MP02 XX 280 Series MP02 XX 280 Series Dual Diode Modules Replaces December 1998 version, DS5103-3.0 DS5103-4.0 January 2000 FEATURES KEY PARAMETERS 2000V VRRM IFSM 6000A 280A IF(AV)(per arm) Visol 2500V CIRCUIT OPTIONS ■ Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina (non-toxic) Isolation Medium Code Circuit HB APPLICATIONS ■ Rectifier Bridges ■ DC Power Supplies G ■ Plating Rectifiers ■ Traction Systems GN VOLTAGE RATINGS Type Number PACKAGE OUTLINE Conditions Repetitive Peak Voltages VRRM MP02/280 - 20 2000 Tvj = 150oC MP02/280 - 18 1800 IRM = 30mA MP02/280 - 16 1600 VRSM = VRRM + 100V MP02/280 - 14 1400 Lower voltage grades available. For full description of part number see "Ordering Instructions" on page 3. Module outline type code: MP02. See Package Details for further information. CURRENT RATINGS - PER ARM Parameter Symbol IF(AV) IF(RMS) Mean forward current RMS value Conditions Halfwave, resistive load Tcase = 75oC Max. Units Tcase = 75oC 280 A Tcase = 85oC 252 A Theatsink = 75oC 228 A Theatsink = 85oC 204 A 440 A 1/9 MP02 XX 280 Series SURGE RATINGS - PER ARM Parameter Symbol IFSM 2 It Surge (non-repetitive) on-state current Max. Units VR = 0 6000 A VR = 50% VRRM 4800 A VR = 0 180000 A2s VR = 50% VRRM 115000 A2s Max. Units dc 0.21 o C/W halfwave 0.22 o C/W 3 phase 0.23 o C/W Mounting torque = 6Nm with mounting compound 0.07 o C/W Conditions 10ms half sine; Tj = 150oC 10ms half sine; Tj = 150oC 2 I t for fusing THERMAL & MECHANICAL RATINGS Parameter Symbol Rth(j-c) Rth(c-hs) Thermal resistance - junction to case per Diode Thermal resistance - case to heatsink per Diode Conditions Tvj Virtual junction temperature 150 o Tsto Storage temperature range -40 to 150 o Visol Isolation voltage Commoned terminals to base plate AC RMS, 1min, 50Hz C C 2.5 kV Max. Units CHARACTERISTICS Symbol Conditions VFM Forward voltage At 400A, Tcase = 25oC 1.1 V IRM Peak reverse current At VRRM, Tj = 150oC 30 mA VTO Threshold voltage At Tvj = 150oC 0.80 V On-state slope resistance At Tvj = 150oC 0.6 mΩ rT 2/9 Parameter MP02 XX 280 Series ORDERING INSTRUCTIONS Part number is made up of as follows: MP02 HB 280 - 18 MP 02 HB 280 18 = Pressure contact module = Outline type = Circuit configuration code (see "circuit options" - front page) = Nominal average current rating at Tcase = 75oC = VRRM/100 Examples: MP02HB280 - 16 MP02G280 - 20 MP02GN280 - 18 Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested. MOUNTING RECOMMENDATIONS Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of V(TO) and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32µmin) and a flatness within 0.05mm (0.002") are recommended. Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 6Nm (55lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module. 3/9 MP02 XX 280 Series CURVES Instantaneous forward current IF - (A) 1000 800 600 Tj = 150˚C 400 200 0 0 0.5 1.0 1.5 Instantaneous forward voltage VF - (V) 2.0 Fig. 1 Maximum (limit) forward characteristics (Per diode) Thermal Impedance - (˚C/W) 0.3 RTH(J-HS) 0.2 RTH(J-C) 0.1 0 0.001 0.010 0.100 Time - (s) 1.0 Fig. 2 Transient thermal impedance (DC) - (Per diode) 4/9 10 100 MP02 XX 280 Series 10000 9000 7000 120 6000 110 5000 100 4000 90 3000 80 I2t 2000 70 60 1000 0 I2t value - A2s x 103 Peak half sine wave forward current - (A) 8000 1 10 ms 1 2 3 5 10 50 20 30 50 cycles at 50Hz Duration Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C) 5/9 MP02 XX 280 Series On-state power loss per device - (W) 400 d.c. 180˚ Rectangular 180˚ Sine 120˚ Rectangular 350 300 60˚ Rectangular 250 200 150 100 50 0 0 50 100 300 150 200 250 Mean forward current - (A) 350 400 Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz 140 120 100 d.c. 20 0 0 50 100 150 200 250 Mean forward current - (A) 180˚ Rectangular 40 180˚ Sine 60 120˚ Rectangular 80 60˚ Rectangular Maximum permissible case temperature - (˚C) 160 300 350 400 Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz 6/9 MP02 XX 280 Series 1200 1000 Total power - (W) 0.08 0.04 0.02 Rth(hs-a) ˚C/W R - Load 800 0.10 0.12 600 0.15 0.20 400 0.30 0.40 200 0 L - Load 0 20 60 40 80 100 120 140 0 100 200 300 D.C. output current - (A) Maximum ambient temperature - (˚C) FIG 6 50/60H SINGLE PHASE BRIDGE DC OUTPUT CURRENT POWER 400 Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 1200 Total power - (W) 1000 0.12 0.10 0.08 800 0.04 0.02 Rth(hs-a) ˚C/W R & L - Load 0.15 600 0.20 400 0.30 0.40 200 0 0 20 60 40 80 100 120 140 0 Maximum ambient temperature - (˚C) 100 200 300 D.C. output current - (A) 400 Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 7/9 MP02 XX 280 Series PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 23 23 24 34 12.8 Ø6.5 13 80 1 2 3 30 2x M6 94 Nominal weight: 350g Recommended fixings for mounting: M6 socket head cap screws Recommended mounting torque: 6Nm (55lb.ins) Recommended torque for electrical connections: 5Nm (44lb.ins) Maximum torque for electrical connections: 8Nm (70lb.ins) Module outline type code: MP02 CIRCUIT CONFIGURATIONS 1 2 3 HB 1 2 3 2 3 G 1 GN 8/9 MP02 XX 280 Series http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS5103-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 9/9