SN54BCT760, SN74BCT760 OCTAL BUFFERS/DRIVERS WITH OPEN-COLLECTOR OUTPUTS SCBS034B – JULY 1989 – REVISED NOVEMBER 1993 • • Open-Collector Version of ′BCT244 Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015 Packages Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (J, N) SN54BCT760 . . . J OR W PACKAGE SN74BCT760 . . . DW OR N PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54BCT760 . . . FK PACKAGE (TOP VIEW) The ′BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 The SN54BCT760 is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74BCT760 is characterized for operation from 0°C to 70°C. 2OE • • FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X H Copyright 1993, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–1 SN54BCT760, SN74BCT760 OCTAL BUFFERS/DRIVERS WITH OPEN-COLLECTOR OUTPUTS SCBS034B – JULY 1989 – REVISED NOVEMBER 1993 logic symbol† 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE 2 18 4 16 6 14 8 12 1Y1 1A1 2OE 1Y3 1A2 2A2 2A3 2A4 18 4 16 6 14 8 12 1Y1 1Y2 1Y4 1Y3 EN 1A4 2A1 2 1Y2 1A3 19 1 EN 11 9 13 7 15 5 17 3 1Y4 2Y1 2Y2 2Y3 2OE 19 2Y4 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input current range, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . – 0.5 V to 5.5 V Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Current into any output in the low state: SN54BCT760 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74BCT760 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54BCT760 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C SN74BCT760 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The negative input voltage rating may be exceeded if the input clamp current rating is observed. 2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54BCT760, SN74BCT760 OCTAL BUFFERS/DRIVERS WITH OPEN-COLLECTOR OUTPUTS SCBS034B – JULY 1989 – REVISED NOVEMBER 1993 recommended operating conditions SN54BCT760 SN74BCT760 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL VOH Low-level input voltage 0.8 0.8 High-level output voltage 5.5 5.5 V IIK IOL Input clamp current –18 –18 mA 64 mA TA Operating free-air temperature 70 °C High-level input voltage 2 2 Low-level output current V 48 – 55 125 V 0 V electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, VOL VCC = 4 4.5 5V II IIH VCC = 5.5 V, VCC = 5.5 V, IIL IOH VCC = 5.5 V, VCC = 4.5 V, ICC Ci SN54BCT760 TYP† MAX TEST CONDITIONS VCC = 5.5 V, VCC = 5 V, VCC = 5 V, MIN II = –18 mA IOL = 48 mA –1.2 0.38 IOL = 64 mA VI = 7 V VI = 2.7 V VI = 0.5 V VOH = 5.5 V SN74BCT760 TYP† MAX MIN –1.2 0.55 0.42 Outputs open 0.55 V 0.1 mA 20 20 µA –1 –1 mA 0.1 0.1 mA 21 33 21 33 Outputs low 48 76 48 76 OE disabled 6 10 6 10 Co † All typical values are at VCC = 5 V, TA = 25°C. V 0.1 Outputs high VI = 2.5 V or 0.5 V VI = 2.5 V or 0.5 V UNIT mA 6 6 pF 10 10 pF switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX‡ ′BCT760 MIN tPLH tPHL Any A Y tPLH tPHL OE Y SN54BCT760 UNIT SN74BCT760 TYP MAX MIN MAX MIN MAX 6.3 8 9.5 6.3 11.1 6.3 10 2.1 4.3 6.5 2.1 7.7 2.1 7.2 8.6 13 15.2 8.6 18.7 8.6 17.5 3.2 6.2 8.9 3.2 10.4 3.2 9.9 ns ns ‡ For conditions shown as MIN or MAX, use the appropriate values specified under recommended operating conditions. NOTE 2: Load circuits and voltage waveforms are shown in Section 1. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–3 SN54BCT760, SN74BCT760 OCTAL BUFFERS/DRIVERS WITH OPEN-COLLECTOR OUTPUTS SCBS034B – JULY 1989 – REVISED NOVEMBER 1993 2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9093801M2A ACTIVE LCCC FK 20 1 TBD 5962-9093801MRA ACTIVE CDIP J 20 1 TBD 5962-9093801MSA ACTIVE CFP W 20 1 SN54BCT760J ACTIVE CDIP J 20 1 SN74BCT760DW ACTIVE SOIC DW 20 SN74BCT760DWE4 ACTIVE SOIC DW SN74BCT760DWG4 ACTIVE SOIC SN74BCT760DWR ACTIVE SN74BCT760DWRE4 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD A42 SNPB N / A for Pkg Type 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT760DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT760N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74BCT760NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74BCT760NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT760NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74BCT760NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54BCT760FK ACTIVE LCCC FK 20 1 TBD SNJ54BCT760J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54BCT760W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 TAPE AND REEL BOX INFORMATION Device SN74BCT760DWR Package Pins DW 20 Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) SITE 41 330 24 10.8 13.0 2.7 12 Pack Materials-Page 1 W Pin1 (mm) Quadrant 24 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74BCT760DWR DW 20 SITE 41 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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