OPA2277-DIE www.ti.com SBOS611 – MARCH 2012 HIGH-PRECISION OPERATIONAL AMPLIFIER Check for Samples: OPA2277-DIE FEATURES 1 • • • • • • • • APPLICATIONS Ultra Low Offset Voltage Ultra Low Drift High Open-Loop Gain High Common-Mode Rejection High Power Supply Rejection Low Bias Current Wide Supply Range: ±2V to ±18V Low Quiescent Current • • • • • • • Transducer Amplifier Bridge Amplifier Temperature Measurements Strain Gage Amplifier Precision Integrator Battery Powered Instruments Test Equipment DESCRIPTION The OPA2277 precision op amp replaces the industry standard OP-177. It offers improved noise, wider output voltage swing, and are twice as fast with half the quiescent current. Features include ultra low offset voltage and drift, low bias current, high common-mode rejection, and high power supply rejection. The OPA2277 op amp operates from ±2V to ±18V supplies with excellent performance. Unlike most op amps which are specified at only one supply voltage, the OPA2277 is specified for real-world applications; a single limit applies over the ±5V to ±15V supply range. High performance is maintained as the amplifiers swing to their specified limits. The OPA2277 op amp is easy to use and free from phase inversion and overload problems found in some other op amps. It is stable in unity gain and provides excellent dynamic behavior over a wide range of load conditions. The dual version features completely independent circuitry for lowest crosstalk and freedom from interaction, even when overdriven or overloaded. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE ORDERABLE PART NUMBER PACKAGE QUANTITY OPA2277 TD Bare Die In Waffle Pack (2) OPA2277TDD1 252 OPA2277TDD2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated OPA2277-DIE SBOS611 – MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15 mils. Silicon with backgrind Floating Aluminium Pad (TiW/AlCu (0.5%)) 1100 nm Table 1. Bond Pad Coordinates in Microns (1) (1) DISCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX Out A 1 -1414.78 -787.4 -1313.18 -685.8 Neg Input A 2 -224.79 -876.3 -123.19 -774.7 Pos Input A 3 567.69 -876.3 669.29 -774.7 V- 4 1391.92 -50.8 1493.52 50.8 Pos Input B 5 567.69 774.7 669.29 876.3 Neg Input B 6 -224.79 774.7 -123.19 876.3 V+ 7 -1414.78 685.8 -1313.18 787.4 Out B 8 -1493.52 -52.07 -1391.92 52.07 Substrate is not connected to any pin. 2 Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): OPA2277-DIE PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) OPA2277TDD1 ACTIVE DIESALE TD 0 130 TBD Call TI N / A for Pkg Type OPA2277TDD2 ACTIVE DIESALE TD 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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