[ /Title (CD74 HC175 , CD74 HCT17 5) /Subject (High Speed CMOS Logic Quad DType Flip- CD74HC175, CD74HCT175 Data sheet acquired from Harris Semiconductor SCHS160 High Speed CMOS Logic Quad D-Type Flip-Flop with Reset August 1997 Features Description • Common Clock and Asynchronous Reset on Four D-Type Flip-Flops The Harris CD74HC175 and CD74HCT175 are high speed Quad D-type Flip-Flops with individual D-inputs and Q, Q complementary outputs. The devices are fabricated using silicon gate CMOS technology. They have the low power consumption advantage of standard CMOS ICs and the ability to drive 10 LSTTL devices. • Positive Edge Pulse Triggering • Complementary Outputs • Buffered Inputs • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Information at the D input is transferred to the Q, Q outputs on the positive going edge of the clock pulse. All four Flip-Flops are controlled by a common clock (CP) and a common reset (MR). Resetting is accomplished by a low voltage level independent of the clock. All four Q outputs are reset to a logic 0 and all four Q outputs to a logic 1. • Wide Operating Temperature Range . . . -55oC to 125oC Ordering Information • Typical fMAX = 50MHz at VCC = 5V, CL = 15pF, TA = 25oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs PART NUMBER • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PKG. NO. PACKAGE CD74HC175E -55 to 125 16 Ld PDIP E16.3 CD74HCT175E -55 to 125 16 Ld PDIP E16.3 CD74HC175M -55 to 125 16 Ld SOIC M16.15 CD74HCT175M -55 to 125 16 Ld SOIC M16.15 CD74HCT175W -55 to 125 Wafer NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. Pinout CD74HC175, CD74HCT175 (PDIP, SOIC) TOP VIEW MR 1 16 VCC Q0 2 15 Q3 Q0 3 14 Q3 D0 4 13 D3 D1 5 12 D2 Q1 6 11 Q2 Q1 7 10 Q2 GND 8 9 CP CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation 1997 1 File Number 1474.1 CD74HC175, CD74HCT175 Functional Diagram 4 D0 2 D Q 9 CP CP 1 MR Q R 5 D1 Q CP Q1 6 Q R 12 Q1 10 D Q CP Q2 11 Q R 13 D3 Q0 7 D D2 Q0 3 Q2 15 D Q CP Q3 14 Q R Q3 TRUTH TABLE INPUTS OUTPUTS RESET (MR) CLOCK CP DATA Dn Qn Qn L X X L H H ↑ H H L H ↑ L L H H L X Q0 Q0 NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level, Q0 = Level Before the Indicated Steady-State Input Conditions Were Established. Logic Diagram 4 (5, 12, 13) Dn D CL CL p p n n CL CL 3( 6, 11, 14) Qn CL CL p p n n CL CL R ONE OF FOUR F/F CL CL 2( 7, 10, 15) Qn CP 1 MR TO OTHER THREE F/F 8 16 9 CP TO OTHER THREE F/F GND 2 VCC CD74HC175, CD74HCT175 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 3) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θJA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO +85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD74HC175, CD74HCT175 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC IO (mA) VCC (V) -40oC TO +85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTES: 4. For dual-supply systems theorectical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. 5. Die for this part number is available which meets all electrical specifications. HCT Input Loading Table INPUT UNIT LOADS MR 1 CP 0.60 D 0.15 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g. 360µA max at 25oC. Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tw - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns HC TYPES Clock Pulse Width MR Pulse Width tw - 4 CD74HC175, CD74HCT175 Prerequisite For Switching Specifications PARAMETER Setup Time, Data to Clock -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tSU - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns 2 6 - - 5 - 4 - MHz 4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz tH - tREM Clock Frequency 25oC TEST CONDITIONS Hold Time, Data to Clock Removal Time, MR to Clock (Continued) - fMAX - HCT TYPES Clock Pulse Width tw - 4.5 20 - - 25 - 30 - ns MR Pulse Width tw - 4.5 20 - - 25 - 30 - ns Setup Time Data to Clock tSU - 4.5 20 - - 25 - 30 - ns Hold Time Data to Clock tH - 4.5 5 - - 5 - 5 - ns Removal Time MR to Clock tREM - 4.5 5 - - 5 - 5 - ns Clock Frequency fMAX - 4.5 25 - - 20 - 16 - MHz Switching Specifications PARAMETER Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 175 220 265 ns 4.5 - 35 44 53 ns 6 - 30 37 45 ns CL = 15pF 5 14 - - - ns CL = 50pF 2 - 175 220 265 ns 4.5 - 35 44 53 ns 6 - 30 37 45 ns CL = 15pF 5 14 - - - ns CL = 50pF 2 - 75 95 110 ns 4.5 - 15 19 22 ns 6 - 13 16 19 ns HC TYPES Propagation Delay, Clock to Q or Q Propagation Delay, MR to Q or Q Output Transition Times tPLH, tPHL tTLH, tTHL Input Capacitance CIN - - - 10 10 10 pF Power Dissipation Capacitance (Notes 6, 7) CPD - 5 65 - - - pF 5 CD74HC175, CD74HCT175 Switching Specifications Input tr, tf = 6ns (Continued) SYMBOL TEST CONDITIONS Propagation Delay, Clock to Q or Q tPLH, tPHL Propagation Delay, MR to Q or Q tPLH, tPHL Output Transition Times tTLH, tTHL PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS CL = 50pF 4.5 - 33 41 50 ns CL = 15pF 5 13 - - - ns CL = 50pF 4.5 - 35 44 53 ns CL = 15pF 5 17 - - - ns CL = 50pF 4.5 - 15 19 22 ns HCT TYPES Input Capacitance CIN - - - 10 10 10 pF Power Dissipation Capacitance (Notes 6, 7) CPD - 5 67 - - - pF NOTES: 6. CPD is used to determine the dynamic power consumption, per flip-flop. 7. PD = VCC2 fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms CLOCK INPUT trCL tfCL trCL VCC 90% GND tH(H) GND tH(H) VCC DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 1. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET 1.3V 0.3V tH(L) DATA INPUT 3V 2.7V CLOCK INPUT 50% 10% tfCL CL 50pF FIGURE 2. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 6 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated