EVERLIGHT IR11-21C

Technical Data Sheet
1206 Package Chip Infrared LED With Inner Lens
IR11-21C
Features
․Small double-end package
․High reliability
․Low forward voltage
․Good spectral matching
to Si photodetector
․Pb free
Descriptions
IR11-21C is an infrared emitting diode in miniature
SMD package which is molded in a water clear plastic
With flat top view lens.
The device is spectrally matched with silicon photodiode
and phototransistor.
Applications
․PCB mounted infrared sensor
․Infrared emitting for miniature light barrier
․Floppy disk drive
․Optoelectronic switch
․Smoke detector
Device Selection Guide
LED Part No.
IR
Chip
Material
GaAlAs
Lens Color
Water Clear
Everlight Electronics Co., Ltd.
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Rev 2.2
Page: 1 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
IR11-21C
Package Dimensions
Notes: 1.All dimensions are in millimeters
2.Tolerances unless dimensions ±0.1mm
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Continuous Forward Current
IF
65
Units
mA
Peak Forward Current
IFP
1.0
A
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +85
℃
Soldering Temperature
Tsol
260
℃
Power Dissipation at(or below)
25℃Free Air Temperature
Pd
130
mW
Notes: *1:IFP Conditions--Pulse Width≦100μs and Duty≦1%.
*2:Soldering time≦5 seconds.
Everlight Electronics Co., Ltd.
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Rev 2.2
Page: 2 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
IR11-21C
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Ee
Radiant Intensity
Condition
IF=20mA
Min.
Typ.
Max.
0.5
1.6
--
IF=100mA
--
9.0
---
nm
nm
Pulse Width≦100μs ,Duty≦1%
Peak Wavelength
λp
IF=20mA
--
Spectral Bandwidth
Δλ
IF=20mA
IF=20mA
--
940
45
--
1.2
-1.5
IF=100mA
--
1.4
1.8
VR=5V
--
--
10
IF=20mA
--
100
--
Forward Voltage
VF
Pulse Width≦100μs ,Duty≦1%
Reverse Current
View Angle
IR
2θ1/2
Everlight Electronics Co., Ltd.
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Rev 2.2
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
Units
mW /sr
V
μA
deg
Page: 3 of 9
IR11-21C
Typical Electro-Optical Characteristics Curves
Fig.1 Forward Current vs.
Ambient Temperature
Fig.2 Spectral Distribution
140
100
IF=20mA
Ta=25° C
120
80
100
80
60
60
40
40
20
20
0
-25
Fig.3
0
20
40
60
80
100
Peak Emission Wavelength
0
Fig.4
Ambient Temperature
Forward Current
vs. Forward Voltage
4
10
980
960
3
10
940
2
10
920
900
-25
0
25
50
75
100
1
10
0
1
2
3
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Rev 2.2
Page: 4 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
4
IR11-21C
Typical Electro-Optical Characteristics Curves
Fig.5 Relative Intensity vs.
Fig.6 Relative Radiant Intensity vs.
Forward Current
Angular Displacement
-20
Ie-Radiant Intensity(mW/sr)
100
-10
0
10
20
30
10
1
0
10
0
10
1
2
10
10
3
1.0
40
0.9
50
0.8
0.7
60
10 4
70
80
0.6 0.4 0.2
0
0.2 0.4 0.6
IF-Forward Current (mA)
Fig.8 Forward Voltage vs.
Fig.7 Relative Intensity vs.
Ambient Temperature(°C)
Ambient Temperature(°C)
1.8
1.3
IF=20mA
1.6
1.2
1.4
1.1
1.2
1
25
50
75
100
120
IF=20mA
25
50
75
100
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 2.2
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
120
Page: 5 of 9
IR11-21C
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 The LEDs should be used within a year.
2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.
2.5 The LEDs should be used within 168 hours (7 days) after opening the package.
2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
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Rev 2.2
Page: 6 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
IR11-21C
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 280℃ for 3
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal. Be careful because the damage of the product is often
started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is
unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed
beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
Everlight Electronics Co., Ltd.
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Rev 2.2
Page: 7 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
IR11-21C
Reliability Test Item And Condition
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
NO. Item
Test Conditions
Test Hours/ Sample
Cycles
Sizes
1 REFLOW Soldering TEMP.:260℃±5℃ 6Mins
5secs
15mins 50Cycles
2 Temperature Cycle H : +100℃
5mins
L : -40℃
15mins
3 Thermal Shock
H :+100℃
4 High Temperature
Storage
TEMP.:+100℃
5 Low Temperature
Storage
TEMP.:-40℃
6 DC Operating Life IF=20mA
7 High Temperature/ 85℃ / 85% R.H
Ac/Re
22pcs
0/1
22pcs
IR≧U×2
Ee≦L×0.8
VF≧U×1.2
0/1
22pcs
U:Upper
0/1
22pcs
Specification
Limit
L:Lower
0/1
1000hrs
22pcs
Specification
Limit
0/1
1000hrs
22pcs
0/1
1000hrs
22pcs
0/1
5mins 50Cycles
10secs
5mins
L :-10℃
Failure
Judgement
Criteria
1000hrs
High Humidity
Everlight Electronics Co., Ltd.
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Rev 2.2
Page: 8 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai
IR11-21C
Packing Quantity Specification
1.1000PCS/1Bag,20Bags/1Box
2.10Boxes/1Carton
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks
HUE: Peak Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
IR11-21C
Notes
1. Above specification may be changed without notice. EVERLIGHT will reserve authority on
material change for above specification.
2. When using this product, please observe the absolute maximum ratings and the instructions
for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for
any damage resulting from use of the product which does not comply with the absolute
maximum ratings and the instructions included in these specification sheets.
3. These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http:\\www.everlight.com
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 2.2
Page: 9 of 9
Device No:DIR-011-062
Prepared date:07-22-2004
Prepared by:Jaine Tsai