TI SMJ320C31GFAS60

 SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
D Processed to MIL-PRF-38535 (QML)
D Operating Temperature Ranges:
D
D
D
D
D
D
D
D
D
D
− Military (M) −55°C to 125°C
− Special (S) −55°C to 105°C
SMD Approval
High-Performance Floating-Point Digital
Signal Processor (DSP):
− SMJ320C31-60 (5 V)
33-ns Instruction Cycle Time
330 Million Operations Per Second
(MOPS), 60 Million Floating-Point
Operations Per Second (MFLOPS),
30 Million Instructions Per Second
(MIPS)
− SMJ320C31-50 (5 V)
40-ns Instruction Cycle Time
275 MOPS, 50 MFLOPS, 25 MIPS
− SMJ320C31-40 (5 V)
50-ns Instruction Cycle Time
220 MOPS, 40 MFLOPS, 20 MIPS
− SMJ320LC31-40 (3.3 V)
50-ns Instruction Cycle Time
220 MOPS, 40 MFLOPS, 20 MIPS
− SMQ320LC31-40 (3.3 V)
50-ns Instruction Cycle Time
220 MOPS, 40 MFLOPS, 20 MIPS
32-Bit High-Performance CPU
16- / 32-Bit Integer and 32- / 40-Bit
Floating-Point Operations
32-Bit Instruction and Data Words, 24-Bit
Addresses
Two 1K Word × 32-Bit Single-Cycle
Dual-Access On-Chip RAM Blocks
Boot-Program Loader
64-Word × 32-Bit Instruction Cache
Eight Extended-Precision Registers
Two Address Generators With Eight
Auxiliary Registers and Two Auxiliary
Register Arithmetic Units (ARAUs)
D Two Low-Power Modes
D On-Chip Memory-Mapped Peripherals:
D
D
D
D
D
D
D
D
D
D
D
D
D
D
− One Serial Port Supporting
8- / 16- / 24- / 32-Bit Transfers
− Two 32-Bit Timers
− One-Channel Direct Memory Access
(DMA) Coprocessor for Concurrent I/O
and CPU Operation
Fabricated Using Enhanced Performance
Implanted CMOS (EPIC) Technology by
Texas Instruments (TI )
Two- and Three-Operand Instructions
40 / 32-Bit Floating-Point / Integer Multiplier
and Arithmetic Logic Unit (ALU)
Parallel ALU and Multiplier Execution in a
Single Cycle
Block-Repeat Capability
Zero-Overhead Loops With Single-Cycle
Branches
Conditional Calls and Returns
Interlocked Instructions for
Multiprocessing Support
Bus-Control Registers Configure
Strobe-Control Wait-State Generation
Validated Ada Compiler
Integer, Floating-Point, and Logical
Operations
32-Bit Barrel Shifter
One 32-Bit Data Bus (24-Bit Address)
Packaging
− 132-Lead Ceramic Quad Flatpack With
Nonconductive Tie-Bar (HFG Suffix)
− 141-Pin Ceramic Staggered Pin
Grid- Array Package (GFA Suffix)
− 132-Lead TAB Frame
− 132-Lead Plastic Quad Flatpack
(PQ Suffix)
description
The SMJ320C31, SMJ320LC31, and SMQ320LC31 digital signal processors (DSPs) are 32-bit, floating-point
processors manufactured in 0.6-µm triple-level-metal CMOS technology. The devices are part of the
SMJ320C3x generation of DSPs from Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright  2006, Texas Instruments Incorporated
!"# $"%&! '#(
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'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
POST OFFICE BOX 1443
$'"! !$& ./.011 && $## # ##'
"&# )#+# #'( && )# $'"! $'"!
$!#- '# #!#&, !&"'# #- && $##(
• HOUSTON, TEXAS 77251−1443
1
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
description (continued)
The SMJ320C3x internal busing and special digital-signal-processing instruction set have the speed and
flexibility to execute up to 60 MFLOPS. The SMJ320C3x optimizes speed by implementing functions in
hardware that other processors implement through software or microcode. This hardware-intensive approach
provides performance previously unavailable on a single chip.
The SMJ320C3x can perform parallel multiply and ALU operations on integer or floating-point data in a single
cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated ARAUs,
internal dual-access memories, one DMA channel supporting concurrent I/O, and a short machine-cycle time.
High performance and ease of use are results of these features.
General-purpose applications are greatly enhanced by the large address space, multiprocessor interface,
internally and externally generated wait states, one external interface port, two timers, one serial port, and
multiple-interrupt structure. The SMJ320C3x supports a wide variety of system applications from host processor
to dedicated coprocessor.
High-level-language support is easily implemented through a register-based architecture, large address space,
powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
For additional information when designing for cold temperature operation, please see Texas Instruments
application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature
number SGUA001.
2
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
141-PIN GFA STAGGERED GRID ARRAY
PACKAGE
( BOTTOM VIEW )
TA PACKAGE
( TOP VIEW )
1
3
5
7
9
11
13
15
17
19
2
4
6
8
132
1
10
100
99
Tab Leads Up
12
14
16
18
Die Face Up
D
B
A
C
67
33
F H K M P T V
E G J L N R U W
34
TB PACKAGE
( TOP VIEW )
132-PIN HFG QUAD FLATPACK
( TOP VIEW )
100
132
99
33
ÉÉ
ÉÉ
67
66
ÉÉ
ÉÉ
ÉÉ
ÉÉ
1
34
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
66
ÉÉ
ÉÉ
Tab Leads Up
Die Face Up
ÉÉ
ÉÉ
POST OFFICE BOX 1443
100
99
132
1
67
33
34
• HOUSTON, TEXAS 77251−1443
66
3
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
SMQ320LC31 pinout (top view)
The SMQ320LC31 device is also packaged in a132-pin plastic quad flatpack (PQ Suffix). The full part numbers
are SMQ320LC31PQM40 and 5962-9760601NXB.
SHZ
VSS
TCLK0
VSS
MCBL/MP
EMU2
EMU1
EMU0
EMU3
TCLK1
VDD
A22
A23
VSS
A20
A21
VDD
VDD
A19
VSS
VSS
A11
A12
A13
A14
A15
A16
A17
A18
VDD
VSS
A10
VDD
PQ PACKAGE
(TOP VIEW)
A9
VSS
A8
A7
A6
A5
VDD
A4
A3
A2
A1
A0
VSS
D31
VDD
VDD
D30
VSS
VSS
VSS
D29
D28
VDD
D27
VSS
D26
D25
D24
D23
D22
D21
VDD
D20
4
POST OFFICE BOX 1443
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V DD
D5
D4
D3
D2
D1
D0
H1
H3
V DD
D7
D6
D9
D8
VSS
VSS
VSS
D12
D11
D10
V DD
V DD
D14
V DD
D13
V SS
D19
D18
D17
D16
D15
V SS
V SS
DX0
VDD
FSX0
VSS
CLKX0
CLKR0
FSR0
VSS
DR0
INT3
INT2
VDD
VDD
INT1
VSS
VSS
INT0
IACK
XF1
VDD
XF0
RESET
R/W
STRB
RDY
VDD
HOLD
HOLDA
X1
X2/CLKIN
VSS
VSS
VSS
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
Terminal Assignments
PIN
PIN
NUMBER
NUMBER
PQ
PKG
HFG
PKG
GFA
PKG
NAME
PQ
PKG
HFG
PKG
GFA
PKG
NAME
29
12
L1
A0
64
47
W9
D10
28
11
K2
A1
63
46
U9
D11
27
10
J1
A2
62
45
V8
D12
26
9
J3
A3
60
43
W7
D13
25
8
G1
A4
58
41
U7
D14
23
6
F2
A5
56
39
V6
D15
22
5
E1
A6
55
38
W5
D16
21
4
E3
A7
54
37
U5
D17
20
3
D2
A8
53
36
V4
D18
18
1
C1
A9
52
35
W3
D19
16
131
C3
A10
50
33
U3
D20
14
129
B2
A11
48
31
V2
D21
13
128
A1
A12
47
30
W1
D22
12
127
C5
A13
46
29
R3
D23
11
126
B4
A14
45
28
T2
D24
10
125
A3
A15
44
27
U1
D25
9
124
C7
A16
43
26
N3
D26
8
123
B6
A17
41
24
P2
D27
7
122
C9
A18
39
22
R1
D28
5
120
B8
A19
38
21
L3
D29
2
117
A7
A20
34
17
M2
D30
1
116
A9
A21
31
14
N1
D31
130
113
B10
A22
108
91
C19
DR0
129
112
A11
A23
116
99
C17
DX0
111
94
E17
CLKR0
124
107
B14
EMU0
112
95
A19
CLKX0
125
108
A13
EMU1
80
63
W19
D0
126
109
B12
EMU2
79
62
V16
D1
123
106
A15
EMU3
78
61
W17
D2
110
93
D18
FSR0
77
60
U13
D3
114
97
B18
FSX0
76
59
V14
D4
81
73
P18
HOLD
75
58
W15
D5
82
72
R19
HOLDA
73
56
U11
D6
90
64
V18
H1
72
55
V12
D7
89
65
U17
H3
68
51
W11
D8
99
82
H18
IACK
100
83
J17
INT0
67
50
V10
D9
† CVSS, VSSL, and IVSS are on the same plane.
‡ AVDD, DVDD, CVDD, and PVDD are on the same plane.
§ VSUBS connects to die metallization. Tie this pin to clean ground.
POST OFFICE BOX 1443
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
Terminal Assignments (Continued)
PIN
PIN
NUMBER
NUMBER
PQ
PKG
HFG
PKG
GFA
PKG
NAME
PQ
PKG
HFG
PKG
GFA
PKG
NAME
103
86
E19
INT1
30
18
P4
106
89
F18
INT2
35
19
T10
VSSL†
VSSL†
107
90
G17
INT3
36
20
K4
127
110
C11
MCBL/MP
37
25
T4
92
77
L19
R/W
42
34
G3
95
75
N17
RDY
51
40
K16
94
78
K18
RESET
57
44
T8
118
101
A17
SHZ
61
52
T12
93
76
M18
STRB
69
53
R11
120
103
B16
TCLK0
70
54
J15
105
C15
TCLK1
71
67
W13
121
G5
84
68
D10
6
130
E7
85
69
D16
15
7
E5
AVDD‡
AVDD‡
AVDD‡
86
84
T16
24
15
N5
85
D12
16
R5
102
92
F16
33
23
H4
VDDL
VDDL
DVDD‡
101
32
109
96
H16
40
32
J5
113
100
D14
49
42
T14
DVDD‡
DVDD‡
117
102
U15
59
48
R7
C13
65
49
R9
66
57
R13
74
66
R15
83
74
VDDL
VDDL
DVDD‡
IVSS†
DVSS
VSSL†
VSSL†
DVSS
CVSS†
IVSS†
DVSS
VSSL†
CVSS†
IVSS†
VSUBS§
DVSS
CVSS†
119
111
128
71
T18
X1
88
70
U19
X2/CLKIN
87
79
J19
XF0
P16
DVDD‡
CVDD‡
96
81
G19
XF1
98
91
80
N15
CVDD‡
97
87
G15
104
88
E15
105
98
L15
VDDL
VDDL
PVDD‡
115
104
E9
121
114
E13
131
115
E11
132
118
L5
3
119
H2
4
132
M4
17
2
F4
PVDD‡
VDDL
VDDL
VSSL†
DVSS
CVSS†
DVSS
CVSS†
19
13
T6
† CVSS, VSSL, and IVSS are on the same plane.
‡ AVDD, DVDD, CVDD, and PVDD are on the same plane.
§ VSUBS connects to die metallization. Tie this pin to clean ground.
6
DVSS
IVSS†
DVSS
CVSS†
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
F6
No Connect
D4
DVSS
N19
DVSS
R17
DVSS
L17
DVSS
M16
DVSS
D6
DVSS
A5
DVSS
D8
DVSS
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
Terminal Functions
TERMINAL
NAME
TYPE†
DESCRIPTION
QTY
CONDITIONS
WHEN
SIGNAL IS Z TYPE‡
PRIMARY-BUS INTERFACE
D31 −D0
32
I/O/Z
32-bit data port
S
H
R
A23 −A0
24
O/Z
24-bit address port
S
H
R
R/W
1
O/Z
Read / write. R/ W is high when a read is performed and low when a write is performed
over the parallel interface.
S
H
R
STRB
1
O/Z
External-access strobe
S
H
RDY
HOLD
HOLDA
1
1
1
I
Ready. RDY indicates that the external device is prepared for a transaction
completion.
I
Hold. When HOLD is a logic low, any ongoing transaction is completed. A23 −A0,
D31 −D0, STRB, and R / W are placed in the high-impedance state and all transactions over the primary-bus interface are held until HOLD becomes a logic high or until
the NOHOLD bit of the primary-bus-control register is set.
O/Z
Hold acknowledge. HOLDA is generated in response to a logic low on HOLD. HOLDA
indicates that A23 −A0, D31 −D0, STRB, and R / W are in the high-impedance state
and that all transactions over the bus are held. HOLDA is high in response to a logic
high of HOLD or the NOHOLD bit of the primary-bus-control register is set.
S
CONTROL SIGNALS
RESET
1
I
Reset. When RESET is a logic low, the device is in the reset condition. When RESET
becomes a logic high, execution begins from the location specified by the reset vector.
INT3 −INT0
4
I
External interrupts
IACK
1
O/Z
MCBL / MP
1
I
Microcomputer boot-loader / microprocessor mode-select
Interrupt acknowledge. IACK is generated by the IACK instruction. IACK can be used
to indicate the beginning or the end of an interrupt-service routine.
SHZ
1
I
Shutdown high impedance. When active, SHZ shuts down the device and places all
pins in the high-impedance state. SHZ is used for board-level testing to ensure that
no dual-drive conditions occur. CAUTION: A low on SHZ corrupts the device memory
and register contents. Reset the device with SHZ high to restore it to a known
operating condition.
XF1, XF0
2
I/O/Z
External flags. XF1 and XF0 are used as general-purpose I / Os or to support
interlocked processor instruction.
S
S
R
SERIAL PORT 0 SIGNALS
CLKR0
1
I/O/Z
Serial port 0 receive clock. CLKR0 is the serial shift clock for the serial port 0 receiver.
S
R
S
R
CLKX0
1
I/O/Z
Serial port 0 transmit clock. CLKX0 is the serial shift clock for the serial port 0
transmitter.
DR0
1
I/O/Z
Data-receive. Serial port 0 receives serial data on DR0.
S
R
DX0
1
I/O/Z
Data-transmit output. Serial port 0 transmits serial data on DX0.
S
R
S
R
S
R
FSR0
1
I/O/Z
Frame-synchronization pulse for receive. The FSR0 pulse initiates the data-receive
process using DR0.
FSX0
1
I/O/Z
Frame-synchronization pulse for transmit. The FSX0 pulse initiates the data-transmit
process using DX0.
S
S
TIMER SIGNALS
TCLK0
1
I/O/Z
Timer clock 0. As an input, TCLK0 is used by timer 0 to count external pulses. As an
output, TCLK0 outputs pulses generated by timer 0.
TCLK1
1
I/O/Z
Timer clock 1. As an input, TCLK0 is used by timer 1 to count external pulses. As an
output, TCLK1 outputs pulses generated by timer 1.
† I = input, O = output, Z = high-impedance state
‡ S = SHZ active, H = HOLD active, R = RESET active
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
Terminal Functions (Continued)
TERMINAL
NAME
TYPE†
DESCRIPTION
QTY
CONDITIONS
WHEN
SIGNAL IS Z TYPE‡
SUPPLY AND OSCILLATOR SIGNALS
H1
1
O/Z
External H1 clock. H1 has a period equal to twice CLKIN.
S
H3
1
O/Z
External H3 clock. H3 has a period equal to twice CLKIN.
S
VDD
20
I
5-V supply for ’C31 devices and 3.3-V supply for ’LC31 devices. All must be
connected to a common supply plane.§
VSS
25
I
Ground. All grounds must be connected to a common ground plane.
X1
1
O
Output from the internal-crystal oscillator. If a crystal is not used, X1 should be left
unconnected.
X2 / CLKIN
1
I
Internal-oscillator input from a crystal or a clock
RESERVED¶
EMU2 −EMU0
3
I
Reserved for emulation. Use pullup resistors to VDD
EMU3
1
O/Z
Reserved for emulation
S
† I = input, O = output, Z = high-impedance state
‡ S = SHZ active, H = HOLD active, R = RESET active
§ Recommended decoupling capacitor value is 0.1 µF.
¶ Follow the connections specified for the reserved pins. Use 18 -kΩ −22-kΩ pullup resistors for best results. All VDD supply pins must be connected
to a common supply plane, and all ground pins must be connected to a common ground plane.
8
POST OFFICE BOX 1443
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
functional block diagram
RAM
Block 0
(1K × 32)
Cache
(64 × 32)
32
24
RAM
Block 1
(1K × 32)
32
24
24
32
ÉÉÉÉÉ
ÉÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
Boot
Loader
24
32
PDATA Bus
PADDR Bus
MUX
DDATA Bus
MUX
RDY
HOLD
HOLDA
STRB
R/W
D31− D0
A23 − A0
DADDR1 Bus
DADDR2 Bus
DMADATA Bus
DMAADDR Bus
32
24
24
32
32
24
24
DMA Controller
Serial Port 0
Serial-Port-Control
Register
Global-Control
Register
MUX
X1
X2 / CLKIN
H1
H3
EMU(3 − 0)
DestinationAddress
Register
REG1
TransferCounter
Register
REG2
REG1
CPU1
REG2
32
32
40
40
32-Bit
Barrel
Shifter
Multiplier
40
40
32
Data-Transmit
Register
Data-Receive
Register
Timer 0
Global-Control
Register
ALU
40
Peripheral Address Bus
CPU1
CPU2
Controller
RESET
INT(3 − 0)
IACK
MCBL / MP
XF(1,0)
VDD(19 − 0)
VSS(24 − 0)
Receive/Transmit
(R / X) Timer Register
Source-Address
Register
Peripheral Data Bus
IR
PC
FSX0
DX0
CLKX0
FSR0
DR0
CLKR0
40
ExtendedPrecision
Registers
(R7−R0)
40
40
Timer-Period
Register
TCLK0
Timer-Counter
Register
Timer 1
DISP0, IR0, IR1
Global-Control
Register
ARAU0
BK
ARAU1
Timer-Period
Register
24
24
24
32
32
Auxiliary
Registers
(AR0 − AR7)
TCLK1
Timer-Counter
Register
24
Port Control
32
STRB-Control
Register
32
32
Other
Registers
(12)
POST OFFICE BOX 1443
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• HOUSTON, TEXAS 77251−1443
9
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
memory map†
0h
Reset, Interrupt, Trap Vector, and
Reserved Locations (64)
(External STRB Active)
0h
03Fh
040h
Reserved for Boot-Loader
Operations
FFFh
1000h
External
STRB Active
(8M Words − 64 Words)
400000h
Boot 1
Boot 2
7FFFFFh
800000h
7FFFFFh
800000h
Reserved
(32K Words)
Reserved
(32K Words)
807FFFh
808000h
External
STRB
Active
(8M Words −
4K Words)
Peripheral Bus
Memory-Mapped Registers
(6K Words Internal)
807FFFh
808000h
Peripheral Bus
Memory-Mapped Registers
(6K Words Internal)
8097FFh
809800h
8097FFh
809800h
RAM Block 0
(1K Words Internal)
RAM Block 0
(1K Words Internal)
809BFFh
809C00h
809BFFh
809C00h
RAM Block 1
(1K Words − 63 Words Internal)
RAM Block 1
(1K Words Internal)
809FFFh
80A000h
External
STRB Active
(8M Words − 40K Words)
FFFFFFh
809FC0h
809FC1h
User-Program Interrupt
and Trap Branches
(63 Words Internal)
809FFFh
80A000h
FFF000h
Boot 3
FFFFFFh
(a) Microprocessor Mode
External
STRB Active
(8M Words −
40K Words)
(b) Microcomputer/Boot-Loader Mode
† Figure 1 depicts the memory map for the SMJ320C31. See the TMS320C3x Users Guide (literature number SPRU031) for a detailed description
of this memory mapping.
Figure 1. SMJ320C31 Memory Map
10
POST OFFICE BOX 1443
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
memory map (continued)
00h
Reset
809FC1h
INT0
01h
INT0
809FC2h
INT1
02h
INT1
809FC3h
INT2
03h
INT2
809FC4h
INT3
04h
INT3
809FC5h
05h
XINT0
XINT0
06h
RINT0
809FC6h
RINT0
07h
08h
809FC7h
Reserved
Reserved
809FC8h
09h
TINT0
809FC9h
TINT0
0Ah
TINT1
809FCAh
TINT1
0Bh
DINT
809FCBh
DINT
0Ch
1Fh
Reserved
809FCCh
809FDFh
Reserved
20h
TRAP 0
809FE0h
TRAP 0
3Bh
TRAP 27
809FFBh
TRAP 27
3Ch
3Fh
Reserved
809FFCh
Reserved
809FFFh
(a) Microprocessor Mode
(b) Microcomputer / Boot-Loader Mode
Figure 2. Reset, Interrupt, and Trap Vector/Branches Memory-Map Locations
POST OFFICE BOX 1443
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
memory map (continued)
808000h
DMA Global Control
808004h
DMA Source Address
808006h
DMA Destination Address
808008h
DMA Transfer Counter
808020h
Timer 0 Global Control
808024h
Timer 0 Counter
808028h
Timer 0 Period Register
808030h
Timer 1 Global Control
808034h
Timer 1 Counter
808038h
Timer 1 Period Register
808040h
Serial Global Control
808042h
FSX/DX/CLKX Serial Port Control
808043h
FSR/DR/CLKR Serial Port Control
808044h
Serial R/X Timer Control
808045h
Serial R/X Timer Counter
808046h
Serial R/X Timer Period Register
808048h
Data-Transmit
80804Ch
Data-Receive
808064h
Primary-Bus Control
†Shading denotes reserved address locations
Figure 3. Peripheral Bus Memory-Mapped Registers†
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absolute maximum ratings over specified temperature range (unless otherwise noted)†
’C31
’LC31
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
. . . . . . . . . . −0.3 V to 5 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
. . . . . . . . . . −0.3 V to 5 V
Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
. . . . . . . . . . −0.3 V to 5 V
Continuous power dissipation (worst case) (see Note 2) . . . . . . . . . . . . . . . . . . 1.7 W
(for SMJ320C31-33)
. . . . . . . . . . . . . . 850 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
. . . . . . − −55°C to 125°C
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
. . . . . . . − 65°C to 150°C
Supply voltage, VDD (see Note 1)
Operating case temperature, TC
(for SMJ320LC31-33)
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to VSS.
2. Actual operating power is less. This value was obtained under specially produced worst-case test conditions for the TMS320C31-33
and the TMS320LC31-33, which are not sustained during normal device operation. These conditions consist of continuous parallel
writes of a checkerboard pattern to both primary and extension buses at the maximum rate possible. See normal (ICC) current
specification in the electrical characteristics table and also read Calculation of TMS320C30 Power Dissipation Application Report
(literature number SPRA020).
recommended operating conditions (see Note 3)
’C31
VDD
VSS
VIH
Supply voltage (DVDD, etc.)
MAX
MIN
NOM
MAX
4.75
5
5.25
3.13
3.3
3.47
VDD + 0.3*
VDD + 0.3*
1.8
0
High-level input voltage (except RESET)
2.1
High-level input voltage (RESET)
2.2
Low-level input voltage
IOL
Low-level output current
TC
NOM
Supply voltage (CVSS, etc.)
VIL
IOH
− 0.3*
High-level output current
Operating case temperature
’LC31
MIN
’320C31-40
’320C31-50
’320C31-60
’320LC31-40
−55
−55
−55
0
0.8
2.2
− 0.3*
UNIT
V
V
VDD + 0.3*
VDD + 0.3*
V
V
0.6
V
− 300
− 300
µA
2
2
mA
125
125
105
°C
−55
125
VTH
High-level input voltage for CLKIN
3.0
VDD + 0.3*
2.5
VDD + 0.3*
V
* This parameter is not production tested.
NOTE 3: All voltage values are with respect to VSS. All input and output voltage levels are TTL-compatible. CLKIN can be driven by a CMOS
clock.
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electrical characteristics over recommended ranges of supply voltage (unless otherwise noted)
(see Note 3)†
PARAMETER
TEST CONDITIONS
VOH
VOL
High-level output voltage
IZ
II
IIP
’C31
TYP‡
High-impedance current
− 20
+ 20
Input current
VI = VSS to VDD
− 10
Input current (with internal
pullup)
Inputs with internal pullups§
− 600
Supply current¶#
TA = 25°C,
VDD = MAX
IDD
Supply current
Standby,
Input
capacitance
2.4
MAX
VDD = MIN, IOH = MAX
VDD = MIN, IOH = MAX
VDD = MAX
Low-level output voltage
ICC
Ci
MIN
V
V
− 20
+ 20
µA
+ 10
− 10
+ 10
µA
20
− 600
10
µA
’C31-50
200
425
’C31-60
225
475
Clocks shut off
50
CLKIN
UNIT
0.4
400
All inputs except CLKIN
MAX
2
160
fx = 50 MHz
fx = 60 MHz
’LC31
TYP‡
0.6
’C31-40
’LC31-40
fx = 40 MHz
IDLE2
3
0.3
MIN
150
300
mA
µA
20
15*
15*
25
25
pF
Co
Output capacitance
20*
20*
pF
† All input and output voltage levels are TTL compatible.
‡ For ’C31, all typical values are at VDD = 5 V, TA = 25°C. For ’LC31, all typical values are at VDD = 3.3 V, TA = 25°C.
§ Pins with internal pullup devices: INT3 −INT0, MCBL / MP.
¶ Actual operating current is less than this maximum value. This value was obtained under specially produced worst-case test conditions, which
are not sustained during normal device operation. These conditions consist of continuous parallel writes of a checkerboard pattern to both primary
and expansion buses at the maximum rate possible. See Calculation of TMS320C30 Power Dissipation Application Report (literature number
SPRA020).
# fx is the input clock frequency.
* This parameter is not production tested.
NOTE 3: All voltage values are with respect to VSS. All input and output voltage levels are TTL-compatible. CLKIN can be driven by a CMOS
clock.
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PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
VLoad
CT
Output
Under
Test
IOH
Where:
IOL
IOH
VLOAD
CT
=
=
=
=
2 mA (all outputs)
300 µA (all outputs)
Selected to emulate 50-Ω termination (typical value = 1.54 V).
80-pF typical load-circuit capacitance
Figure 4. SMJ320C31 Test Load Circuit
signal transition levels for ’C31 (see Figure 5 and Figure 6)
TTL-level outputs are driven to a minimum logic-high level of 2.4 V and to a maximum logic-low level of 0.6 V.
Output transition times are specified as follows:
D For a high-to-low transition on a TTL-compatible output signal, the level at which the output is said to be
no longer high is 2 V and the level at which the output is said to be low is 1 V.
D For a low-to-high transition, the level at which the output is said to be no longer low is 1 V and the level at
which the output is said to be high is 2 V.
2.4 V
2V
1V
0.6 V
Figure 5. TTL-Level Outputs
Transition times for TTL-compatible inputs are specified as follows:
D For a high-to-low transition on an input signal, the level at which the input is said to be no longer high is
2.1 V and the level at which the input is said to be low is 0.8 V.
D For a low-to-high transition on an input signal, the level at which the input is said to be no longer low is
0.8 V and the level at which the input is said to be high is 2.1 V.
2.1 V
0.8 V
Figure 6. TTL-Level Inputs
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
VLoad
CT
Output
Under
Test
IOH
Where:
IOL
IOH
VLOAD
CT
=
=
=
=
2 mA (all outputs)
300 µA (all outputs)
2.15 V
80-pF typical load-circuit capacitance
Figure 7. SMJ320LC31 Test Load Circuit
signal transition levels for ’LC31 (see Figure 8 and Figure 9)
Outputs are driven to a minimum logic-high level of 2 V and to a maximum logic-low level of 0.4 V. Output
transition times are specified as follows:
D For a high-to-low transition on an output signal, the level at which the output is said to be no longer high
is 2 V and the level at which the output is said to be low is 1 V.
D For a low-to-high transition, the level at which the output is said to be no longer low is 1 V and the level at
which the output is said to be high is 2 V.
2V
1.8 V
0.6 V
0.4 V
Figure 8. ’LC31 Output Levels
Transition times for inputs are specified as follows:
D For a high-to-low transition on an input signal, the level at which the input is said to be no longer high is
1.8 V and the level at which the input is said to be low is 0.6 V.
D For a low-to-high transition on an input signal, the level at which the input is said to be no longer low is
0.6 V and the level at which the input is said to be high is 1.8 V.
1.8 V
0.6 V
Figure 9. ’LC31 Input Levels
16
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PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols used herein were created in accordance with JEDEC Standard 100-A. In order to
shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows,
unless otherwise noted:
A
A23 −A0
H
ASYNCH
Asynchronous reset signals
HOLD
HOLD
C
CLKX0
HOLDA
HOLDA
CI
CLKIN
IACK
IACK
CLKR
CLKR0
INT
INT3 −INT0
CONTROL
Control signals
RDY
RDY
D
D31 −D0
RW
R/W
DR
DR
RESET
RESET
DX
DX
S
STRB
FS
FSX/R
SCK
CLKX/R
FSX
FSX0
SHZ
SHZ
FSR
FSR0
TCLK
TCLK0, TCLK1, or TCLKx
GPI
General-purpose input
XF
XF0, XF1, or XFx
GPIO
General-purpose input/output; peripheral pin
XFIO
XFx switching from input to output
GPO
General-purpose output
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H1 and H3
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
timing
Timing specifications apply to the SMJ320C31 and SMJ320LC31.
X2/CLKIN, H1, and H3 timing
The following table defines the timing parameters for the X2/CLKIN, H1, and H3 interface signals.
timing parameters for X2/CLKIN, H1, H3 (see Figure 10, Figure 11, Figure 12, and Figure 13)
’C31-40
’LC31-40
NO.
MIN
1
tf(CI)
tw(CIL)
Fall time, CLKIN
Pulse duration, CLKIN low tc(CI) = min
9
tw(CIH)
tr(CI)
Pulse duration, CLKIN high tc(CI) = min
9
tc(CI)
tf(H)
Cycle time, CLKIN
Pulse duration, H1 and H3 low
8
tw(HL)
tw(HH)
9
tr(H)
Rise time, H1 and H3
td(HL-HH)
Delay time. from H1 low to H3 high or from H3 low to H1
high
2
3
4
5
6
7
10
MAX
MIN
5*
Rise time, CLKIN
25
Fall time, H1 and H3
303
MIN
5*
20
4*
303
16.67
3
ns
4*
ns
303
ns
3
ns
P −4†
P −5†
3
ns
ns
6
P −5†
P −6†
3
UNIT
MAX
6
5*
3
ns
ns
3
ns
0
4
0
4
0
4
ns
50
606
40
606
33.3
606
ns
5
4
1
X2/CLKIN
3
2
Figure 10. Timing for X2/CLKIN
POST OFFICE BOX 1443
MAX
7
P−5†
P−6†
Pulse duration, H1 and H3 high
’C31-60
7
5*
11
tc(H)
Cycle time, H1 and H3
† P = tc(CI)
* This parameter is not production tested.
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X2/CLKIN, H1, and H3 timing (continued)
11
9
6
H1
8
7
10
10
H3
9
7
6
8
11
Figure 11. Timing for H1 and H3
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
1
CLKIN to H1/H3 - ns
4.5 V Band
0
−60
5.5 V Band
0
−40
−20
0
20
40
60
80
100
120
140
Temperature
Figure 12. SMJ320C31 CLKIN to H1 / H3 as a Function of Temperature
(Typical)
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X2/CLKIN, H1, and H3 timing (continued)
12
12
10
CLKIN to H1/H3 - ns
10
8
8
6
6
4
4
3.8 V Band
2
2
0
−60
2.5 V Band
0
−40
−20
0
20
40
60
80
100
Temperature
Figure 13. SMJ320LC31 CLKIN to H1 / H3 as a Function of Temperature
(Typical)
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120
140
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
memory read/write timing
The following table defines memory read/write timing parameters for STRB.
timing parameters for memory (STRB = 0) read/write (see Figure 14 and Figure 15)†
’C31-40
’LC31-40
NO.
12
’C31-50
’C31-60
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
td(H1L-SL)
td(H1L-SH)
Delay time, H1 low to STRB low
0*
6
0*
5
0*
5
ns
Delay time, H1 low to STRB high
0*
6
0*
5
0*
5
ns
td(H1H-RWL)R
td(H1L-A)
Delay time, H1 high to R/W low (read)
0*
9
0*
7
0*
6
ns
Delay time, H1 low to A valid
0*
10
0*
10
0*
8
ns
tsu(D-H1L)R
th(H1L-D)R
Setup time, D before H1 low (read)
14
10
9
ns
Hold time, D after H1 low (read)
0
0
0
ns
tsu(RDY-H1H)
th(H1H-RDY)
Setup time, RDY before H1 high
8
6
5
ns
Hold time, RDY after H1 high
0
Delay time, H1 high to R/W high (write)
21
td(H1H-RWH)W
tv(H1L-D)W
22
th(H1H-D)W
Hold time, D after H1 high (write)
td(H1H-A)W
Delay time, H1 high to A valid on back-to-back
write cycles (write)
13
14
15
16
17
18
19
20
23
0
9
Valid time, D after H1 low (write)
17
0
0
7
14
0
15
ns
6
ns
12
ns
0
14
ns
10
ns
24
td(A-RDY)
Delay time, RDY from A valid
7*
6*
6*
† See Figure 16 for address bus timing variation with load capacitance greater than typical load-circuit capacitance (CT = 80 pF).
* This parameter is not production tested.
ns
H3
H1
12
13
STRB
R/W
15
14
A
16
17
24
D
18
19
RDY
NOTE A: STRB remains low during back-to-back read operations.
Figure 14. Timing for Memory (STRB = 0) Read
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
memory read / write timing (continued)
H3
H1
13
12
STRB
20
14
R/W
15
23
A
21
22
D
19
18
RDY
Figure 15. Timing for Memory (STRB = 0) Write
Change in Address-Bus Timing, ns
Address-Bus Timing Variation Load Capacitance
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Change in Load Capacitance, pF
NOTE A: 30 pF/ns slope
Figure 16. Address-Bus Timing Variation With Load Capacitance (see Note A)
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XF0 and XF1 timing when executing LDFI or LDII
The following table defines the timing parameters for XF0 and XF1 during execution of LDFI or LDII.
timing for XF0 and XF1 when executing LDFI or LDII for SMJ320C31 (see Figure 17)
NO.
25
’C31-40
’LC31-40
MIN
MIN
MAX
’C31-50
MIN
’C31-60
MIN
11
UNIT
26
Setup time, XF1 before H1 low
9
10
8
8
ns
27
th(H1L-XF1)
Hold time, XF1 after H1 low
0
0
0
0
ns
Read
12
MAX
Delay time, H3 high to XF0 low
Decode
13
MAX
td(H3H-XF0L)
tsu(XF1-H1L)
Fetch
LDFI or LDII
13
MAX
ns
Execute
H3
H1
STRB
R/W
A
D
RDY
25
XF0 Pin
26
27
XF1 Pin
Figure 17. Timing for XF0 and XF1 When Executing LDFI or LDII
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
XF0 timing when executing STFI and STII†
The following table defines the timing parameters for the XF0 pin during execution of STFI or STII.
timing for XF0 when executing STFI or STII (see Figure 18)
’C31-40
’LC31-40
NO.
MIN
MAX
’C31-50
MIN
MAX
’C31-60
MIN
UNIT
MAX
28 td(H3H-XF0H) Delay time, H3 high to XF0 high
13
12
11
ns
† XF0 is always set high at the beginning of the execute phase of the interlock-store instruction. When no pipeline conflicts occur, the address of
the store is also driven at the beginning of the execute phase of the interlock-store instruction. However, if a pipeline conflict prevents the store
from executing, the address of the store will not be driven until the store can execute.
Fetch
STFI or STII
Decode
Read
Execute
H3
H1
STRB
R/W
A
D
28
RDY
XF0 Pin
Figure 18. Timing for XF0 When Executing an STFI or STII
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XF0 and XF1 timing when executing SIGI
The following table defines the timing parameters for the XF0 and XF1 pins during execution of SIGI.
timing for XF0 and XF1 when executing SIGI for SMJ320C31 (see Figure 19)
NO.
29
30
31
32
’C31-40
’LC31-40
MIN
MIN
MAX
13
MAX
’C31-50
MIN
MAX
UNIT
Delay time, H3 high to XF0 low
tsu(XF1-H1L)
th(H1L-XF1)
Setup time, XF1 before H1 low
9
10
8
8
ns
Hold time, XF1 after H1 low
0
0
0
0
ns
Fetch
SIGI
13
Decode
12
MAX
td(H3H-XF0L)
td(H3H-XF0H)
Delay time, H3 high to XF0 high
13
’C31-60
MIN
13
Read
12
11
ns
11
ns
Execute
H3
H1
29
31
30
XF0
32
XF1
Figure 19. Timing for XF0 and XF1 When Executing SIGI
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
loading when XF is configured as an output
The following table defines the timing parameter for loading the XF register when the XFx pin is configured as
an output.
timing for loading the XF register when configured as an output pin (see Figure 20)
’C31-40
’LC31-40
NO.
MIN
33
tv(H3H-XF)
Valid time, H3 high to XFx
Fetch Load
Instruction
MAX
’C31-50
MIN
13
Decode
Read
’C31-60
MAX
MIN
12
11
Execute
H3
H1
OUTXFx Bit
(see Note A)
1 or 0
33
XFx Pin
NOTE A: OUTXFx represents either bit 2 or 6 of the IOF register.
Figure 20. Timing for Loading XF Register When Configured as an Output Pin
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UNIT
MAX
ns
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
changing XFx from an output to an input
The following table defines the timing parameters for changing the XFx pin from an output pin to an input pin.
timing of XFx changing from output to input mode for SMJ320C31 (see Figure 21)
NO.
34
35
th(H3H-XF)
tsu(XF-H1L)
’C31-40
’LC31-40
MIN
MIN
MAX
Hold time, XFx after H3 high
13*
Setup time, XFx before H1 low
36
th(H1L-XF)
Hold time, XFx after H1 low
* This parameter is not production tested.
Execute
Load of IOF
MAX
’C31-50
MIN
MAX
13*
’C31-60
MIN
12*
MAX
11*
UNIT
ns
9
10
8
8
ns
0
0
0
0
ns
Buffers Go
From Output
to Output
Synchronizer Value on Pin
Seen in IOF
Delay
H3
H1
35
I / OxFx Bit
(see Note A)
36
34
XFx Pin
INXFx Bit
(see Note A)
Output
Data
Sampled
Data
Seen
NOTE A: I / OxFx represents either bit 1 or bit 5 of the IOF register, and INXFx represents either bit 3 or bit 7 of the IOF register.
Figure 21. Timing for Change of XFx From Output to Input Mode
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
changing XFx from an input to an output
The following table defines the timing parameter for changing the XFx pin from an input pin to an output pin.
timing for XFx changing from input to output mode (see Figure 22)
’C31-40
’LC31-40
NO.
MIN
37
td(H3H-XFIO)
Delay time, H3 high to XFx switching from input to output
MAX
’C31-50
MIN
MAX
17
17
’C31-60
MIN
UNIT
MAX
16
ns
Execution of
Load of IOF
H3
H1
I / OxFx
Bit
(see Note A)
37
XFx Pin
NOTE A: I / OxFx represents either bit 1 or bit 5 of the IOF register.
Figure 22. Timing for Change of XFx From Input to Output Mode
reset timing
RESET is an asynchronous input that can be asserted at any time during a clock cycle. If the specified timings
are met, the exact sequence shown in Figure 23 occurs; otherwise, an additional delay of one clock cycle is
possible.
The asynchronous reset signals include XF0/1, CLKX0, DX0, FSX0, CLKR0, DR0, FSR0, and TCLK0/1.
Resetting the device initializes the primary- and expansion-bus control registers to seven software wait states
and therefore results in slow external accesses until these registers are initialized.
HOLD is an asynchronous input and can be asserted during reset.
28
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RESET timing (see Figure 23)
’C31-40
NO.
’LC31-40
’C31-50
’C31-60
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
UNIT
38
tsu(RESET-CIL)
Setup time, RESET before
CLKIN low
10
P†*
10
P†*
10
P†*
7
P†*
ns
39
td(CLKINH-H1H)
Delay time, CLKIN high to
H1 high (see Note 4)
2
14
2
14
2
10
2
10
ns
40
td(CLKINH-H1L)
Delay time, CLKIN high to
H1 low (see Note 4)
2
14
2
14
2
10
2
10
ns
41
tsu(RESETH-H1L)
Setup time, RESET high
before H1 low and after ten
H1 clock cycles
9
42
td(CLKINH-H3L)
Delay time, CLKIN high to
H3 low (see Note 4)
2
14
2
14
2
10
2
10
ns
43
td(CLKINH-H3H)
Delay time, CLKIN high to
H3 high (see Note 4)
2
14
2
14
2
10
2
10
ns
44
tdis(H1H-DZ)
Disable time, H1 high to D
(high impedance)
15*
13*
12*
11*
ns
45
tdis(H3H-AZ)
Disable time, H3 high to A
(high impedance)
9*
9*
8*
7*
ns
46
td(H3H-CONTROLH)
Delay time, H3 high to
control signals high
9*
9*
8*
7*
ns
47
td(H1H-RWH)
Delay time, H1 high to R/W
high
9*
9*
8*
7*
ns
48
td(H1H-IACKH)
Delay time, H1 high to IACK
high
9*
9*
8*
7*
ns
49
tdis(RESETL-ASYNCH)
Disable time, RESET low to
asynchronous reset signals
disabled (high impedance)
21*
21*
17*
14*
ns
9
7
6
ns
† P = tc(CI)
* This parameter is not production tested.
NOTE 4: See Figure 12 and Figure 13 for typical temperature dependence.
POST OFFICE BOX 1443
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29
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
RESET timing (continued)
CLKIN
38
RESET
(see Notes A and B)
39
40
41
H1
42
H3
Ten H1 Clock Cycles
44
D
(see Note C)
43
A
(see Note C)
45
46
Control Signals
(see Note D)
47
SMJ320C31 R/W
(see Note E)
48
IACK
Asynchronous
Reset Signals
(see Note A)
49
NOTES: A. Asynchronous reset signals include XF0 / 1, CLKX0, DX0, FSX0, CLKR0, DR0, FSR0, and TCLK0/1.
B. RESET is an asynchronous input and can be asserted at any point during a clock cycle. If the specified timings are met, the exact
sequence shown occurs; otherwise, an additional delay of one clock cycle is possible.
C. In microprocessor mode, the reset vector is fetched twice, with seven software wait states each time. In microcomputer mode, the
reset vector is fetched twice, with no software wait states.
D. Control signals include STRB.
E. The R/W outputs are placed in a high-impedance state during reset and can be provided with a resistive pullup, nominally
18−22 kΩ, if undesirable spurious writes are caused when these outputs go low.
Figure 23. Timing for RESET
30
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interrupt response timing
The following table defines the timing parameters for the INT signals.
timing for INT3−INT0 response (see Figure 24)
NO.
50
tsu(INT-H1L)
Setup time, INT3−INT0 before H1 low
51
tw(INT)
Pulse duration, interrupt to ensure
only one interrupt
’C31-40
’LC31-40
MIN
MIN
MAX
13
P
MAX
15
2P†*
P
’C31-50
MIN
MAX
’C31-60
MIN
11
2P†*
P
MAX
8
2P†*
P
UNIT
ns
2P†*
ns
† P = tc(H)
* This parameter is not production tested.
The interrupt (INT) pins are asynchronous inputs that can be asserted at any time during a clock cycle. The
SMJ320C3x interrupts are level-sensitive, not edge-sensitive. Interrupts are detected on the falling edge of H1.
Therefore, interrupts must be set up and held to the falling edge of H1 for proper detection. The CPU and DMA
respond to detected interrupts on instruction-fetch boundaries only.
For the processor to recognize only one interrupt on a given input, an interrupt pulse must be set up and held
to:
D A minimum of one H1 falling edge
D No more than two H1 falling edges
The SMJ320C3x can accept an interrupt from the same source every two H1 clock cycles.
If the specified timings are met, the exact sequence shown in Figure 24 occurs; otherwise, an additional delay
of one clock cycle is possible.
POST OFFICE BOX 1443
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31
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
timing parameters for INT3−INT0 response (continued)
Reset or
Interrupt
Vector Read
Fetch First
Instruction of
Service
Routine
H3
H1
50
INT3 −INT0
Pin
51
INT3 −INT0
Flag
ADDR
Vector Address
First Instruction Address
Data
Figure 24. Timing for INT3−INT0 Response
32
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interrupt-acknowledge timing
The IACK output goes active on the first half-cycle (HI rising) of the decode phase of the IACK instruction and
goes inactive at the first half-cycle (HI rising) of the read phase of the IACK instruction.
timing for IACK (see Note 5 and Figure 25)
’C31-40
’LC31-40
NO.
MIN
52
53
td(H1H-IACKL)
td(H1H-IACKH)
’C31-50
MAX
MIN
’C31-60
MAX
MIN
UNIT
MAX
Delay time, H1 high to IACK low
9
7
6
ns
Delay time, H1 high to IACK high
9
7
6
ns
NOTE 5: IACK goes active on the first half-cycle (H1 rising) of the decode phase of the IACK instruction and goes inactive at the first half-cycle
(H1 rising) of the read phase of the IACK instruction. Because of pipeline conflicts, IACK remains low for one cycle even if the decode
phase of the IACK instruction is extended.
Fetch IACK
Instruction
Decode IACK
Instruction
IACK Data
Read
H3
H1
52
53
IACK
ADDR
Data
Figure 25. Timing for IACK
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
serial-port timing for SMJ320C31-40 and SMJ320LC31-40 (see Figure 26 and Figure 27)
’C31-40
’LC31-40
NO.
MIN
54
td(H1H-SCK)
Delay time, H1 high to internal CLKX/R
13
CLKX/R ext
55
tc(SCK)
Cycle time, CLKX/R
56
tw(SCK)
Pulse duration, CLKX/R high/low
57
tr(SCK)
tf(SCK)
Rise time, CLKX/R
CLKX/R int
CLKX/R ext
58
CLKX/R int
tc(H)x2.6
tc(H)x2
tc(H)+10
[tc(SCK)/2]−5
Fall time, CLKX/R
tc(H)x232
[tc(SCK)/2]+5
7
7
CLKX ext
30
CLKX int
17
ns
ns
ns
ns
ns
59
td(C-DX)
Delay time, CLKX to DX valid
60
tsu(DR-CLKRL)
Setup time, DR before CLKR low
61
th(CLKRL-DR)
Hold time, DR from CLKR low
62
td(C-FSX)
Delay time, CLKX to internal FSX high/low
63
tsu(FSR-CLKRL)
Setup time, FSR before CLKR low
64
th(SCKL-FS)
Hold time, FSX/R input from CLKX/R low
65
tsu(FSX-C)
Setup time, external FSX before CLKX
66
td(CH-DX)V
Delay time, CLKX to first DX bit, FSX
precedes CLKX high
67
td(FSX-DX)V
Delay time, FSX to first DX bit, CLKX precedes FSX
30*
ns
td(CH-DXZ)
Delay time, CLKX high to DX high impedance following last data
bit
17*
ns
CLKR ext
9
CLKR int
21
CLKR ext
9
CLKR int
0
68
CLKX int
15
CLKR ext
9
9
CLKX/R ext
9
CLKX/R int
0
CLKX int
−[tc(H)−8]*
[tc(H)−21]*
ns
[tc(SCK)/2]−10*
tc(SCK)/2*
30*
CLKX int
18*
• HOUSTON, TEXAS 77251−1443
ns
ns
CLKX ext
* This parameter is not production tested.
POST OFFICE BOX 1443
ns
27
CLKR int
ns
ns
CLKX ext
CLKX ext
34
UNIT
MAX
ns
ns
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
serial-port timing for SMJ320C31-50 (see Figure 26 and Figure 27)
’C31-50
NO.
54
MIN
td(H1H-SCK)
Delay time, H1 high to internal CLKX/R
MAX
10
CLKX/R ext
tc(H)x2.6
tc(H)x2
UNIT
ns
55
tc(SCK)
Cycle time, CLKX/R
56
tw(SCK)
Pulse duration, CLKX/R high/low
57
tr(SCK)
tf(SCK)
Rise time, CLKX/R
58
59
td(C-DX)
Delay time, CLKX to DX valid
60
tsu(DR-CLKRL)
Setup time, DR before CLKR low
61
th(CLKRL-DR)
Hold time, DR from CLKR low
62
td(C-FSX)
Delay time, CLKX to internal FSX high/low
63
tsu(FSR-CLKRL)
Setup time, FSR before CLKR low
64
th(SCKL-FS)
Hold time, FSX/R input from CLKX/R low
65
tsu(FSX-C)
Setup time, external FSX before CLKX
66
td(CH-DX)V
Delay time, CLKX to first DX bit, FSX
precedes CLKX high
67
td(FSX-DX)V
Delay time, FSX to first DX bit, CLKX precedes FSX
24*
ns
68
td(CH-DXZ)
Delay time, CLKX high to DX high impedance following last
data bit
14*
ns
CLKX/R int
CLKX/R ext
CLKX/R int
tc(H)+10
[tc(SCK)/2]−5
Fall time, CLKX/R
tc(H)x232
[tc(SCK)/2]+5
6
6
CLKX ext
24
CLKX int
16
CLKR ext
9
CLKR int
17
CLKR ext
7
CLKR int
0
22
15
CLKR int
7
CLKX/R ext
7
CLKX/R int
0
CLKX ext
CLKX int
−[tc(H) −8]*
−[tc(H) −21]*
ns
ns
ns
ns
CLKX int
7
ns
ns
CLKX ext
CLKR ext
ns
ns
ns
ns
[tc(SCK)/2] −10*
tc(SCK)/2*
CLKX ext
24*
CLKX int
14*
ns
ns
* This parameter is not production tested.
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
serial-port timing for SMJ320C31-60 (see Figure 26 and Figure 27)
’C31-60
NO.
54
MIN
td(H1H-SCK)
Delay time, H1 high to internal CLKX/R
8
CLKX/R ext
tc(H)x2.6
tc(H)x2
UNIT
ns
55
tc(SCK)
Cycle time, CLKX/R
56
tw(SCK)
Pulse duration, CLKX/R high/low
57
tr(SCK)
tf(SCK)
Rise time, CLKX/R
58
59
td(C-DX)
Delay time, CLKX to DX valid
60
tsu(DR-CLKRL)
Setup time, DR before CLKR low
61
th(CLKRL-DR)
Hold time, DR from CLKR low
62
td(C-FSX)
Delay time, CLKX to internal FSX high/low
63
tsu(FSR-CLKRL)
Setup time, FSR before CLKR low
64
th(SCKL-FS)
Hold time, FSX/R input from CLKX/R low
65
tsu(FSX-C)
Setup time, external FSX before CLKX
66
td(CH-DX)V
Delay time, CLKX to first DX bit, FSX
precedes CLKX high
67
td(FSX-DX)V
Delay time, FSX to first DX bit, CLKX precedes FSX
20*
ns
68
td(CH-DXZ)
Delay time, CLKX high to DX high impedance following last
data bit
12*
ns
CLKX/R int
CLKX/R ext
CLKX/R int
tc(H)+10
[tc(SCK)/2]−5
Fall time, CLKX/R
[tc(SCK)/2]+5
5
CLKX ext
20
CLKX int
15
CLKR ext
8
CLKR int
15
CLKR ext
6
CLKR int
0
20
14
6
CLKR int
6
CLKX/R ext
6
CLKX/R int
0
CLKX int
−[tc(H) −8]*
−[tc(H) −21]*
ns
ns
ns
ns
ns
ns
[tc(SCK)/2] −10*
tc(SCK)/2*
CLKX ext
20*
CLKX int
12*
• HOUSTON, TEXAS 77251−1443
ns
ns
CLKX int
CLKR ext
ns
ns
CLKX ext
* This parameter is not production tested.
POST OFFICE BOX 1443
tc(H)x232
5
CLKX ext
36
MAX
ns
ns
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
data-rate timing modes
Unless otherwise indicated, the data-rate timings shown in Figure 26 and Figure 27 are valid for all serial-port
modes, including handshake. For a functional description of serial-port operation, see subsection 8.2.12 of the
TMS320C3x User’s Guide (literature number SPRU031).
55
54
H1
54
56
56
CLKX/R
58
57
66
61
Bit n-1
DX
68
59
Bit n-2
Bit 0
60
DR
Bit n-1
Bit n-2
FSR
63
62
62
FSX(INT)
64
FSX(EXT)
64
65
NOTES: A. Timing diagrams show operations with CLKXP = CLKRP = FSXP = FSRP = 0.
B. Timing diagrams depend on the length of the serial-port word, where n = 8, 16, 24, or 32 bits, respectively.
Figure 26. Timing for Fixed Data-Rate Mode
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
data-rate timing modes (continued)
CLKX/R
62
FSX(INT)
67
65
FSX(EXT)
59
68
66
Bit n-1
64
DX
Bit n-2
Bit n-3
Bit 0
FSR
63
Bit n-1
DR
Bit n-2
Bit n-3
60
61
NOTES: A. Timing diagrams show operation with CLKXP = CLKRP = FSXP = FSRP = 0.
B. Timing diagrams depend on the length of the serial-port word, where n = 8, 16, 24, or 32 bits, respectively.
C. The timings that are not specified expressly for the variable data-rate mode are the same as those that are specified for the fixed
data-rate mode.
Figure 27. Timing for Variable Data-Rate Mode
38
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HOLD timing
HOLD is an asynchronous input that can be asserted at any time during a clock cycle. If the specified timings
are met, the exact sequence shown in Figure 27 occurs; otherwise, an additional delay of one clock cycle is
possible.
The NOHOLD bit of the primary-bus control register overrides the HOLD signal. When this bit is set, the device
comes out of hold and prevents future hold cycles.
Asserting HOLD prevents the processor from accessing the primary bus. Program execution continues until a
read from or a write to the primary bus is requested. In certain circumstances, the first write is pending, thus
allowing the processor to continue until a second write is encountered.
timing for HOLD/HOLDA (see Figure 28)
NO.
’C31-40
’LC31-40
’C31-50
’C31-60
MIN
MIN
MIN
MIN
69
tsu(HOLD-H1L)
Setup time, HOLD before
H1 low
13
70
tv(H1L-HOLDA)
Valid time, HOLDA after H1
low
0†
71
tw(HOLD)†
tw(HOLDA)
72
Pulse duration, HOLD low
Pulse duration, HOLDA low
MAX
MAX
13
9
2tc(H)
tcH−5*
0*
MAX
10
9
2tc(H)
tcH−5*
0*
MAX
8
7
2tc(H)
tcH−5*
0*
UNIT
ns
6
2tc(H)
tcH−5*
ns
ns
ns
73
td(H1L-SH)H
Delay time, H1 low to STRB
high for a HOLD
74
tdis(H1L-S)
Disable time, H1 low to
STRB to the
high-impedance state
0*
9*
0*
9*
0*
7*
0*
7*
ns
75
ten(H1L-S)
Enable time, H1 low to
STRB enabled (active)
0*
9
0*
9
0*
7
0*
6
ns
76
tdis(H1L-RW)
Disable time, H1 low to R/W
to the high-impedance state
0*
9*
0*
9*
0*
8*
0*
7*
ns
77
ten(H1L-RW)
Enable time, H1 low to R/W
enabled (active)
0*
9
0*
9
0*
7
0*
6
ns
78
tdis(H1L-A)
Disable time, H1 low to
address to the
high-impedance state
0*
9*
0*
10*
0*
8*
0*
7*
ns
79
ten(H1L-A)
Enable time, H1 low to
address enabled (valid)
0*
13
0*
13
0*
10
0*
11?
ns
80
tdis(H1H-D)
Disable time, H1 high to
data to the high-impedance
state
0*
12*
0*
9*
0*
10*
0*
7*
ns
0*
9
0*
9
0*
7
0*
6
ns
† HOLD is an asynchronous input and can be asserted at any point during a clock cycle. If the specified timings are met, the exact sequence shown
in Figure 28 occurs; otherwise, an additional delay of one clock cycle is possible.
* This parameter is not production tested.
POST OFFICE BOX 1443
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
HOLD timing (continued)
H3
H1
69
69
71
HOLD
70
70
72
HOLDA
73
74
75
STRB
76
77
R/W
78
79
A
80
D
Write Data
NOTE A: HOLDA goes low in response to HOLD going low and continues to remain low until one H1 cycle
after HOLD goes back high.
Figure 28. Timing for HOLD/HOLDA
40
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general-purpose I/O timing
Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0 / 1. The contents of the internal
control registers associated with each peripheral define the modes for these pins.
peripheral pin I/O timing
The table, timing parameters for peripheral pin general-purpose I/O, defines peripheral pin general-purpose I/O
timing parameters.
timing requirements for peripheral pin general-purpose I/O (see Note 6 and Figure 29)
’C31-40
’LC31-40
’C31-33
NO.
MIN
81
tsu(GPIO-H1L)
Setup time, general-purpose input
before H1 low
82
th(H1L-GPIO)
Hold time, general-purpose input after
H1 low
83
td(H1H-GPIO)
Delay time, general-purpose output
after H1 high
MAX
MIN
MAX
’C31-50
MIN
’C31-60
MAX
MIN
UNIT
MAX
12
10
9
8
ns
0
0
0
0
ns
15
13
10
8
ns
NOTE 6: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0 / 1. The modes of these pins are defined by the contents
of internal-control registers associated with each peripheral.
H3
H1
82
81
83
83
Peripheral
Pin
(see Note A)
NOTE A: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0/1.
Figure 29. Timing for Peripheral Pin General-Purpose I/O
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
changing the peripheral pin I/O modes
The following tables show the timing parameters for changing the peripheral pin from a general-purpose output
pin to a general-purpose input pin and vice versa.
timing requirements for peripheral pin changing from general-purpose output to input mode
(see Note 6 and Figure 30)
’C31-40
’LC31-40
NO.
MIN
84
85
th(H1H)
tsu(GPIO-H1L)
Hold time, peripheral pin after H1 high
MAX
’C31-50
MIN
13
Setup time, peripheral pin before H1 low
9
’C31-60
MAX
MIN
10
9
UNIT
MAX
8
8
86
ns
ns
th(H1L-GPIO)
Hold time, peripheral pin after H1 low
0
0
0
ns
NOTE 6: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0 / 1. The modes of these pins are defined by the contents
of internal-control registers associated with each peripheral.
Execution
of Store of
PeripheralControl
Register
Buffers Go
From
Output to
Input
Synchronizer Delay
Value on Pin
Seen in
PeripheralControl
Register
H3
H1
85
I/O
Control Bit
86
84
Peripheral
Pin
(see Note A)
Data Bit
Output
Data
Sampled
Data
Seen
NOTE A: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0/1.
Figure 30. Timing for Change of Peripheral Pin From General-Purpose Output to Input Mode
42
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timing for peripheral pin changing from general-purpose input to output mode (see Note 6 and
Figure 31)
’C31-40
’LC31-40
NO.
MIN
87
td(H1H-GPIO)
MAX
Delay time, H1 high to peripheral pin switching from input
to output
’C31-50
MIN
’C31-60
MAX
13
10
MIN
UNIT
MAX
8
ns
NOTE 6: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0 / 1. The modes of these pins are defined by the contents
of internal-control registers associated with each peripheral.
Execution of Store
of PeripheralControl Register
H3
H1
I/O
Control
Bit
87
Peripheral
Pin
(see Note A)
NOTE A: Peripheral pins include CLKX0, CLKR0, DX0, DR0, FSX0, FSR0, and TCLK0/1.
Figure 31. Timing for Change of Peripheral Pin From General-Purpose Input to Output Mode
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SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
timer pin timing
Valid logic-level periods and polarity are specified by the contents of the internal control registers.
The following tables define the timing requirements for the timer pin.
timing for timer pin (see Figure 32 and Note 7)
’C31-40,
’LC31-40
’C31-50
NO.
MIN
88
tsu(TCLK-H1L)
Setup time, TCLK external
before H1 low
89
th(H1L-TCLK)
Hold time, TCLK external after
H1 low
90
td(H1H-TCLK)
Delay time, H1 high to TCLK
internal valid
91
tc(TCLK)
Cycle time, TCLK
92
tw(TCLK)
Pulse duration,
TCLK high/low
’C31-60
UNIT
MAX
MIN
MAX
10
6
ns
0
0
ns
9
tc(H)×2.6
tc(H)×2
TCLK ext
TCLK int
TCLK ext
tc(H)
×232*
tc(H)+10
[tc(TCLK)/2]−5
tc(H)×2.6
tc(H)×2
8
ns
tc(H)×232*
ns
tc(H)+10
[tc(TCLK)/2]−5
ns
[tc(TCLK)/2]+5
[tc(TCLK)/2]+5
NOTE 7: Numbers 88 and 89 are applicable for a synchronous input clock. Timing parameters 91 and 92 are applicable for an asynchronous
input clock.
* This parameter is not production tested.
TCLK int
H3
H1
89
90
88
Peripheral
Pin
(see Note A)
90
92
91
NOTE A: HOLDA goes low in response to HOLD going low and continues to remain low until one H1 cycle
after HOLD goes back high.
Figure 32. Timing for Timer Pin
44
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
SHZ pin timing
The following table defines the timing parameter for the SHZ pin.
timing parameters for SHZ (see Figure 33)
’C31
’LC31
NO.
MIN
93
tdis(SHZ)
Disable time, SHZ low to all O, I/O pins disabled (high impedance)
† P = tc(CI)
* This parameter is not production tested.
0*
UNIT
MAX
2P†*
ns
H3
H1
SHZ
93
All I/O Pins
NOTE A: Enabling SHZ destroys SMJ320C3x register and memory contents.
Assert SHZ = 1 and reset the SMJ320C3x to restore it to a known
condition.
Figure 33. Timing for SHZ
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
45
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
part order information
TECHNOLOGY
POWER
SUPPLY
OPERATING
FREQUENCY
5962-9205803MXA
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 141-pin staggered PGA
DSCC SMD
SMJ320C31GFAM40
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 141-pin staggered PGA
QML
SM320C31GFAM40
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 141-pin staggered PGA
Std
DEVICE
PACKAGE TYPE
PROCESSING
LEVEL
5962-9205803MYA
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 132-pin quad flatpack with
nonconductive tie bar.
SMJ320C31HFGM40
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 132-lead quad flatpack with a
nonconductive tie bar
QML
SM320C31HFGM40
0.6-µm CMOS
5 V ± 5%
40 MHz
Ceramic 132-lead quad flatpack with a
nonconductive tie bar
Std
5962-9205803Q9A
0.72-µm CMOS
5 V ± 5%
40 MHz
C31−40 KGD (known good die)
SMJ320C31KGDM40B
0.72-µm CMOS
5 V ± 5%
40 MHz
C31−40 KGD (known good die)
QML
5962-9205804MXA
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 141-pin staggered PGA
DSCC SMD
SMJ320C31GFAM50
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 141-pin staggered PGA
QML
SM320C31GFAM50
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 141-pin staggered PGA
Std
DSCC SMD
DSCC SMD
DSCC SMD
5962-9205804MYA
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 132-pin quad flatpack with
nonconductive tie bar.
SMJ320C31HFGM50
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 132-lead quad flatpack with
nonconductive tie bar
QML
SM320C31HFGM50
0.6-µm CMOS
5 V ± 5%
50 MHz
Ceramic 132-lead quad flatpack with
nonconductive tie bar
Std
5962-9205805QXA
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 141-pin staggered PGA
DSCC SMD
SMJ320C31GFAS60
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 141-pin staggered PGA
QML
SM320C31GFAS60
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 141-pin staggered PGA
Std
5962-9205805QYA
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 132-pin quad flatpack with
nonconductive tie bar.
DSCC SMD
SMJ320C31HFGS60
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 132-lead quad flatpack with
nonconductive tie bar
QML
SM320C31HFGS60
0.6-µm CMOS
5 V ± 5%
60 MHz
Ceramic 132-lead quad flatpack with
nonconductive tie bar
Std
5962-9760601NXB
0.72-µm CMOS
3.3 V ± 5%
40 MHz
Plastic 132-lead good flatpack
SMQ320LC31PQM40
0.72-µm CMOS
3.3 V ± 5%
40 MHz
Plastic 132-lead good flatpack
5962-9760601Q9A
0.72-µm CMOS
3.3 V ± 5%
40 MHz
LC31−40 KGD (known good die)
DSCC SMD
SMJ320LC31KGDM40B
0.72-µm CMOS
3.3 V ± 5%
40 MHz
LC31−40 KGD (known good die)
QML
46
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
DSCC SMD
QML
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
part order information (continued)
SMJ
PREFIX
SMJ =
SM =
SMQ =
320
(L)
C
31
GFA
M
50
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
60 = 60 MHz
MIL-PRF-38535 (QML)
Standard Processing
Plastic (QML)
TEMPERATURE RANGE
M = − 55°C to 125°C
S = − 55°C to 105°C
L =
0°C to 70°C
DEVICE FAMILY
320 = SMJ320 Family
TECHNOLOGY
L = Low Voltage
(3.3−V option)
PACKAGE TYPE
GFA = 141-Pin Ceramic Staggered Pin Grid
Array Ceramic Package
HFG = 132-Pin Ceramic Quad Flatpack with a
nonconductive tie bar
PQ
= 132-lead Plastic Quad Flatpack
TA
= 132-lead TAB frame with
polyimide encapsulant
TB
= 132-lead TAB frame, bare-die
option
KGD = Known Good Die
TECHNOLOGY
C = CMOS
DEVICE
31 = ’320C31 or ’320LC31
Figure 34. Device Nomenclature
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
47
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
MECHANICAL DATA
GFA (S-CPGA-P141)
CERAMIC PIN GRID ARRAY PACKAGE
1.080 (27,43)
SQ
1.040 (26,42)
0.900 (22,86) TYP
0.100 (2,54) TYP
0.050 (1,27) TYP
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2
1
0.026 (0,66)
0.006 (0,15)
4
3
6
5
8
7
10
9
12
11
16
14
13
15
18
17
19
0.145 (3,68)
0.105 (2,67)
0.034 (0,86) TYP
0.022 (0,56)
0.016 (0,41)
0.140 (3,56)
DIA TYP
0.120 (3,05)
0.048 (1,22) DIA TYP
4 Places
4040133/D 04/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-128
Thermal Resistance Characteristics
PARAMETER
48
°C/W
RθJA
4.3
RθJC
39.0
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
MECHANICAL DATA
HFG (S-CQFP-F132)
CERAMIC QUAD FLATPACK WITH TIE-BAR
0.960 (24,38)
TYP SQ
0.945 (24,00)
0.800 (20,32) TYP SQ
”A”
33
0.225 (5,72)
Tie Bar Width
0.175 (4,45)
1
34
132
1.210 (30,73)
TYP
2.015 (51,18)
1.990 (50,55)
100
2.025 (51,44) MAX
66
67
99
“C”
“B”
0.061 (1,55)
DIA TYP
0.059 (1,50)
132 0.013 (0,33)
0.006 (0,15)
Braze
0.040 (1,02)
0.030 (0,76)
0.025 (0,64)
DETAIL “A”
0.014 (0,36)
0.002 (0,05)
0.010 (0,25)
0.005 (0,12)
0.020 (0,51) MAX
0.116 (2,95) MAX
DETAIL “C”
DETAIL “B”
4040231-8 / F 04/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Ceramic quad flatpack with flat leads brazed to non-conductive tie bar carrier.
This package can be hermetically sealed with a metal lid.
The terminals will be gold plated.
Thermal Resistance Characteristics†
PARAMETER
°C/W
RθJA
44.3
RθJC
2.1
† Falls within MIL-STD-1835 CMGA7-PN and CMGA19-PN and JEDEC MO-067AG and MO-066AG, respectively
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
49
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
PQ (S-PQFP-G***)
PLASTIC QUAD FLATPACK
100 LEAD SHOWN
13
1 100
89
14
88
0.012 (0,30)
0.008 (0,20)
0.006 (0,15) M
”D3” SQ
0.025 (0,635)
0.006 (0,16) NOM
64
38
0.150 (3,81)
0.130 (3,30)
39
63
Gage Plane
”D1” SQ
”D” SQ
0.010 (0,25)
0.020 (0,51) MIN
”D2” SQ
0°−ā 8°
0.046 (1,17)
0.036 (0,91)
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
LEADS ***
100
132
MAX
0.890 (22,61)
1.090 (27,69)
MIN
0.870 (22,10)
1.070 (27,18)
MAX
0.766 (19,46)
0.966 (24,54)
MIN
0.734 (18,64)
0.934 (23,72)
MAX
0.912 (23,16)
1.112 (28,25)
MIN
0.888 (22,56)
1.088 (27,64)
NOM
0.600 (15,24)
0.800 (20,32)
DIM
”D”
”D1”
”D2”
”D3”
4040045 / C 11/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-069
50
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
MECHANICAL DATA
TA (35 OR 70 mm WITH PROTECTIVE FILM)
SMJ320C31 244-PIN TAB FRAME (PG6) SOCKET,
132 OLB/ILB 0,30-mm PITCH
0,31 × 32 = 9,62
0,29
9,58
100
132
99
1
0,31
9,62
× 32 =
0,29
9,58
0,31
9,62
× 32 =
0,29
9,58
Tab Leads Up
Die Face Up
67
33
34
2,25
(4 Places)
NOTES: A.
B.
C.
D.
E.
F.
66
0,31 × 32 = 9,62
0,29
9,58
14,00
(2 Places)
4081548/A 11/95
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
The OLB lead width is 0,120 ± 0,03 mm.
The ILB lead width is 0,0832 ± 0,015 mm.
The tape width is 35 mm.
The TA is encapsulated die with polyimide overcoat.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
51
SGUS026G − APRIL 1998 − REVISED SEPTEMBER 2006
MECHANICAL DATA
TB (35 OR 70 mm WITHOUT PROTECTIVE FILM)
SMJ320C31 244-PIN TAB FRAME (PG6) SOCKET,
132 OLB/ILB 0,30-mm PITCH
0,31 × 32 = 9,62
0,29
9,58
100
132
99
1
0,31
9,62
× 32 =
0,29
9,58
0,31
9,62
× 32 =
0,29
9,58
Tab Leads Up
Die Face Up
67
33
34
2,25
(4 Places)
66
0,31 × 32 = 9,62
0,29
9,58
14,00
(2 Places)
4081549/A 11/95
NOTES: A.
B.
C.
D.
E.
F.
52
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
The OLB lead width is 0,120 ± 0,03 mm.
The ILB lead width is 0,0832 ± 0,015 mm.
The tape width is 35 mm.
The TB is bare die.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9205803MXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205803MXC
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205803MYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MXC
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9205805QXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205805QYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9760601NXB
ACTIVE
BQFP
PQ
132
1
Green (RoHS &
no Sb/Br)
CU NIPDAU
5962-9760601Q9A
OBSOLETE
XCEPT
KGD
0
TBD
Call TI
Call TI
SM320C31GFAM50
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SM320C31GFAS60
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SM320C31HFGM40
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SM320C31HFGM50
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
Level-4-260C-72 HR
SM320C31HFGS60
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAM40
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAM50
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAS60
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGM40
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGM50
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGS60
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2007
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MBQF001A – NOVEMBER 1995
PQ (S-PQFP-G***)
PLASTIC QUAD FLATPACK
100 LEAD SHOWN
13
89
1 100
14
88
0.012 (0,30)
0.008 (0,20)
0.006 (0,15) M
”D3” SQ
0.025 (0,635)
0.006 (0,16) NOM
64
38
0.150 (3,81)
0.130 (3,30)
39
63
Gage Plane
”D1” SQ
”D” SQ
0.010 (0,25)
0.020 (0,51) MIN
”D2” SQ
0°– 8°
0.046 (1,17)
0.036 (0,91)
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
LEADS ***
100
132
MAX
0.890 (22,61)
1.090 (27,69)
MIN
0.870 (22,10)
1.070 (27,18)
MAX
0.766 (19,46)
0.966 (24,54)
MIN
0.734 (18,64)
0.934 (23,72)
MAX
0.912 (23,16)
1.112 (28,25)
MIN
0.888 (22,56)
1.088 (27,64)
NOM
0.600 (15,24)
0.800 (20,32)
DIM
”D”
”D1”
”D2”
”D3”
4040045 / C 11/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-069
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCPG015B – FEBRUARY 1996 – REVISED DECEMBER 2001
GFA (S-CPGA-P141)
CERAMIC PIN GRID ARRAY
1.080 (27,43)
SQ
1.040 (26,42)
0.900 (22,86) TYP
0.100 (2,54) TYP
0.050 (1,27) TYP
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
A1 Corner
C
B
A
1
3
2
0.026 (0,66)
0.006 (0,15)
5
4
0.145 (3,68)
0.105 (2,67)
7
6
9
8
11
10
13
12
15
14
17
16
19
18
Bottom View
0.034 (0,86) TYP
0.022 (0,56)
0.016 (0,41)
0.140 (3,56)
DIA TYP
0.120 (3,05)
0.048 (1,22) DIA TYP
4 Places
4040133/E 11/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Index mark can appear on top or bottom, depending on package vendor.
Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within 0.030 (0,76) diameter
relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Falls within JEDEC MO-128AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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