TI TPD6F202YFUR

TPD4F202, TPD6F202
www.ti.com
SLLS800 – JUNE 2010
FOUR-, SIX-CHANNEL EMI FILTER WITH ESD PROTECTION FOR LCD DISPLAY
Check for Samples: TPD4F202, TPD6F202
FEATURES
1
•
•
•
•
Four-, Six-Channel EMI Filtering and ESD
Protection for Data Lines
Excellent filter Performance
– >40dB Attenuation at 1GHz-3GHz
– -3dB Bandwidth at 108MHz
– 70 dB Crosstalk Attenuation at 100 MHz
Exceeds IEC61000-4-2 (Level 4) ESD
Protection Requirements
– ±25-kV IEC 61000-4-2 Contact Discharge
– ±25-kV IEC 61000-4-2 Air-Gap Discharge
– ±15-kV Human-Body Model (HBM)
Pi-Style C-R-C Filter Configuration Offers
Symmetric Filter Performance
•
•
(R = 100 Ω, CTOTAL = 30 pF)
Low 10-nA Leakage Current
Space-Saving WCSP Package and
Flow-Through Pin Mapping Provides Optimum
Performance in Portable Applications
APPLICATIONS
•
•
•
•
•
LCD Display Interface
Memory Interface
SVGA Video Connections
Keypad
Data Lines in Portables
TPD4F202
YFU PACKAGE
TPD6F202
YFU PACKAGE
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE (1)
(2)
WCSP – YFU
PACKAGE DIMENSION
ORDERABLE
PART NUMBER
TOP-SIDE MARKING
Length = 2.36 mm, Width = 1.053 mm,
TPD6F202YFUR
Pitch = 0.4 mm, Height = 0.32 mm)
YMS5WS
Length = 1.56 mm, Width = 1.053 mm,
TPD4F202YFUR
Pitch = 0.4 mm, Height = 0.32 mm)
YMS57S
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TPD4F202, TPD6F202
SLLS800 – JUNE 2010
www.ti.com
DESCRIPTION
The TPDxF202 are four, six-channel EMI filters, designed particularly to suppress EMI noise in the cell phone
and other portable applications. These low-pass filters also protect internal core citcuity against system level
ESD strikes at the external interface pins. The pi-style C-R-C filter provides symmetric filter performance in the
data lines to/ from either side of the filter.
Due to tiny package parasitics of the WCSP package, the TPDxF202 series of filters provide excellent signal
attenuation (-40dB at 1GHz) at the typical cell-phone carrier frequency ranges.
The ultra thin (0.3-mm package height, when mounted on board) space saving YFU package enables the
TPDxF202 devices to mount on the printed circuit boards where the height is a key constraint.
The TPDxF202 devices offer very robust system level ESD protection specifications at both input and output
ports, which eliminates the need for any additional ESD clamp diodes at the external interface pins.
The TPDxF202 devices are specified for –40°C to 85°C operation.
EQUIVALENT SCHEMATIC REPRESENTATION
2
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 – JUNE 2010
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VIO
MAX
IO to GND
6
Continuous power dissipation (TA = 70°C)
V
100
mW
150
°C
Tstg
Storage temperature range
TJ
Junction temperature
150
°C
Lead temperature (soldering, 10 s)
300
°C
(1)
–65
UNIT
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C (Unless otherwise noted)
PARAMETER
TEST CONDITIONS
VBR
DC breakdown voltage
R
Resistance
C
Capacitance (C1 or C2)
VIO = 3.3 V
IIO
Channel leakage current
VIO = 3.3 V
fC
Cut-off frequency
ZSOURCE = 50 Ω, ZLOAD = 50 Ω
(1)
IIO = 10 mA
MIN
TYP (1)
MAX
UNIT
100
115
Ω
6
85
V
15
pF
10
nA
108
MHz
Typical values are at TA = 25°C.
ESD PROTECTION
TYP
UNIT
HBM
PARAMETER
±15
kV
IEC 61000-4-2 Contact Discharge
±25
kV
IEC 61000-4-2 Air-Gap Discharge
±25
kV
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
3
TPD4F202, TPD6F202
SLLS800 – JUNE 2010
www.ti.com
APPLICATION INFORMATION
Typically, there are multiple EMI filters being utilized in cell phone applications to suppress the EMI interference.
This means the total board area consumed by EMI filters are relatively large. One example of space saving
innovation is to place the EMI filters right under the connectors so that the main PCB space is not utilized. The
YFU packages of the TPDxF202 series offer ultra low-profile package height which enables such innovative
component placement in portable applications. Package under-fill is recommended while using the YFU
packages in flex boards.
For maximum efficiency of filtering and ESD protection, while doing the board layout, care should be taken to
reduce board parasitic from package GND pins to board GND plane. The TPDxF202 devices should be
connected to a ground plane with a micro via adjacent to the device GND pad. If this is not possible, the
connection to the ground plane should be as direct as possible to minimize the inductance. Due to flow-through
pin mapping, the signal pins routing is easily achieved in a single layer.
Figure 1. Board Layout with TPDxF20
4
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 – JUNE 2010
TYPICAL CHARACTERISTICS
Figure 2. Channel-to-Channel Crosstalk
Figure 3. Frequency Response Data (0 V Bias)
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
5
TPD4F202, TPD6F202
SLLS800 – JUNE 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 4. IEC Clamping Waveforms +8 kV Contact
Figure 5. IEC Clamping Waveforms -8 kV Contact
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
TPD4F202, TPD6F202
www.ti.com
SLLS800 – JUNE 2010
TYPICAL CHARACTERISTICS (continued)
Figure 6. DC Characteristics (IIN vs. VIN), TA = 25ºC
Figure 7. C1 or C2 Capacitance vs. VBIAS
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F202, TPD6F202
7
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPD4F202YFUR
ACTIVE
DSBGA
YFU
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
TPD6F202YFUR
ACTIVE
DSBGA
YFU
15
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPD4F202YFUR
DSBGA
YFU
10
3000
178.0
9.2
TPD6F202YFUR
DSBGA
YFU
15
3000
178.0
9.2
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.21
1.72
0.45
4.0
8.0
Q1
1.19
2.5
0.45
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD4F202YFUR
DSBGA
YFU
10
3000
220.0
220.0
35.0
TPD6F202YFUR
DSBGA
YFU
15
3000
220.0
220.0
35.0
Pack Materials-Page 2
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