XCB170 Single Pole OptoMOS® Relays Load Voltage Load Current Max RON XCB170 350 100 50 Units V mA Ω Features • Small 6 Pin DIP Package • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • 3750VRMS Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hookswitch • Dial Pulsing • Ground Start • Ringer Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Description The XCB170 is a 1-Form-B relay which uses optically coupled MOSFET technology to provide 3750V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS® architecture. A highly efficient GaAIAs infrared LED controls the optically coupled input. The device is available in small 6-pin dual in line package in standard through hole and surface mount lead bend. Approvals • UL Recognized: File Number E76270 • CSA Certified: File Number LR 43639-10 • BSI Certified to: • BS EN 60950:1992 (BS7002:1992) Certificate #: 7344 • BS EN 41003:1993 Certificate #: 7344 Ordering Information Part # XCB170 XCB170S XCB170STR Description 6 Pin DIP (50/Tube) 6 Pin Surface Mount (50/Tube) 6 Pin Surface Mount (1000/Reel) Pin Configuration XCB170 Pinout XCB170 Pinout AC/DC Configuration DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Control Load – Control Do Not Use Load Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed (Form B) Devices 10ms CONTROL +90% + 90% +10% TOFF DS-XBA170-R2.0 www.clare.com TON 1 XCB170 Absolute Maximum Ratings (@ 25˚ C) Parameter Input Power Dissipation Input Control Current Peak (10ms) Reverse Input Voltage Total Power Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Soldering Temperature DIP Package Surface Mount Package (10 Seconds Max.) 1 Derate Linearly 1.33 mw/˚C 2 Derate Linearly 6.67 mw/˚C Min - Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability. Typ Max Units - 1501 mW 50 mA 1 A 5 V - 8002 mW 3750 -40 -40 - VRMS +85 °C +125 °C - - +260 +220 °C °C Electrical Characteristics Parameter Output Characteristics @ 25°C Load Voltage (Peak) Load Current (Continuous) AC/DC Configuration DC Configuration Peak Load Current On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance Input to Output Input Characteristics @ 25°C Input Control Current Input Dropout Current Input Voltage Drop Reverse Input Voltage Reverse Input Current Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units - VL - - 350 V 10ms IL IL ILPK - - 100 180 350 mA mA mA IL=120mA IL=200mA VL=35OV RON RON ILEAK - 31 10 - 50 15 1 Ω Ω µA IF=5mA, VL=10V IF=5mA, VL=10V 50V; f=1MHz TON TOFF COUT - 25 5 5 - ms ms pF - - - 3 - pF IL=120mA IF=5mA VR=5V - IF IF VF VR IR CI/O 5 0.4 0.9 - 0.7 1.2 3 50 1.4 5 10 - mA mA V V µA pF www.clare.com Rev. 2.0 XCB170 PERFORMANCE DATA* Device Count (N) 25 20 15 10 5 25 25 20 20 15 10 5 1.17 1.19 1.21 1.23 1.25 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (V) XCB170 Typical Turn-Off Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XCB170 Typical IF for Switch Dropout (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 25 25 20 20 20 15 10 5 0 Device Count (N) 25 Device Count (N) Device Count (N) 5 On-Resistance (Ω) XCB170 Typical IF for Switch Operation (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 15 10 5 0.50 0.56 0.62 0.69 0.75 0.81 0.44 0.50 LED Current (mA) Load Current (mA) 20 15 10 5 0.56 0.62 0.69 0.75 0.67 0.81 0.22 160 0.016 140 0.014 120 0.012 100 80 10mA 5mA 60 40 0.25 XCB170 Typical Blocking Voltage vs. Temperature -20 0 20 40 60 80 100 435 430 5mA 1.20 1.00 10mA 0.80 0.60 0 -20 0 20 40 60 Temperature (°C) 80 100 -40 -20 0 20 40 60 80 XCB170 Typical Turn-On vs. Temperature (Load Current = 100mADC) 0.20 420 0.006 XCB170 Typical Turn-Off vs. Temperature (Load Current = 100mADC) 0.40 425 0.008 Temperature (°C) -20 0 20 40 60 Temperature (°C) 80 100 120 Turn-Off (ms) Turn-On (ms) 440 0.010 -40 1.40 445 1.14 Temperature (°C) 1.60 450 1.06 0 120 1.80 455 0.99 0.002 -40 0.28 0.91 0.004 Turn-Off (ms) -40 0.83 XCB170 Typical Leakage vs. Temperature (Measured across Pins 4 & 6) 0 0 0.19 0.75 Turn-On (ms) 20 0.17 5 XCB170 Typical Load Current vs. Temperature 25 0.14 10 LED Current (mA) XCB170 Typical Turn-On Time (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) 0.11 15 0 0 0.44 Device Count (N) 10 29.09 29.86 30.63 31.40 32.16 32.93 33.70 LED Forward Voltage Drop (V) Blocking Voltage (VRMS) 15 0 0 0 Leakage (µA) Device Count (N) 30 XCB170 Typical Blocking Voltage Distribution (N=50 Ambient Temperature = 25°C) Device Count (N) 35 XCB170 Typical On-Resistance Distribution (N=50 Ambient Temperature = 25°C) (Load Current = 100mADC) XCB170 Typical LED Forward Voltage Drop (N=50 Ambient Temperature = 25°C) IF = 5mADC 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 100 IF= 5mA -40 -20 0 20 40 60 80 100 120 Temperature (°C) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Rev. 2.0 www.clare.com 3 XCB170 PERFORMANCE DATA* XCB170 Typical Turn-Off vs. LED Forward Current (Load Current = 100mADC) 1.6 1.4 50mA 1.2 10mA 5mA 1.0 0.8 -40 -20 0 20 40 60 80 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 120 XCB170 Typical Turn-On vs. LED Forward Current (Load Current = 100mADC) Turn-Off (ms) 1.8 Turn-On (ms) LED Forward Voltage Drop (V) XCB170 Typical LED Forward Voltage Drop vs. Temperature 5 10 Temperature (°C) 15 20 25 30 35 40 45 50 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 LED Forward Current (mA) 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) 6.0 5.0 5.0 50 40 30 20 LED Current (mA) 6.0 60 LED Current (mA) On-Resistance (Ω) 70 4.0 3.0 2.0 10 -20 0 20 40 60 80 100 120 -40 Temperature (°C) -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 2.0 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) XCB170 Energy Rating Curve Load Current (A) 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 -20 Temperature (°C) XCB170 Typical Load Current vs. Load Voltage (Ambient Temperature = 25°C) IF = 5mADC 3.0 0 0 -40 4.0 1.0 1.0 0 Load Current (mA) XCB170 Typical IF for Switch Dropout vs. Temperature (Load Current = 50mA) XCB170 Typical IF for Switch Operation vs. Temperature (Load Current = 50mA) XCB170 Typical On-Resistance vs. Temperature (Load Current = 100mADC; IF = 5mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10µs 100µs 1ms 10ms 100ms 1s 10s 100s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.clare.com Rev. 2.0 XCB170 MECHANICAL DIMENSIONS PC Board Pattern (Top View) 6Pin DIP Through Hole (Standard) 6-.800 DIA. (6-.031 DIA.) 2.540 ± .127 (.100 ± .005) 7.620 ± .127 (.300 ± .005) 6.350 ± .127 (.250 ± .005) 5.080 ± .127 (.200 ± .005) 6Pin DIP Surface Mount (“S” Suffix) PC Board Pattern (Top View) 2.540 ± .127 (.100 ± .005) 8.305 ± .127 (.327 ± .005) 1.905 ± .127 (.075 ± .005) 1.499 ± .127 (.059 ± .005) Dimensions mm (inches) Rev. 2.0 www.clare.com 5 For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-XCB170-R2.0 ©Copyright 2001, Clare, Inc. OptoMOS® is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. 9/26/01