUTPUT CAPACITANCE 1-ch OPTICAL COUPLED MOS FET FEATURES • ULTRA SMALL FLAT-LEAD PACKAGE: 4.2 (L) × 2.5 (W) × 1.85 (H) mm • SUPER LOW OUTPUT CAPACITANCE: Cout = 0.5 pF TYP. • LOW C × R: C × R = 6.5 pF • Ω • 1 CHANNEL TYPE: 1 a output • DESIGN FOR AC/DC SWITCHING LINE CHANGER • LOW OFFSET VOLTAGE • ORDERING NUMBER OF TAPING PRODUCT: PS7801C-1A-F3, F4: 3 500 pcs/reel DESCRIPTION NEC's PS7801C-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the PS72xx series. It is suitable for high-frequency signal control, due to its low C × R, super low output capacitance, and low off-state leakage current. APPLICATION • Measurement Equipment California Eastern Laboratories PS7801C-1A PACKAGE DIMENSIONS (UNIT: mm) 2.5±0.3 0.2 MAX. TOP VIEW 3 3.6 +0.3 -0.4 1 1 2 3.0 MAX. 0.2±0.1 1.27 MARKING EXAMPLE N 503 No.1 pin mark (knicked corner) 0.36 0.15 +0.1 -0.05 1.85±0.05 4.6±0.2 0.4±0.1 1C 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 0.2±0.1 N 4 4.2±0.2 4 Last number of type No. : 1C*1 *2 An initial of "NEC" Assembly lot 5 03 (Marking details) Week assembled Year assembled *1 The marking corresponds to the last two digits of the part number below. PS7801C-1A *2 Bar : Pb-Free 2 PS7801C-1A ORDERING INFORMATION PART NUMBER ORDER NUMBER PS7801C-1A-F3 PS7801C-1A-F3-A PS7801C-1A-F4 PS7801C-1A-F4-A SOLDER PLATING SPECIFICATION Pb-Free PACKING STYLE Embossed Tape 3 500 pcs/reel ABSOLUTE MAXIMUM RATINGS (TA = 25ºC, unless otherwise Specified) PARAMETER Diode MOS FET SYMBOL RATINGS UNIT Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V Power Dissipation PD 50 mW Peak Forward Current *1 IFP 1 A Break Down Voltage VL 30 V Continuous Load Current IL 80 mA Pulse Load Current *2 (AC/DC Connection) ILP 160 mA Power Dissipation PD 250 mW Isolation Voltage BV 500 Vr.m.s. Total Power Dissipation PT 300 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C *3 *1 PW = 100 μs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. RECOMMENDED OPERATING CONDITIONS (TA = 25ºC) PARAMETER SYMBOL MIN. TYP. LED Operating Current IF 2 5 LED Off Voltage VF 0 MAX. UNIT 20 mA 0.5 V PS7801C-1A ELECTRICAL CHARACTERISTICS PARAMETER Diode MOS FET Coupled (TA = 25 85ºC) SYMBOL CONDITIONS MIN. TYP. MAX. UNIT 1.1 1.4 V 5.0 μA Forward Voltage VF IF = 5 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff VD = 30 V 0.1 1.0 nA Output Capacitance Cout VD = 0 V, f = 1 MHz 0.5 0.7 pF LED On-state Current IFon IL = 80 mA 2.0 mA On-state Resistance Ron IF = 5 mA, IL = 80 mA 13 17 Ω Turn-on Time*1, 2 ton IF = 5 mA, VO = 5 V, RL = 500 Ω, 0.03 0.5 ms Turn-off Time*1, 2 toff PW ≥ 10 ms 0.1 0.5 Isolation Resistance RI-O VI-O = 0.5 kVDC 10 Isolation Capacitance CI-O V = 0 V, f = 1 MHz 9 Ω 0.3 pF *1 Test Circuit for Switching Time Pulse Input IF VL 50% Input 0 Input monitor VO monitor Rin RL VO = 5 V 90% Output 10% ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. PS7801C-1A NOTES ON HANDLING Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (ºC) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260ºC MAX. 220ºC to 60 s 180ºC 120ºC 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 04/11/2005 A Business Partner of NEC Compound Semiconductor Devices, Ltd.