EM78P153S
OTP ROM
EM78P153S
8-BIT MICRO-CONTROLLER
Version 1.4
EM78P153S
OTP ROM
Specification Revision History
Version
Content
1.1
Initial version
1.2
Change Initialized Register Values, Internal RC Drift Rate, DC and AC
Electrical Characteristic
05/02/2003
1.3
Change Power on reset content
06/25/2003
1.4
Add the Device Characteristic at section 6.3
12/31/2003
Application Note
AN-001 Q & A on ICE153S
AN-002 The Set-up Timing and Pin Change Wake-up Function Application
AN-003 Internal RC Oscillator Mode
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
1. GENERAL DESCRIPTION
EM78P153S is an 8-bit microprocessor with low-power and high-speed CMOS technology. It is equipped
with a 1024*13-bits Electrical One Time Programmable Read Only Memory (OTP-ROM) within it. It
provides a PROTECTION bit to prevent intrusion of user’s code in the OTP memory as well as 15
OPTION bits to match user’s requirements.
With its OTP-ROM feature, the EM78P153S offers users a convenient way of developing and verifying
their programs. Moreover, user developed code can be easily programmed with the ELAN writer.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
2. FEATURES
• 14-lead packages : EM78P153S
• Operating voltage range : 2.3V~5.5V
• Available in temperature range: 0°C~70°C
• Operating frequency range (base on 2 clocks):
* Crystal mode: DC~20MHz at 5V, DC~8MHz at 3V, DC~4MHz at 2.3V.
* ERC mode: DC~4MHz at 5V, DC~4MHz at 3V, DC~4MHz at 2.3V.
• Low power consumption:
* less then 1.5 mA at 5V/4MHz
* typical of 15 µA, at 3V/32KHz
* typical of 1µA, during the sleep mode
• 1024 × 13 bits on chip ROM
• Built-in calibrated IRC oscillators (8MHz, 4MHz, 1MHz, 455KHz )
• Programmable prescaler of oscillator set-up time
• One security register to prevent the code in the OTP memory from intruding
• One configuration register to match the user’s requirements
• 32× 8 bits on chip registers (SRAM, general purpose register)
• 2 bi-directional I/O ports
• 5 level stacks for subroutine nesting
• 8-bit real time clock/counter (TCC) with selective signal sources and trigger edges, and with overflow interrupt
• Power down mode (SLEEP mode)
• Three available interruptions
* TCC overflow interrupt
* Input-port status changed interrupt (wake up from the sleep mode)
* External interrupt
• Programmable free running watchdog timer
• 7 programmable pull-high I/O pins
• 7 programmable open-drain I/O pins
• 6 programmable pull-down I/O pins
• Two clocks per instruction cycle
• Package type: 14 pins SOP, DIP
* 14 pin DIP 300mil: EM78P153SP
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
* 14 pin SOP 150mil: EM78P153SN
• The transient point of system frequency between HXT and LXT is around 400KHz.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
3. PIN ASSIGNMENTS
1
14
P51
P67
2
13
P52
P66
3
12
P53
Vdd
4
11
Vss
P65/OSCI
5
10
P60//INT
P64/OSCO
6
9
P61
P63//RST
7
8
P62/TCC
EM78P153S
P50
Fig. 1 Pin assignment
Table 1 Pin description
Symbol
Vdd
Pin No. Type
Function
4
- Power supply.
* General purpose I/O pin.
* External clock signal input.
P65/OSCI
5
I/O * Input pin of XT oscillator.
* Pull-high/open-drain
* Wake up from sleep mode when the status of the pin changes.
* General purpose I/O pin.
* External clock signal input.
P64/OSCO
6
I/O * Input pin of XT oscillator.
* Pull-high/open-drain
* Wake up from sleep mode when the status of the pin changes.
* If set as /RESET and remain at logic low, the device will be under reset.
* Wake up from sleep mode when the status of the pin changes.
P63//RESET
7
I * Voltage on /RESET must not exceed Vdd during the normal mode.
* Internal Pull-high is on if defined as /RESET.
* P63 is input pin only
* General purpose I/O pin.
* Pull-high/open-drain/pull-down.
P62/TCC
8
I/O
* Wake up from sleep mode when the status of the pin changes.
* External Timer/Counter input.
* General purpose I/O pin.
* Pull-high/open-drain/pull-down.
P61
9
I/O
* Wake up from sleep mode when the status of the pin changes.
* Schmitt Trigger input during the programming mode
* General purpose I/O pin.
* Pull-high/open-drain/pull-down.
P60//INT
10
I/O
* Wake up from sleep mode when the status of the pin changes.
* Schmitt Trigger input during the programming mode.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
P66, P67
P50~P53
P53
VSS
* External interrupt pin triggered by falling edge.
* General purpose I/O pin.
2, 3
I/O * Pull-high/open-drain.
* Wake up from sleep mode when the status of the pin changes.
* General purpose I/O pin.
1,14~13 I/O
* Pull-down
12
I/O * General purpose I/O pin.
11
- *Ground.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
4. FUNCTION DESCRIPTION
OSCO
OSCI
/RESET
TCC
WDT timer
/INT
Oscillator/Timing
Control
Built-in
OSC
Interrupt
Controller
RAM
R4
R2
ROM
Prescaler
Stack
ALU
Instruction
Register
R3
R1(TCC)
Instruction
Decoder
ACC
DATA & CONTROL BUS
IOC6
R6
P60
P61
P62/TCC
P63//REST
P64/OSCO
P65/OSCI
P66
P67
I/O
PORT 6
IOC5
R6
I/O
PORT 5
P50
P51
P52
P53
Fig. 2 Functional block diagram
4.1 Operational Registers
1. R0 (Indirect Addressing Register)
R0 is not a physically implemented register. Its major function is to be an indirect addressing pointer.
Any instruction using R0 as a pointer, actually accesses data pointed by the RAM Select Register
(R4).
2. R1 (Time Clock /Counter)
• Increased by an external signal edge, which is defined by TE bit (CONT-4) through the TCC pin, or
by the instruction cycle clock.
• Writable and readable as any other registers.
• Defined by resetting PAB (CONT-3).
• The prescaler is assigned to TCC if the PAB bit (CONT-3) is reset.
• The contents of the prescaler counter is cleared only when a value is written to TCC register.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
3. R2 (Program Counter) & Stack
• Depending on the device type, R2 and hardware stack are 10-bit wide. The structure is depicted in
Fig.3.
•1024×13 bits on-chip OTP ROM addresses to the relative programming instruction codes. One
program page is 1024 words long.
• R2 is set as all "0"s when at RESET condition.
• "JMP" instruction allows direct loading of the lower 10 program counter bits. Thus, "JMP" allows PC
to go to any location within a page.
• "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into the stack. Thus,
the subroutine entry address can be located anywhere within a page.
• "RET" ("RETL k", "RETI") instruction loads the program counter with the contents of the top-level
stack.
• "ADD R2,A" allows the contents of ‘A’ to be added to the current PC, and the ninth and tenth bits of
the PC are cleared.
• "MOV R2,A" allows to load an address from the "A" register to the lower 8 bits of the PC, and the
ninth and tenth bits of the PC are cleared.
• Any instruction that is written to R2 (e.g. "ADD R2,A", "MOV R2,A", "BC R2,6",⋅⋅⋅⋅⋅) will cause the
ninth and tenth bits (A8,A9) of the PC to be cleared. Thus, the computed jump is limited to the first
256 locations of a page.
• All instructions are single instruction cycle (fclk/2 or fclk/4), except for the instruction that would
change the contents of R2. This instruction will need one more instruction cycle.
Reset Vector
Interrupt Vector
PC (A9 ~ A0)
000H
008H
User Memory
Space
On-chip Program
Memory
Stack Level 1
Stack Level 2
Stack Level 3
Stack Level 4
Stack Level 5
3FFH
Fig. 3 Program counter organization
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Address
R PAGE registers
IOC PAGE registers
00
R0
Reserve
01
R1
(TCC)
02
R2
(PC)
Reserve
03
R3
(Status)
Reserve
04
R4
(RSR)
Reserve
05
R5
(Port5)
IOC5
(I/O Port Control Register)
06
R6
(Port6)
IOC6
(I/O Port Control Register)
CONT (Control Register)
07
Reserve
Reserve
08
Reserve
Reserve
09
Reserve
Reserve
0A
Reserve
Reserve
0B
Reserve
IOCB (Pull-down Register)
0C
Reserve
IOCC (Open-drain Control)
0D
Reserve
IOCD (Pull-high Control Register)
0E
Reserve
IOCE (WDT Control Register)
0F
RF
(Interrupt Status)
IOCF (Interrupt Mask Register)
10
︰
General Registers
2F
Fig. 4 Data memory configuration
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
4. R3 (Status Register)
7
6
5
4
3
2
1
0
RST
GP1
GP0
T
P
Z
DC
C
• Bit 7 (RST) Bit for reset type.
Set to 1 if wake-up from sleep mode on pin change
Set to 0 if wake up from other reset types
• Bit6 ~ 5 (GP1 ~ 0) General purpose read/write bits.
• Bit 4 (T) Time-out bit.
Set to 1 with the "SLEP" and "WDTC" command, or during power up and reset to 0 by WDT
time-out.
• Bit 3 (P) Power down bit.
Set to 1 during power on or by a "WDTC" command and reset to 0 by a "SLEP" command.
• Bit 2 (Z) Zero flag.
Set to "1" if the result of an arithmetic or logic operation is zero.
• Bit 1 (DC) Auxiliary carry flag
• Bit 0 (C) Carry flag
5. R4 (RAM Select Register)
• Bits 7 ~ 6 are general-purpose read/write bits.
See the configuration of the data memory in Fig. 4.
• Bits 5 ~ 0 are used to select registers (address: 00~06, 0F~2F) in the indirect addressing mode.
6. R5 ~ R6 (Port 5 ~ Port 6)
• R5 and R6 are I/O registers.
• Only the lower 4 bits of R5 are available.
• The upper 4 bits of R5 are fixed to 0.
• P63 is input only.
7. RF (Interrupt Status Register)
7
6
5
4
3
2
1
0
-
-
-
-
-
EXIF
ICIF
TCIF
“1” means interrupt request, and “0” means no interrupt occurs.
• Bits 7 ~ 3 Not used.
• Bit 2 (EXIF) External interrupt flag. Set by falling edge on /INT pin, reset by software.
• Bit 1 (ICIF) Port 6 input status changed interrupt flag. Set when Port 6 input changes, reset by
software.
• Bit 0 (TCIF) TCC overflowing interrupt flag. Set when TCC overflows, reset by software.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
• RF can be cleared by instruction but cannot be set.
• IOCF is the interrupt mask register.
• Note that the result of reading RF is the "logic AND" of RF and IOCF.
8. R10 ~ R2F
• All of these are the 8-bit general-purpose registers.
4.2 Special Purpose Registers
1. A (Accumulator)
• Internal data transfer, or instruction operand holding
• It cannot be addressed.
2. CONT (Control Register)
7
6
5
4
3
2
1
0
-
INT
TS
TE
PAB
PSR2
PSR1
PSR0
• Bit 7 Not used.
• Bit 6 (INT) Interrupt enable flag
0: masked by DISI or hardware interrupt
1: enabled by ENI/RETI instructions
• Bit 5 (TS) TCC signal source
0: internal instruction cycle clock, P62 is a bi-directional I/O pin.
1: transition on TCC pin
• Bit 4 (TE) TCC signal edge
0: increment if the transition from low to high takes place on TCC pin
1: increment if the transition from high to low takes place on TCC pin
• Bit 3 (PAB) Prescaler assignment bit.
0: TCC
1: WDT
• Bit 2 (PSR2) ~ 0 (PSR0) TCC/WDT prescaler bits.
PSR2
PSR1
PSR0
TCC Rate
WDT Rate
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1:2
1:4
1:8
1:16
1:32
1:64
1:128
1:256
1:1
1:2
1:4
1:8
1:16
1:32
1:64
1:128
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
• CONT register is both readable and writable.
3. IOC5 ~ IOC6 (I/O Port Control Register)
• "1" put the relative I/O pin into high impedance, while "0" defines the relative I/O pin as output.
• Only the lower 4 bits of IOC5 are available to be defined.
• IOC5 and IOC6 registers are both readable and writable.
4. IOCB (Pull-down Control Register)
7
6
5
4
3
2
1
0
-
/PD6
/PD5
/PD4
-
/PD2
/PD1
/PD0
• Bit 7 Not used.
0: Enable internal pull-down
1: Disable internal pull-down
• Bit 6 (/PD6) Control bit used to enable the pull-down of P62 pin.
• Bit 5 (/PD5) Control bit is used to enable the pull-down of P61 pin.
• Bit 4 (/PD4) Control bit is used to enable the pull-down of P60 pin.
• Bit 3 Not used
• Bit 2 (/PD2) Control bit is used to enable the pull-down of P52 pin.
• Bit 1 (/PD1) Control bit is used to enable the pull-down of P51 pin.
• Bit 0 (/PD0) Control bit is used to enable the pull-down of P50 pin.
• IOCB Register is both readable and writable.
5. IOCC (Open-drain Control Register)
7
6
5
4
3
2
1
0
OD7
OD6
OD5
OD4
-
OD2
OD1
OD0
• Bit 7 (OD7) Control bit is used to enable the open-drain of P67 pin.
0: Disable open-drain output
1: Enable open-drain output
• Bit 6 (OD6) Control bit is used to enable the open-drain of P66 pin.
• Bit 5 (OD5) Control bit is used to enable the open-drain of P65 pin.
• Bit 4 (OD4) Control bit is used to enable the open-drain of P64 pin.
• Bit 3 Not used.
• Bit 2 (OD2) Control bit is used to enable the open-drain of P62 pin.
• Bit 1 (OD1) Control bit is used to enable the open-drain of P61 pin.
• Bit 0 (OD0) Control bit is used to enable the open-drain of P60 pin.
• IOCC Register is both readable and writable.
6. IOCD (Pull-high Control Register)
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
7
6
5
4
3
2
1
0
/PH7
/PH6
/PH5
/PH4
-
/PH2
/PH1
/PH0
• Bit 7 (/PH7) Control bit is used to enable the pull-high of P67 pin.
0: Enable internal pull-high
1: Disable internal pull-high
• Bit 6 (/PH6) Control bit is used to enable the pull-high of P66 pin.
• Bit 5 (/PH5) Control bit is used to enable the pull-high of P65 pin.
• Bit 4 (/PH4) Control bit is used to enable the pull-high of P64 pin.
• Bit 3
Not used.
• Bit 2 (/PH2) Control bit is used to enable the pull-high of P62 pin.
• Bit 1 (/PH1) Control bit is used to enable the pull-high of P61 pin.
• Bit 0 (/PH0) Control bit used to enable the pull-high of P60 pin.
• IOCD Register is both readable and writable.
7. IOCE (WDT Control Register)
7
6
5
4
3
2
1
0
WDTE
EIS
-
-
-
-
-
-
• Bit 7 (WDTE) Control bit used to enable Watchdog timer.
0: Disable WDT.
1: Enable WDT.
WDTE is both readable and writable.
• Bit 6 (EIS) Control bit is used to define the function of P60(/INT) pin.
0: P60, bi-directional I/O pin.
1: /INT, external interrupt pin. In this case, the I/O control bit of P60 (bit 0 of IOC6) must be set to "1".
When EIS is "0", the path of /INT is masked. When EIS is "1", the status of /INT pin can also be read
by way of reading Port 6 (R6). Refer to Fig. 7.
EIS is both readable and writable.
• Bit 5 ~ 0 Not used.
8. IOCF (Interrupt Mask Register)
7
6
5
4
3
2
1
0
-
-
-
-
-
EXIE
ICIE
TCIE
• Bit 7 ~ 3 Not used.
• Individual interrupt is enabled by setting its associated control bit in the IOCF to "1".
• Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Fig.
9.
• Bit 2 (EXIE) EXIF interrupt enable bit.
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
0: disable EXIF interrupt
1: enable EXIF interrupt
• Bit 1 (ICIE) ICIF interrupt enable bit.
0: disable ICIF interrupt
1: enable ICIF interrupt
• Bit 0 (TCIE) TCIF interrupt enable bit.
0: disable TCIF interrupt
1: enable TCIF interrupt
• IOCF register is both readable and writable.
4.3 TCC/WDT & Prescaler
There is an 8-bit counter available as prescaler for the TCC or WDT. The prescaler is available for the
TCC only or the WDT only at the same time and the PAB bit of the CONT register is used to determine
the prescaler assignment. The PSR0~PSR2 bits determine the ratio. The prescaler is cleared each time
the instruction is written to TCC under TCC mode. The WDT and prescaler, when assigned to WDT
mode, are cleared by the “WDTC” or “SLEP” instructions. Fig. 5 depicts the circuit diagram of
TCC/WDT.
• R1(TCC) is an 8-bit timer/counter. The clock source of TCC can be internal or external clock input
(edge selectable from TCC pin). If TCC signal source is from internal clock, TCC will increase by 1 at
every instruction cycle (without prescaler). Referring to Fig. 5, CLK=Fosc/2 or CLK=Fosc/4, depends
on the CODE Option bit CLK. CLK=Fosc/2 is used if CLK bit is "0", and CLK=Fosc/4 is used if CLK bit
is "1". If TCC signal source is from external clock input, TCC is increased by 1 at every falling edge or
rising edge of TCC pin.
• The watchdog timer is a free running on-chip RC oscillator. The WDT will keep running even when the
oscillator driver has been turned off (i.e. in sleep mode). During normal operation or sleep mode, a
WDT time-out (if enabled) will cause the device to reset. The WDT can be enabled or disabled any
time during normal mode by software programming. Refer to WDTE bit of IOCE register. Without
prescaler, the WDT time-out period is approximately 18 ms1 (default).
4.4 I/O Ports
The I/O registers, both Port 5 and Port 6, are bi-directional tri-state I/O ports. Port 6 can be pulled-high
1
<Note>: Vdd = 5V, set up time period = 16.5ms ± 30%
Vdd = 3V, set up time period = 18ms ± 30%
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
internally by software except P63. In addition, Port 6 can also have open-drain output by software
except P63. Input status changed interrupt (or wake-up) function is available from Port 6. P50 ~ P52 and
P60 ~ P62 pins can be pulled-down by software. Each I/O pin can be defined as "input" or "output" pin
by the I/O control register (IOC5 ~ IOC6) except P63. The I/O registers and I/O control registers are both
readable and writable. The I/O interface circuits for Port 5 and Port 6 are shown in Fig. 6,Fig.7 and fig. 8
respectively.
Data Bus
CLK(Fosc/2 or Fosc/4)
0
1
M
U
X
TCC
Pin
1
TE
0
TS
0
WDT
M
U
X
SYNC
2 cycles
PAB
M
U
X
TCC(R1)
TCC Overflow Interrupt
8-bit Counter
1
PSR0~PSR2
8-to-1 MUX
PAB
0
WDTE
(in IOCE)
1
MUX
PAB
WDT Time Out
Fig. 5 Block diagram of TCC and WDT
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
PCRD
P
R
Q
_
Q
PORT
C
L
Q
P
R
_
Q
C
L
D
CLK
PCWR
IOD
D
CLK
PDWR
PDRD
0
1
M
U
X
*Pull-down is not shown in the figure.
Fig. 6 The circuit of I/O port and I/O control register for Port 5
PCRD
P
Q R D
_ CLK
Q C
L
Q
_
Q
PORT
B it 6 of I O C E
P
R
CLK
C
L
D
Q
_
Q
0
1
P
R D
CLK
C
L
PCW R
IO D
PDW R
M
U
X
PDRD
D
T 10
P
R Q
CLK _
C Q
L
*Pull-high (down), Open-drain are not shown in the figure.
Fig. 7 The circuit of I/O port and I/O control register for P60(/INT)
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
PORT
0
1
Q
_
Q
P
R D
CLK
C
L
PCW R
Q
_
Q
P
D
R
CLK
C
L
PDW R
IOD
M
U
X
TIN
PDRD
P
R
CLK
C
L
D
Q
_
Q
*Pull-high (down), Open-drain are not shown in the figure.
Fig. 8 The circuit of I/O port and I/O control register for P61~P67
ICIE
D
P
R
Q
Interrupt
CLK
C
L
_
Q
ICIF
ENI Instruction
D
P60
P61
P62
P63
P
R
CLK
Q
_
C Q
L
P64
P65
P66
P67
Q
_
Q
P
R
D
CLK
C
L
DISI Instruction
Interrupt
(Wake-up from SLEEP)
/SLEP
Next Instruction
(Wake-up from SLEEP)
Fig. 9 Block diagram of I/O Port 6 with input change interrupt/wake-up
This specification is subject to change without prior notice.
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4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Table 2 Usage of Port 6 input change wake-up/interrupt function
Usage of Port 6 Input Status Change Wake-up/Interrupt
(I) Wake-up from Port 6 Input Status Change
(a) Before SLEEP
1. Disable WDT
2. Read I/O Port 6 (MOV R6,R6)
3. Execute "ENI" or "DISI"
4. Enable interrupt (Set IOCF.1)
5. Execute "SLEP" instruction
(b) After Wake-up
1. IF "ENI" → Interrupt vector (008H)
2. IF "DISI" → Next instruction
(II) Port 6 Input Status Change Interrupt
1. Read I/O Port 6 (MOV R6,R6)
2. Execute "ENI"
3. Enable interrupt (Set IOCF.1)
4. IF Port 6 change (interrupt)
→ Interrupt vector (008H)
4.5 RESET and Wake-up
1. RESET
Input Status Change
(1) Power on reset.
(2) /RESET pin input "low", or
(3) WDT time-out (if enabled).
The device is kept in a RESET condition for a period of approx. 18ms1 (one oscillator start-up timer
period) after the reset is detected. Once the RESET occurs, the following functions are performed.
Refer to Fig10..
• The oscillator is running, or will be started.
• The Program Counter (R2) is set to all "0".
• All I/O port pins are configured as input mode (high-impedance state).
• The Watchdog timer and prescaler are cleared.
• When power is switched on, the upper 3 bits of R3 are cleared.
• The bits of the CONT register are set to all "1" except for the Bit 6 (INT flag).
• The bits of the IOCB register are set to all "1".
• The IOCC register is cleared.
• The bits of the IOCD register are set to all "1".
• Bit 7 of the IOCE register is set to "1", and Bits 4 and 6 are cleared.
• Bits 0~2 of RF and bits 0~2 of IOCF register are cleared.
1
<Note> Vdd = 5V, set up time period = 16.5ms ± 30%
Vdd = 3V, set up time period = 18ms ± 30%
This specification is subject to change without prior notice.
19
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
The sleep (power down) mode is attained by executing the “SLEP” instruction. While entering sleep
mode, WDT (if enabled) is cleared but keeps on running. The controller can be awakened by
(1) External reset input on /RESET pin,
(2) WDT time-out (if enabled), or
(3) Port 6 input status changes (if enabled).
The first two cases will cause the EM78P153S to reset. The T and P flags of R3 can be used to
determine the source of the reset (wake-up). The last case is considered the continuation of program
execution and the global interrupt ("ENI" or "DISI" being executed) decides whether or not the
controller branches to the interrupt vector following wake-up. If ENI is executed before SLEP, the
instruction will begin to execute from the address 008H after wake-up. If DISI is executed before
SLEP, the operation will restart from the instruction right next to SLEP after wake-up.
Only one of the Cases 2 and 3 can be enabled before entering the sleep mode. That is,
[a] if Port 6 input status changed interrupt is enabled before SLEP , WDT must be disabled. by
software. However, the WDT bit in the option register remains enabled. Hence, the EM78P153S can
be awakened only by Case 1 or 3.
[b] if WDT is enabled before SLEP, Port 6 Input Status Change Interrupt must be disabled. Hence, the
EM78P153S can be awakened only by Case 1 or 2. Refer to the section on interrupt.
If Port 6 Input Status Changed Interrupt is used to wake-up the EM78P153S (Case [a] above), the
following instructions must be executed before SLEP:
MOV
CONTW
WDTC
MOV
IOW
MOV
MOV
IOW
ENI (or DISI)
SLEP
A, @xxxx1110b
A, @0xxxxxxxb
RE
R6, R6
A, @00000x1xb
RF
; Select WDT prescaler, prescaler must set over 1:1
; Clear WDT and prescaler
; Disable WDT
; Read Port 6
; Enable Port 6 input change interrupt
; Enable (or disable) global interrupt
; Sleep
NOTE:
1. After waking up from the sleep mode, WDT is automatically enabled. The WDT enabled/disabled
operation after waking up from sleep mode should be appropriately defined in the software
2. To avoid a reset from occurring when the Port 6 Input Status Changed Interrupt enters into
interrupt vector or is used to wake-up the MCU, the WDT prescaler must be set above the 1:1
ratio.
This specification is subject to change without prior notice.
20
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Table 3 The Summary of the Initialized Register Values
Address
Name
N/A
IOC5
N/A
IOC6
0x05
P5
0x06
P6
N/A
CONT
0x00
R0(IAR)
0x01
R1(TCC)
0x02
R2(PC)
0x03
R3(SR)
0x04
R4(RSR)
0x0F
RF(ISR)
0x0B
IOCB
Reset Type
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
Wake-Up from Pin Change
Bit Name
Power-On
/RESET and WDT
This specification is subject to change without prior notice.
Bit 7
X
0
0
0
C67
1
1
P
X
1
P
P
P67
1
P
P
X
1
1
P
U
P
P
0
0
P
0
0
P
RST
0
0
1
GP1
U
P
P
X
0
0
0
X
1
1
21
Bit 6
X
0
0
0
C66
1
1
P
X
1
P
P
P66
1
P
P
INT
0
0
0
U
P
P
0
0
P
0
0
P
GP1
0
0
P
GP0
U
P
P
X
0
0
0
/PD6
1
1
Bit 5
X
0
0
0
C65
1
1
P
X
1
P
P
P65
1
P
P
TS
1
1
P
U
P
P
0
0
P
0
0
P
GP0
0
0
P
U
P
P
X
0
0
0
/PD5
1
1
Bit 4
X
0
0
0
C64
1
1
P
X
1
P
P
P64
1
P
P
TE
1
1
P
U
P
P
0
0
P
0
0
P
T
1
t
t
U
P
P
X
0
0
0
/PD4
1
1
Bit 3
C53
1
1
P
C63
1
1
P
P53
1
P
P
P63
1
P
P
PAB
1
1
P
U
P
P
0
0
P
0
0
N
P
1
t
t
U
P
P
X
0
0
0
/PD3
1
1
Bit 2 Bit 1 Bit 0
C52
C51
C50
1
1
1
1
1
1
P
P
P
C62
C61
C60
1
1
1
1
1
1
P
P
P
P52
P51
P50
1
1
1
P
P
P
P
P
P
P62
P61
P60
1
1
1
P
P
P
P
P
P
PSR2 PSR1 PSR0
1
1
1
1
1
1
P
P
P
U
U
U
P
P
P
P
P
P
0
0
0
0
0
0
P
P
P
0
0
0
0
0
0
P
P
P
Z
DC
C
U
U
U
P
P
P
P
P
P
U
U
U
P
P
P
P
P
P
EXIF ICIF TCIF
0
0
0
0
0
0
P
N
P
/PD2 /PD1 /PD0
1
1
1
1
1
1
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Address
0x0C
0x0D
0x0E
0x0F
0x10~0x2F
Name
Reset Type
Bit 7 Bit 6
Wake-Up from Pin Change
P
P
Bit Name
OD7 OD6
Power-On
0
0
IOCC
/RESET and WDT
0
0
Wake-Up from Pin Change
P
P
Bit Name
/PH7 /PH6
Power-On
1
1
IOCD
/RESET and WDT
1
1
Wake-Up from Pin Change
P
P
Bit Name
WDTE EIS
Power-On
1
0
IOCE
/RESET and WDT
1
0
Wake-Up from Pin Change
1
P
Bit Name
X
X
Power-On
1
1
IOCF
/RESET and WDT
1
1
Wake-Up from Pin Change
1
1
Bit Name
Power-On
U
U
R10~R2F
/RESET and WDT
P
P
Wake-Up from Pin Change
P
P
Bit 5
P
OD5
0
0
P
/PH5
1
1
P
X
1
1
1
X
1
1
1
U
P
P
Bit 4
P
OD4
0
0
P
/PH4
1
1
P
X
1
1
1
X
1
1
1
U
P
P
Bit 3
P
X
0
0
P
X
1
1
P
X
1
1
1
X
1
1
1
U
P
P
Bit 2
P
OD2
0
0
P
/PH2
1
1
P
X
1
1
1
EXIE
0
0
P
U
P
P
Bit 1
P
OD1
0
0
P
/PH1
1
1
P
X
1
1
1
ICIE
0
0
P
U
P
P
Bit 0
P
OD0
0
0
P
/PH0
1
1
P
X
1
1
1
TCIE
0
0
P
U
P
P
X: not used. U: unknown or don’t care. -: not defined P: previous value before reset. t: check Table 4
N: Monitors interrupt operation status; 1 = running; P = not running
2. /RESET Configure
Refer to Fig. 10 When the RESET bit in the OPTION word is programmed to 0, the external /RESET
is enabled. When programmed to 1, the internal /RESET is enabled, tied to the internal Vdd and the
pin is defined as P63.
3. The status of RST, T, and P of STATUS register
A RESET condition is initiated by the following events:
1. A power-on condition,
2. A high-low-high pulse on /RESET pin, and
3. Watchdog timer time-out.
The values of RST, T and P, listed in Table 4 are used to check hoe the processor wakes up.
Table 5 shows the events which may affect the status of RST, T and P.
This specification is subject to change without prior notice.
22
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Table 4 The Values of RST, T and P after RESET
Reset Type
RST
T
P
0
0
0
0
0
1
1
*P
1
0
0
1
1
*P
0
P
0
0
RST
T
P
Power on
0
1
1
WDTC instruction
*P
1
1
WDT time-out
0
0
*P
SLEP instruction
*P
1
0
Wake-Up on pin change during SLEEP mode
1
1
0
Power on
/RESET during Operating mode
/RESET wake-up during SLEEP mode
WDT during Operating mode
WDT wake-up during SLEEP mode
Wake-Up on pin change during SLEEP mode
*P: Previous status before reset
Table 5 The Status of RST, T and P being Affected by Events
Event
*P: Previous value before reset
VDD
D
CLK
Oscillator
Q
CLK
CLR
Power-on
Reset
Voltage
Detector
WDTE
WDT
WDT Timeout
Setup Time
RESET
/RESET
Fig. 10 Block Diagram of Controller Reset
This specification is subject to change without prior notice.
23
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
4.6 Interrupt
The EM78P153S has three falling-edge interrupts as listed below:
(1) TCC overflow interrupt
(2) Port 6 Input Status Change Interrupt
(3) External interrupt [(P60, /INT) pin].
Before the Port 6 Input Status Changed Interrupt is enabled, reading Port 6 (e.g. "MOV R6,R6") is
necessary. Each pin of Port 6 will have this feature if its status changes. Any pin configured as output or
P60 pin configured as /INT, is excluded from this function. The Port 6 Input Status Changed Interrupt
can wake up the EM78P153S from sleep mode if Port 6 is enabled prior to going into the sleep mode by
executing SLEP instruction. When the chip wakes-up, the controller will continue to execute the
program in-line if the global interrupt is disabled. If the global interrupt is enabled, it will branch to the
interrupt vector 008H.
RF is the interrupt status register that records the interrupt requests in the relative flags/bits. IOCF is an
interrupt mask register. The global interrupt is enabled by the ENI instruction and is disabled by the DISI
instruction. When one of the interrupts (enabled) occurs, the next instruction will be fetched from
address 008H. Once in the interrupt service routine, the source of an interrupt can be determined by
polling the flag bits in RF. The interrupt flag bit must be cleared by instructions before leaving the
interrupt service routine before interrupts are enabled to avoid recursive interrupts.
The flag (except ICIF bit) in the Interrupt Status Register (RF) is set regardless of the status of its mask
bit or the execution of ENI. Note that the outcome of RF will be the logic AND of RF and IOCF (refer to
Fig. 11). The RETI instruction ends the interrupt routine and enables the global interrupt ( the execution
of ENI).
When an interrupt is generated by the INT instruction (enabled), the next instruction will be fetched from
address 001H.
This specification is subject to change without prior notice.
24
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
VCC
D
/IRQn
P
R
CLK
RF
C
L
Q
IRQn
INT
_
Q
IRQm
RFRD
ENI/DISI
IOCF
Q
P
R
_
Q
C
L
IOD
D
CLK
IOCFWR
/RESET
IOCFRD
RFWR
Fig. 11 Interrupt input circuit
4.7 Oscillator
1. Oscillator Modes
The EM78P153S can be operated in four different oscillator modes, such as Internal RC oscillator
mode (IRC), External RC oscillator mode(ERC), High XTAL oscillator mode(HXT), and Low XTAL
oscillator mode(LXT). User can select one of them by programming OCS1 and OSC2 in the CODE
Option register. Table 6 depicts how these four modes are defined.
The up-limited operation frequency of crystal/resonator on the different VDDs is listed in Table 7.
Table 6 Oscillator Modes defined by OSC1 and OSC2
Mode
IRC(Internal RC oscillator mode)
ERC(External RC oscillator mode)
HXT(High XTAL oscillator mode)
LXT(Low XTAL oscillator mode)
OSC1
1
1
0
0
OSC2
1
0
1
0
<Note> The transient point of system frequency between HXT and LXY is around 400 KHz.
This specification is subject to change without prior notice.
25
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Table 7 The summary of maximum operating speeds
Conditions
Two cycles with two clocks
VDD
2.3
3.0
5.0
Fxt max.(MHz)
4.0
8.0
20.0
2. Crystal Oscillator/Ceramic Resonators(XTAL)
EM78P153S can be driven by an external clock signal through the OSCI pin as shown in Fig. 12.
OSCI
Ext. Clock
OSCO
EM78P153S
Fig. 12 Circuit for External Clock Input
In most applications, pin OSCI and pin OSCO can be connected with a crystal or ceramic resonator to
generate oscillation. Fig. 13 depicts such circuit. The same thing applies whether it is in the HXT
mode or in the LXT mode. Table 8 provides the recommended values of C1 and C2. Since each
resonator has its own attribute, user should refer to its specification for appropriate values of C1 and
C2. RS, a serial resistor, may be necessary for AT strip cut crystal or low frequency mode
C1
OSCI
EM78P153S
XTAL
OSCO
RS
C2
Fig. 13 Circuit for Crystal/Resonator
Table 8 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonators
This specification is subject to change without prior notice.
26
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Oscillator Type
Frequency Mode
Ceramic Resonators
HXT
LXT
Crystal Oscillator
HXT
Frequency
C1(pF)
C2(pF)
455 kHz
100~150
100~150
2.0 MHz
20~40
20~40
4.0 MHz
10~30
10~30
32.768kHz
25
15
100KHz
25
25
200KHz
25
25
455KHz
20~40
20~150
1.0MHz
15~30
15~30
2.0MHz
15
15
4.0MHz
15
15
<Note> 1. The value of capacitors (C1, C2) is for reference.
3. External RC Oscillator Mode
For some applications that do not need to have its timing to be calculated precisely, the RC oscillator
(Fig. 16) offers a lot of cost savings. Nevertheless, it should be noted that the frequency of the RC
oscillator is influenced by the supply voltage, the values of the resistor (Rext), the capacitor (Cext),
and even the operation temperature. Moreover, the frequency also changes slightly from one chip to
another due to the manufacturing process variation.
In order to maintain a stable system frequency, the values of the Cext should not be less than 20pF,
and that the value of Rext should not be greater than 1 M ohm. If they cannot be kept in this range, the
frequency is easily affected by noise, humidity, and leakage.
The smaller the Rext in the RC oscillator, the faster its frequency will be. On the contrary, for very low
Rext values, for instance, 1 KΩ, the oscillator becomes unstable because the NMOS cannot
discharge the current of the capacitance correctly.
Based on the reasons above, it must be kept in mind that all of the supply voltage, the operation
temperature, the components of the RC oscillator, the package types, the way the PCB is layout, will
affect the system frequency.
This specification is subject to change without prior notice.
27
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Vcc
Rext
OSCI
Cext
EM78P153S
Fig.14 Circuit for External RC Oscillator Mode
Table 9 RC Oscillator Frequencies
Cext
20 pF
100 pF
300 pF
Rext
3.3k
5.1k
10k
100k
3.3k
5.1k
10k
100k
3.3k
5.1k
10k
100k
Average Fosc 5V,25°C
3.92 MHz
2.67 MHz
1.4 MHz
150 KHz
1.4 MHz
940 KHz
476 KHz
50 KHz
595 KHz
400 KHz
200 KHz
20.9 KHz
Average Fosc 3V,25°C
3.63MHz
2.6 MHz
1.4 MHz
156 KHz
1.33 MHz
917 KHz
480 KHz
52 KHz
570 KHz
384 KHz
203 KHz
20 KHz
<Note> 1. Measured on DIP packages.
2. Design reference only
3. The frequency drift is about ±30%
4. Internal RC Oscillator Mode
EM78P153S offer a versatile internal RC mode with default frequency value of 4MHz.Internal RC
oscillator mode still has other frequencies 8MHz, 1MHz, and 455KHz and can be set by OPTION bits,
RCM1 and RCM0. All these four main frequencies can be calibration by programming the OPTION
bits, CAL0~CAL2. Table 10 describes the EM78P153S internal RC drift with the variation of voltage,
temperature, and process.
This specification is subject to change without prior notice.
28
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Table 10 Internal RC Drift Rate (Ta=25°C , VDD=5 V± 5%, VSS=0V)
Drift Rate
Internal RC
Temperature
(0°C~70°C)
± 3%
± 3%
± 3%
± 3%
8MHz
4MHz
1MHz
455kHz
Voltage
(2.3V~5.5V)
± 5%
± 5%
± 5%
± 5%
Process
Total
± 10%
± 5%
± 10%
± 10%
± 18%
± 13%
± 18%
± 18%
4.8 Code Option Register
The EM78P153S has one CODE option word that is not a part of the normal program memory. The
option bits cannot be accessed during normal program execution.
Code Option Register and Customer ID Register arrangement distribution:
Word 0
Bit12~Bit0
Word1
Bit1~Bit0
Word 2
Bit12~Bit0
Code Option Register (Word 0)
WORD 0
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
/RESET
/ENWDT
CLKS
OSC1
OCS0
CS
SUT1
SUT0
TYPE
RCOUT
C2
C1
C0
• Bit 12 (/RESET): Define pin7 as a reset pin.
0: /RESET enable
1: /RESET disable
• Bit 11 (/ENWTD): Watchdog timer enable bit.
0: Enable
1: Disable
<Note> This bit must enable and the WDTE reg. (IOCE reg. bit 6) must disable when port 6 pin
change wake up function is used.
• Bit 10 (CLKS): Instruction period option bit.
0: two oscillator periods.
1: four oscillator periods.
Refer to the section of Instruction Set.
• Bit 9 and Bit 8 ( OSC1 and OSC0 ): Oscillator Modes Selection bits.
Table 11 Oscillator Modes defined by OSC1 and OSC0
Mode
IRC(Internal RC oscillator mode)
ERC(External RC oscillator mode)
HXT(High XTAL oscillator mode)
This specification is subject to change without prior notice.
OSC1
OSC0
1
1
0
1
0
1
29
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
LXT(Low XTAL oscillator mode)
0
0
<Note> : The transient point of system frequency between HXT and LXY is around 400 KHz.
• Bit 7 (CS): Code Security Bit
0: Security On
1: Security Off
• Bit6 and Bit5 ( SUT1 and SUT0 ): Set-Up Time of device bits.
Table 12 Set-Up Time of device Programming
SUT1
SUT0
*Set-Up Time
1
1
0
0
1
0
1
0
18 ms
4.5 ms
288 ms
72 ms
* Theoretical values, for reference only
• Bit 4 (Type): Type selection for EM78P153S
TYPE
Series
0
1
EM78P153S
X
• Bit 3 (RCOUT): A selecting bit of Oscillator output or I/O port.
RCOUT
Pin Function
0
1
P64
OSCO
• Bit 2, Bit 1, and Bit 0 ( C2, C1, C 0 ): Calibrator of internal RC mode Bit 3
C2,C1,C0 must be set to “1” ONLY.
Code Option Register (Word 1)
WORD1
Bit1
RCM1
Bit0
RCM0
Bit 1, and Bit 0 ( RCM1, RCM0): RC mode selection bits
RCM 1
1
1
0
0
RCM 0
1
0
1
0
*Frequency(MHz)
4
8
1
455kHz
Customer ID Register (Word 2)
Bit 12~Bit 0
XXXXXXXXXXXXX
Bit 12~ 0 : Customer’s ID code
This specification is subject to change without prior notice.
30
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
4.9 Power On Considerations
Any microcontroller is not guaranteed to start to operate properly before the power supply stabilizes at
its steady state. Under customer application, when power is OFF, Vdd must drop to below 1.8V and
remains OFF for 10us before power can be switched ON again. This way, the EM78P153S will
reset and work normally. The extra external reset circuit will work well if Vdd can rise at very fast speed
(50 ms or less). However, under most cases where critical applications are involved, extra devices are
required to assist in solving the power-up problems.
4.10 Programmable Oscillator Set-Up Time
The Option word contains SUT0 and SUT1 which can be used to define the oscillator set up time.
Theorically, the range is from 4.5 ms to 72 ms. For most of crystal or ceramic resonators, the lower the
operation frequency is, the longer the Set-up time may be required. Table 12 describes the values of
Oscillator Set-Up Time.
4.11 External Power On Reset Circuit
The circuit shown in Fig 17 implements an external RC to produce the reset pulse. The pulse width (time
constant) should be kept long enough for Vdd to reach minimum operation voltage. This circuit is used
when the power supply has slow rise time. Because the current leakage from the /RESET pin is about
±5µA, it is recommended that R should not be great than 40 K. In this way, the voltage in pin /RESET
will be held below 0.2V. The diode (D) acts as a short circuit at the moment of power down. The
capacitor C, will discharged rapidly and fully. Rl, the current-limited resistor, will prevent high current
discharge or ESD (electrostatic discharge) from flowing to pin /RESET.
Vdd
R
/RESET
D
EM78P153S
Rin
C
Fig. 15 External Power-Up Reset Circuit
4.12 Residue-Voltage Protection
When battery is replaced, device power (Vdd) is taken off but residue-voltage remains. The
This specification is subject to change without prior notice.
31
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
residue-voltage may trips below Vdd minimum, but not to zero. This condition may cause a poor power
on reset. Fig.18 and Fig. 19 show how to build a residue-voltage protection circuit.
Vdd
Vdd
33K
EM78P153S
Q1
10K
/RESET
100K
1N4684
Fig. 16 Circuit 1 for the residue voltage protection
V dd
Vdd
R1
E M78P 153S
Q1
/R E S E T
R2
R3
Fig.17 Circuit 2 for the residue voltage protection
4.13 Instruction Set
Each instruction in the instruction set is a 13-bit word divided into an OP code and one or more
operands. Normally, all instructions are executed within one single instruction cycle (one instruction
consists of 2 oscillator periods), unless the program counter is changed by instruction "MOV R2,A",
This specification is subject to change without prior notice.
32
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
"ADD R2,A", or by instructions of arithmetic or logic operation on R2 (e.g. "SUB R2,A", "BS(C) R2,6",
"CLR R2", ⋅⋅⋅⋅). In this case, the execution takes two instruction cycles.
If for some reasons, the specification of the instruction cycle is not suitable for certain applications, try
modifying the instruction as follows:
(A) Modify one instruction cycle to consist of 4 oscillator periods.
(B) Execute within two instruction cycles the "JMP", "CALL", "RET", "RETL", "RETI" commands, or
the conditional skip ("JBS", "JBC", "JZ", "JZA", "DJZ", "DJZA") which were tested to be true.
The instructions that are written to the program counter, should also take two instruction
cycles.
The Case (A) is selected by the CODE Option bit, called CLKS. One instruction cycle will consist of two
oscillator clocks if CLKS is low, and four oscillator clocks if CLKS is high.
Note that once the 4 oscillator periods within one instruction cycle is selected under Case (A), the
internal clock source to TCC should be CLK=Fosc/4 ,instead of Fosc/ 2 as illustrated in Fig. 5.
In addition, the instruction set has the following features:
(1) Every bit of any register can be set, cleared, or tested directly.
(2) The I/O register can be regarded as general register. That is, the same instruction can operate
on I/O register.
The symbol "R" represents a register designator that specifies which one of the registers (including
operational registers and general purpose registers) is to be utilized by the instruction. "b" represents a
bit field designator that selects the value for the bit which is located in the register "R", and affects the
operation. "k" represents an 8 or 10-bit constant or literal value.
INSTRUCTION BINARY
0 0000 0000 0000
0 0000 0000 0001
0 0000 0000 0010
0 0000 0000 0011
0 0000 0000 0100
0 0000 0000 rrrr
0 0000 0001 0000
0 0000 0001 0001
0 0000 0001 0010
0 0000 0001 0011
0 0000 0001 0100
0 0000 0001 rrrr
0 0000 01rr rrrr
0 0000 1000 0000
0 0000 11rr rrrr
HEX
0000
0001
0002
0003
0004
000r
0010
0011
0012
0013
0014
001r
00rr
0080
00rr
MNEMONIC
NOP
DAA
CONTW
SLEP
WDTC
IOW R
ENI
DISI
RET
RETI
CONTR
IOR R
MOV R,A
CLRA
CLR R
This specification is subject to change without prior notice.
OPERATION
No Operation
Decimal Adjust A
A → CONT
0 → WDT, Stop oscillator
0 → WDT
A → IOCR
Enable Interrupt
Disable Interrupt
[Top of Stack] → PC
[Top of Stack] → PC, Enable Interrupt
CONT → A
IOCR → A
A→R
0→A
0→R
33
STATUS AFFECTED
None
C
None
T,P
T,P
None <Note1>
None
None
None
None
None
None <Note1>
None
Z
Z
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0001
0001
0001
0001
0010
0010
0010
0010
0011
0011
0011
0011
0100
0100
0100
0100
0101
0101
0101
0101
0110
0110
0110
0110
0111
0111
0111
0111
100b
101b
110b
111b
00kk
01kk
1000
1001
1010
1011
1100
1101
1110
1111
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
00rr rrrr
01rr rrrr
10rr rrrr
11rr rrrr
bbrr rrrr
bbrr rrrr
bbrr rrrr
bbrr rrrr
kkkk kkkk
kkkk kkkk
kkkk kkkk
kkkk kkkk
kkkk kkkk
kkkk kkkk
kkkk kkkk
kkkk kkkk
0000 0001
kkkk kkkk
01rr
01rr
01rr
01rr
02rr
02rr
02rr
02rr
03rr
03rr
03rr
03rr
04rr
04rr
04rr
04rr
05rr
05rr
05rr
05rr
06rr
06rr
06rr
06rr
07rr
07rr
07rr
07rr
0xxx
0xxx
0xxx
0xxx
1kkk
1kkk
18kk
19kk
1Akk
1Bkk
1Ckk
1Dkk
1E01
1Fkk
SUB A,R
SUB R,A
DECA R
DEC R
OR A,R
OR R,A
AND A,R
AND R,A
XOR A,R
XOR R,A
ADD A,R
ADD R,A
MOV A,R
MOV R,R
COMA R
COM R
INCA R
INC R
DJZA R
DJZ R
RRCA R
RRC R
RLCA R
RLC R
SWAPA R
SWAP R
JZA R
JZ R
BC R,b
BS R,b
JBC R,b
JBS R,b
CALL k
JMP k
MOV A,k
OR A,k
AND A,k
XOR A,k
RETL k
SUB A,k
INT
ADD A,k
R-A → A
R-A → R
R-1 → A
R-1 → R
A ∨ VR → A
A ∨ VR → R
A&R→A
A&R→R
A⊕R→A
A⊕R→R
A+R→A
A+R→R
R→A
R→R
/R → A
/R → R
R+1 → A
R+1 → R
R-1 → A, skip if zero
R-1 → R, skip if zero
R(n) → A(n-1),R(0) → C, C → A(7)
R(n) → R(n-1),R(0) → C, C → R(7)
R(n) → A(n+1),R(7) → C, C → A(0)
R(n) → R(n+1),R(7) → C, C → R(0)
R(0-3) → A(4-7),R(4-7) → A(0-3)
R(0-3) ↔ R(4-7)
R+1 → A, skip if zero
R+1 → R, skip if zero
0 → R(b)
1 → R(b)
if R(b)=0, skip
if R(b)=1, skip
PC+1 → [SP],(Page, k) → PC
(Page, k) → PC
k→A
A∨k→A
A&k→A
A⊕k→A
k → A,[Top of Stack] → PC
k-A → A
PC+1 → [SP],001H → PC
k+A → A
Z,C,DC
Z,C,DC
Z
Z
Z
Z
Z
Z
Z
Z
Z,C,DC
Z,C,DC
Z
Z
Z
Z
Z
Z
None
None
C
C
C
C
None
None
None
None
None <Note2>
None <Note3>
None
None
None
None
None
Z
Z
Z
None
Z,C,DC
None
Z,C,DC
<Note 1> This instruction is applicable to IOC5~IOC6, IOCB~IOCF only.
<Note 2> This instruction is not recommended for RF operation.
<Note 3> This instruction cannot operate under RF.
This specification is subject to change without prior notice.
34
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
4.14 Timing Diagrams
AC Test Input/Output Waveform
2.4
2.0
0.8
TEST POINTS
2.0
0.8
0.4
AC Testing : Input is driven at 2.4V for logic "1",and 0.4V for logic "0".Timing measurements are
made at 2.0V for logic "1",and 0.8V for logic "0".
RESET Timing (CLK="0")
NOP
Instruction 1
Executed
CLK
/RESET
Tdrh
TCC Input Timing (CLKS="0")
Tins
CLK
TCC
Ttcc
This specification is subject to change without prior notice.
35
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
5. ABSOLUTE MAXIMUNM RATINGS
Items
Rating
Temperature under bias
0°C to 70°C
Storage temperature
-65°C to 150°C
Input voltage
-0.3V to +6.0V
Output voltage
-0.3V to +6.0V
This specification is subject to change without prior notice.
36
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
6. ELECTRICAL CHARACTERISTIC
6.1 DC Electrical Characteristic
( Ta= 0°C ~ 70 °C, VDD= 5.0V±5%, VSS= 0V )
Symbol
Fxt
Fxt
Fxt
ERC
IIL
VIH1
VIL1
VIHT1
VILT1
VIHX1
VILX1
VIH2
VIL2
VIHT2
VILT2
VIHX2
VILX2
Parameter
Condition
Min
XTAL: VDD to 2.3V
Two cycle with two clocks
DC
XTAL: VDD to 3V
Two cycle with two clocks
DC
XTAL: VDD to 5V
Two cycle with two clocks
DC
RC: VDD to 5V
R: 5KΩ, C: 39 pF
F-30%
Input Leakage Current for input pins
VIN = VDD, VSS
Input High Voltage (VDD=5.0V)
Ports 5, 6
2.0
Input Low Voltage (VDD=5.0V)
Ports 5, 6
Input High Threshold Voltage (VDD=5.0V) /RESET, TCC (Schmitt trigger)
2.0
Input Low Threshold Voltage (VDD=5.0V) /RESET, TCC (Schmitt trigger)
Clock Input High Voltage (VDD=5.0V)
OSCI
2.5
Clock Input Low Voltage (VDD=5.0V)
OSCI
Input High Voltage (VDD=3.0V)
Ports 5, 6
1.5
Input Low Voltage (VDD=3.0V)
Ports 5, 6
Input High Threshold Voltage (VDD=3.0V) /RESET, TCC (Schmitt trigger)
1.5
Input Low Threshold Voltage (VDD=3.0V) /RESET, TCC (Schmitt trigger)
Clock Input High Voltage (VDD=3.0V)
OSCI
1.5
Clock Input Low Voltage (VDD=3.0V)
OSCI
Output High Voltage (Ports 5, 6)
VOH1
IOH = -12.0 mA
2.4
(P60~P63, P66~P67 are Schmitt trigger)
Output Low Voltage (P50~P53, P60~P63,
VOL1
P66~P67), (P60~P63, P66~P67 are
IOL = 12.0 mA
Schmitt trigger)
VOL2
Output Low Voltage (P64,P65)
IOL = 16.0 mA
IPH
Pull-high current
Pull-high active, input pin at VSS
-50
IPD
Pull-down current
Pull-down active, input pin at VDD
20
All input and I/O pins at VDD,
ISB1
Power down current
output pin floating, WDT disabled
All input and I/O pins at VDD,
ISB2
Power down current
output pin floating, WDT enabled
/RESET= 'High', Fosc=32KHz
Operating supply current(VDD=3V)
ICC1
(Crystal type,CLKS="0"),
15
at two clocks
output pin floating, WDT disabled
/RESET= 'High', Fosc=32KHz
Operating supply current (VDD=3V)
ICC2
(Crystal type,CLKS="0"),
at two clocks
output pin floating, WDT enabled
/RESET= 'High', Fosc=4MHz
Operating supply current(VDD=5.0V)
ICC3
(Crystal type, CLKS="0"),
At two clocks
output pin floating
/RESET= 'High', Fosc=10MHz
Operating supply current(VDD=5.0V)
ICC4
(Crystal type, CLKS="0"),
at two clocks
output pin floating
Typ
1500
Max
4.0
8.0
20.0
F+30%
±1
0.8
0.8
1.0
0.4
0.4
0.6
Unit
MHz
MHz
MHz
KHz
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
0.4
V
0.4
-240
120
V
µA
µA
1
µA
10
µA
15
30
µA
19
35
µA
2.0
mA
4.0
mA
-100
50
* These parameters are characterizes and tested.
* Data in the Minimum, Typical, Maximum(“Min”,“Typ”,”Max”) column are based on characterization results at
25℃. This data is for design guidance and is tested.
This specification is subject to change without prior notice.
37
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
6.2 AC Electrical Characteristic
(Ta=0°C ~ 70 °C, VDD=5V±5%, VSS=0V)
Symbol
Parameter
Dclk
Input CLK duty cycle
Tins
Instruction cycle time
(CLKS="0")
Ttcc
TCC input period
Tdrh
Device reset hold time
Trst
/RESET pulse width
Twdt1*
Watchdog timer period
Twdt2*
Watchdog timer period
Twdt3*
Watchdog timer period
Twdt4*
Watchdog timer period
Tset
Input pin setup time
Thold
Input pin hold time
Tdelay
Output pin delay time
Conditions
Min
Typ
Max
Unit
45
50
55
%
Crystal type
100
DC
ns
RC type
500
DC
ns
(Tins+20)/N*
Ta = 25°C
TXAL,SUT1,SUT0=1,1
Ta = 25°C
Ta = 25°C
SUT1,SUT0=1,1
Ta = 25°C
SUT1,SUT0=1,0
Ta = 25°C
SUT1,SUT0=0,1
Ta = 25°C
SUT1,SUT0=0,0
17.6-30%
ns
17.6
17.6+30%
2000
ms
ns
17.6-30%
17.6
17.6+30%
ms
4.5-30%
4.5
4.5+30%
ms
288-30%
288
288+30%
ms
72-30%
72
72+30%
ms
0
Cload=20pF
ns
20
ns
50
ns
* Twdt1: The Option word (SUT1,SUT0) is used to define the oscillator Set-Up time. In Crystal mode the WDT
timeout length is the same as set-up time(18ms).
* Twdt2: The Option word (SUT1,SUT0) is used to define the oscillator Set-Up time. In Crystal mode the WDT
timeout length is the same as set-up time(4.5ms).
* Twdt3: The Option word (SUT1,SUT0) is used to define the oscillator Set-Up time. In Crystal mode the WDT
timeout length is the same as set-up time(288ms).
* Twdt4: The Option word (SUT1,SUT0) is used to define the oscillator Set-Up time. In Crystal mode the WDT
timeout length is the same as set-up time(72ms).
* These parameters are characterizes but not tested.
* Data in the Minimum, Typical, Maximum(“Min”,“Typ”,”Max”) column are based on characterization results at
25℃. This data is for design guidance and is not tested.
* N= selected prescaler ratio.
* The duration of watch dog timer is determined by option code (bit6,bit5)
This specification is subject to change without prior notice.
38
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
6.3 Device Characteristic
The graphs provided in the following pages were derived based on a limited number of samples and are shown
here for reference only. The device characteristic illustrated herein are not guaranteed for it accuracy. In some
graphs, the data maybe out of the specified warranted operating range.
Vih/Vil (Input pins with schmitt inverter)
2
Vih max (-40℃ to 85℃)
Vih typ 25℃
Vih Vil (Volt)
1.5
Vih min (-40℃ to 85℃)
1
Vil max (-40℃ to 85℃)
Vil typ 25℃
0.5
Vil min (-40℃ to 85℃)
0
2.5
3
3.5
4
4.5
5
5.5
Vdd (Volt)
Fig. 18 Vih, Vil of P60~P63, P66, P67 vs. VDD
This specification is subject to change without prior notice.
39
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Vth (Input thershold voltage) of I/O pins
2.2
2
1.8
Vth (Volt)
1.6
Max (-40 ℃ to 85 ℃)
T yp 25 ℃
1.4
1.2
Min(-40 ℃ to 85 ℃)
1
0.8
0.6
0.4
2.5
3
3.5
4
4.5
5
5.5
VDD (Volt)
Fig. 19 Vth (Threshold voltage) of P50~P53, P64~P65 vs. VDD
Voh/Ioh (VDD=3V)
Vo h /Io h (VDD=5 V)
-5
-2
-10
-4
Ioh (mA)
0
Ioh (mA)
0
Min 70 ℃
-15
Max 70 ℃
-6
T yp 25 ℃
T yp 25 ℃
-20
-8
Min 0 ℃
Min 0 ℃
-10
-25
0
1
2
3
4
0
5
1
1.5
2
2.5
3
Voh (Volt)
Voh (Volt)
Fig. 20 Port5 and Port6 Voh vs. Ioh, VDD=5V
This specification is subject to change without prior notice.
0.5
Fig. 21 Port5 and Port6 Voh vs. Ioh, VDD=3V
40
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Vol/Iol (VDD=5V)
Vo l/Io l (VDD=3 V)
100
40
Max 0 ℃
Max 0℃
80
Typ 25℃
T yp 25 ℃
30
Min 70 ℃
Iol (mA)
Iol (mA)
Min 70℃
60
20
40
10
20
0
0
0
1
2
3
4
5
0
Vol (Volt)
0.5
1
1.5
2
2.5
3
Vol (Volt)
Fig. 22 Port5, Port6.0~Port6.3 and
Fig. 23 Port5, Port6.0~Port6.3 and
Port6.6~Port6.7 Vol vs. Iol, VDD=5V
Port6.6~Port6.7 Vol vs. Iol, VDD=3V
This specification is subject to change without prior notice.
41
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Vol/Iol (VDD=5V)
Vo l/Io l (VDD=3 V)
120
60
Max 0 ℃
Max 0 ℃
100
50
T yp 25 ℃
T yp 25 ℃
80
40
Iol (mA)
Iol (mA)
Min 70 ℃
60
Min 70 ℃
30
40
20
20
10
0
0
0
1
2
3
4
0
5
1
1.5
2
2.5
3
Vol (Volt)
Vol (Volt)
Fig. 24 Port6.4 and Port6.5 Vol vs. Iol, VDD=5V
This specification is subject to change without prior notice.
0.5
Fig. 25 Port6.4 and Port6.5 Vol vs. Iol, VDD=3V
42
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
WDT Time_ o u t
35
WDT period (mS)
30
Max 70 ℃
25
T yp 25 ℃
20
Min 0 ℃
15
10
2
3
4
5
6
VDD (Volt)
Fig. 26 WDT time out period vs. VDD,
perscaler set to 1:1
This specification is subject to change without prior notice.
43
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
C e xt = 100pF , Typi c a l R C OS C F re que nc y
1.4
R = 3.3K
1.2
Frequency (M Hz)
1
R = 5.1K
0.8
0.6
R = 10K
0.4
0.2
R = 100K
0
2.5
3
3.5
4
VDD (Volt)
4.5
5
5.5
Fig. 27 Typical RC OSC Frequency vs. VDD
(Cext=100pF, Temperature at 25℃)
Fig. 28 Typical RC OSC Frequency vs. Temperature (R and C are ideal components)
This specification is subject to change without prior notice.
44
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
IRC OSC Freq u en cy (VDD=5 V)
9
OSC = 8M Hz
8
Frequency (M Hz)
7
6
5
OSC = 4M Hz
4
3
OSC = 1M Hz
OSC = 455K Hz
2
1
0
0
25
50
70
Temperature (℃)
Fig. 29 Internal RC OSC Frequency vs. Temperature, VDD=5V
IRC OSC Frequency (VDD=3V)
9
OSC = 8M Hz
Frequency (M Hz)
8
7
6
5
OSC = 4M Hz
4
3
OSC = 1M Hz
OSC = 455K Hz
2
1
0
0
25
50
70
Temperature (℃)
Fig. 30 Internal RC OSC Frequency vs. Temperature, VDD=3V
This specification is subject to change without prior notice.
45
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Four conditions exist with the Operating Current ICC1 to ICC4. These conditions are as follows:
ICC1: VDD=3V, Fosc=32K Hz, 2 clocks, WDT disable
ICC2: VDD=3V, Fosc=32K Hz, 2 clocks, WDT enable
ICC3: VDD=5V, Fosc=4M Hz, 2 clocks, WDT enable
ICC4: VDD=5V, Fosc=10M Hz, 2 clocks, WDT enable
Typical ICC1 and ICC2 vs. Temperature
Current (uA)
18
15
T yp ICC2
T yp ICC1
12
9
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 31 Typical operating current (ICC1 and ICC2) vs. Temperature
Maximum ICC1 and ICC2 vs. Temperature
Current (uA)
24
Max ICC2
21
Max ICC1
18
15
0
10
20
30
40
50
60
70
Temperature (℃)
This specification is subject to change without prior notice.
46
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Fig. 32 Maximum operating current (ICC1 and ICC2) vs. Temperature
Typical ICC3 and ICC4 vs. Temperature
4
Current (mA)
3.5
T yp ICC4
3
2.5
2
T yp ICC3
1.5
1
0.5
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 33 Typical operating current (ICC3 and ICC4) vs. Temperature
Maximum ICC3 and ICC4 vs. Temperature
4
Current (mA)
3.5
Max ICC4
3
2.5
2
Max ICC3
1.5
1
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 34 Maximum operating current (ICC3 and ICC4) vs. Temperature
This specification is subject to change without prior notice.
47
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Two conditions exist with the Standby Current ISB1 and ISB2. These conditions are as follows:
ISB1: VDD=5V, WDT disable
ISB2: VDD=5V, WDT enable
Typical ISB1 and ISB2 vs. Temperature
Current (uA)
12
9
T yp ISB2
6
3
T yp ISB1
0
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 35 Typical standby current (ISB1 and ISB2) vs. Temperature
Maximum ISB1 and ISB2 vs. Temperature
15
Current (uA)
12
T yp ISB2
9
6
3
T yp ISB1
0
0
10
20
30
40
50
60
70
Temperature (℃)
Fig. 36 Maximum standby current (ISB1 and ISB2) vs. Temperature
This specification is subject to change without prior notice.
48
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Fig. 37 Operating voltage under temperature range of 0℃ to 70℃
OSC = 4M Hz
OSC = 32K Hz
2.5
70
60
2
I (uA)
I (mA)
50
1.5
Max
1
40
30
Max
20
Min
1.5
2
2.5
3
3.5
Min
10
0.5
4
4.5
5
5.5
0
6
1.5
2.5
V
3.5
4.5
5.5
V (Volt)
Fig. 38 V-I curve in operating mode, operating
Fig. 39 V-I curve in operating mode, operating
frequency is 4M Hz
frequency is 32K Hz
This specification is subject to change without prior notice.
49
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Appendix
Package Types:
OTP MCU
EM78P153NP
EM78P153NN
Package Type
DIP
SOP
This specification is subject to change without prior notice.
Pin Count
14
14
50
Package Size
300 mil
150 mil
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
Package Information
14-Lead Plastic Dual in line (PDIP) — 300 mil
This specification is subject to change without prior notice.
51
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
14-Lead Plastic Small Outline (SOP) — 150 mil
This specification is subject to change without prior notice.
52
4. 1.2004 (V1.4)
EM78P153S
OTP ROM
ELAN (HEADQUARTER) MICROELECTRONICS CORP., LTD.
Address : No. 12, Innovation 1st. Rd. Science-Based Industrial Park, Hsinchu City, Taiwan.
Telephone: 886-3-5639977
Facsimile : 886-3-5639966
ELAN (H.K.) MICROELECTRONICS CORP., LTD.
Address : Rm. 1005B, 10/F, Empire Centre, 68 Mody Road, Tsimshatsui, Kowloon, Hong Kong.
Telephone: 852-27233376
Facsimile : 852-27237780
E-mail : [email protected]
ELAN MICROELECTRONICS SHENZHEN, LTD.
Address : SSMEC Bldg. 3F , Gaoxin S. Ave. 1st , South Area , Shenzhen High-tech Industrial Park., Shenzhen
Telephone: 86-755-26010565
Facsimile : 86-755-26010500
ELAN MICROELECTRONICS SHANGHAI, LTD.
Address : #23 Building No.115 Lane 572 BiBo Road. Zhangjiang, Hi-tech Park, Shanghai
Telephone: 86-21-50803866
Facsimile : 86-21-50804600
Elan Information Technology Group.
Address: 1821 Saratoga Avenue, suite 250, Saratoga, CA 95070, USA
Telephone: 1-408-366-8225
Facsimile : 1-408-366-8220
Elan Microelectronics Corp. (Europe)
Address: Dubendorfstrasse 4, 8051 Zurich, Switzerland
Telephone: 41-43-2994060
Facsimile : 41-43-2994079
Email : [email protected]
Web-Site : www.elan-europe.com
Copyright © 2004 ELAN Microelectronics Corp. All rights reserved.
ELAN owns the intellectual property rights, concepts, ideas, inventions, know-how (whether patentable
or not) related to the Information and Technology (herein after referred as " Information and
Technology") mentioned above, and all its related industrial property rights throughout the world, as now
may exist or to be created in the future. ELAN represents no warranty for the use of the specifications
described, either expressed or implied, including, but not limited, to the implied warranties of
merchantability and fitness for particular purposes. The entire risk as to the quality and performance of
the application is with the user. In no even shall ELAN be liable for any loss or damage to revenues,
profits or goodwill or other special, incidental, indirect and consequential damages of any kind, resulting
from the performance or failure to perform, including without limitation any interruption of business,
whatever resulting from breach of contract or breach of warranty, even if ELAN has been advised of the
possibility of such damages.
The specifications of the Product and its applied technology will be updated or changed time by time. All
the information and explanations of the Products in this website is only for your reference. The actual
specifications and applied technology will be based on each confirmed order.
ELAN reserves the right to modify the information without prior notification. The most up-to-day
information is available on the website http://www.emc.com.tw.
This specification is subject to change without prior notice.
53
4. 1.2004 (V1.4)